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21. 发明专利

JP2010232208A Method of manufacturing electronic device, and the electronic device 有权
标题翻译：制造电子设备的方法和电子设备
公开(公告)号：JP2010232208A
公开(公告)日：2010-10-14
申请号：JP2009075025
申请日：2009-03-25
申请人： Denso Corp , 株式会社デンソー
发明人： SUGIMOTO KEIICHI , NAKAGAWA MITSURU
IPC分类号： H01L21/56
CPC分类号： H05K3/284 , H05K3/281 , H05K5/0243 , H05K5/065 , H05K2201/09936 , H05K2203/1311 , H05K2203/1316 , H05K2203/1322 , Y10T29/49124 , Y10T29/49146
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device capable of suppressing deformation of a circuit board and a decrease in packaging reliability of electronic components and capable of improving design properties at low costs, and to provide an electronic device. SOLUTION: The circuit board, where the electronic components are packaged only on the front, is held in a mold cavity such that the back is adhered to an inner surface, and a decorative sheet, where a decorative layer is disposed on one surface of a transparent base material made of a thermoplastic resin, is interposed between the front of the circuit board and an inner surface of the mold that opposes the front such that the decorative layer is located at the side of the circuit board. Then, in this holding state, the thermoplastic resin is filled into the cavity and hardened, a casing for sealing the front of the circuit board including the electronic components is formed such that the back of the circuit board forms one portion of an outer surface, and the decorative sheet is integrated with the casing to form one portion of the outer surface, thus obtaining an electronic key. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造能够抑制电路板的变形并且降低电子部件的封装可靠性并且能够以低成本改进设计特性的电子设备的方法，并且提供一种电子设备。
解决方案：电子部件仅在前面封装的电路板被保持在模腔中，使得背面粘附到内表面，并且装饰片在其上设置有装饰层由热塑性树脂制成的透明基材的表面插入在电路板的前部和与前面相对的模具的内表面之间，使得装饰层位于电路板的侧面。然后，在该保持状态下，将热塑性树脂填充到空腔中并硬化，形成用于密封包括电子部件的电路板的前部的壳体，使得电路板的背面形成外表面的一部分，并且装饰片与壳体一体形成外表面的一部分，从而获得电子钥匙。版权所有（C）2011，JPO＆INPIT

22. 发明专利

JP4467492B2 Electronic equipment, a liquid crystal display device 有权
公开(公告)号：JP4467492B2
公开(公告)日：2010-05-26
申请号：JP2005257868
申请日：2005-09-06
申请人：シャープ株式会社
发明人：光洋森保 , 秀之近澤
IPC分类号： F21S2/00 , F21Y101/02 , G02F1/1333 , G02F1/13357
CPC分类号： H05K1/0266 , G02F1/13336 , G02F1/133603 , G02F2001/133354 , H05K1/142 , H05K2201/09936 , H05K2201/10106 , H05K2203/168

23. 发明专利

JP2008071742A Fuse capacity display device, and electronic device equipped with it 审中-公开
标题翻译：保险丝容量显示设备及其配备的电子设备
公开(公告)号：JP2008071742A
公开(公告)日：2008-03-27
申请号：JP2007176473
申请日：2007-07-04
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： KIM YOUNG SEOK
IPC分类号： H01H85/34 , H01H85/045 , H01H85/157 , H01H85/50
CPC分类号： H01H85/202 , H01H85/34 , H01H2085/2085 , H05K1/0266 , H05K1/18 , H05K2201/09936 , H05K2201/09954 , H05K2201/10181
摘要： PROBLEM TO BE SOLVED: To provide a fuse capacity display device capable of easily displaying the fuse capacity, and moreover, capable of easily displaying the fuse capacity arranged on a PCB by changing a PCB pattern on the PCB without a separate work steps in an electrical appliance in which two or more fuse capacities are used by the same PCB.
SOLUTION: In the fuse capacity display device, among a fuse, the PCB in which the fuse is assembled, and a plurality of fuse capacity displays to display mutually different fuse capacities, only the fuse capacity of the fuse assembled in the PCB is exposed, and a capacity display part to shut off the rest of the fuse capacities is included.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够容易地显示熔丝容量的熔丝容量显示装置，此外，能够通过在PCB上改变PCB图案来容易地显示布置在PCB上的熔丝容量，而无需单独的工作步骤在同一PCB使用两个或多个保险丝容量的电器中。
解决方案：在保险丝容量显示装置中，在保险丝，组装有保险丝的PCB和多个保险丝容量显示器之间显示互不相同的保险丝容量，只有熔丝装配在PCB中的保险丝容量并且包括用于切断其余熔丝容量的容量显示部分。版权所有（C）2008，JPO＆INPIT

24. 发明专利

JP2008504629A Coupled communication system of magnetic and optical 审中-公开
公开(公告)号：JP2008504629A
公开(公告)日：2008-02-14
申请号：JP2007519423
申请日：2005-06-28
申请人：インターナショナルバーコードコーポレイション
发明人：アレンルボウ、
IPC分类号： G06K19/08 , G06K7/10 , G06K19/06 , G06K19/07 , G06K19/077 , H04B5/02 , H05K1/02 , H05K1/16
CPC分类号： G06K19/07769 , G06K19/06018 , G06K19/07749 , G06K19/083 , H05K1/0266 , H05K1/165 , H05K2201/09781 , H05K2201/09927 , H05K2201/09936 , H05K2201/10098
摘要：【課題】磁気と光とを組み合わせた通信システムを提供する【解決手段】電磁（EM）通信デバイスと少なくとも機械可読シンボルを含む光通信デバイスとの双方を含み、少なくとも電磁通信デバイスの一部と少なくとも機械可読シンボルの一部が同じ材料で構成された通信システムを提供する。この材料は、例えば、導電性のインク或いは導電性の箔であり得る。必要であれば、電磁通信デバイスはアンテナを含み、少なくともそのアンテナの一部が少なくとも機械可読シンボルの一部を含む。
【選択図】図６

25. 发明专利

JP2008006009A Flexible printed circuit board, ultrasonic probe and manufacture process of ultrasonic probe 有权
标题翻译：柔性印刷电路板，超声探头和超声波探头的制造工艺
公开(公告)号：JP2008006009A
公开(公告)日：2008-01-17
申请号：JP2006178705
申请日：2006-06-28
申请人： Ge Medical Systems Global Technology Co Llc , ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー
发明人： NOZAKI MITSUHIRO , ISONO HIROSHI , USUI YOJI
IPC分类号： A61B8/00 , B06B3/04 , G01N29/24 , H04R17/00
CPC分类号： H05K1/118 , H05K1/0266 , H05K1/189 , H05K2201/09936 , H05K2201/10083 , H05K2201/10446 , Y10T29/49005 , Y10T29/49124 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T428/24942 , Y10T428/24975 , Y10T428/265
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed circuit board which can keep an interval as desired between a plurality of adjacent wiring patterns formed on the board by cutting the board. SOLUTION: A plurality of extending wiring patterns 30 is formed on the surface of an insulated base film 20. Each of these wiring patterns 30 is formed to include the part where intervals between adjacent wiring patterns narrow down in the direction of extension of the base film 20. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷电路板，其可以通过切割板来在形成在板上的多个相邻布线图案之间保持期望的间隔。解决方案：在绝缘基膜20的表面上形成多个延伸的布线图案30.这些布线图案30中的每一个形成为包括相邻布线图案之间的间隔在扩展方向上缩小的部分底片20.版权所有（C）2008，JPO＆INPIT

26. 发明专利

JP2007034015A Optical write-in device and image forming apparatus 有权
标题翻译：光学写入装置和图像形成装置
公开(公告)号：JP2007034015A
公开(公告)日：2007-02-08
申请号：JP2005218843
申请日：2005-07-28
申请人： Ricoh Co Ltd , 株式会社リコー
发明人： KUSUSE NOBORU
IPC分类号： G02B26/10 , B41J2/44 , H04N1/036
CPC分类号： H04N1/1135 , H04N1/053 , H04N2201/04713 , H04N2201/04715 , H04N2201/04729 , H04N2201/04732 , H05K1/0274 , H05K1/181 , H05K2201/0108 , H05K2201/09936 , H05K2201/10121
摘要： PROBLEM TO BE SOLVED: To enable an operator easily and surely decide the state of a synchronous sensor and the incident state of a light beam without using a particular equipment, to enable the operator easily adjust and repair the synchronous sensor and the incident state of the light beam, and to improve workability.
SOLUTION: A circuit substrate 23 is formed of a translucent member, and printed parts 28 and 29 as display parts are provided on the side opposite to the mounting face of the synchronous sensor 15 on the circuit substrate 23. Thus, the position at which a laser beam passes through the synchronous sensors 15 and the position of the synchronous sensors 15 are easily recognized from the back side of the circuit substrate 23 opposite to the mounting side of the synchronous sensors 15 or the scanning side of the laser beam, and a defect position is simply specified even in such an optical write-in unit having a plurality of synchronous sensors 15 as a color machine.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了使操作者能够容易且可靠地确定同步传感器的状态和光束的入射状态而不使用特定设备，以使操作者能够容易地调整和修复同步传感器和事件光束的状态，并提高可操作性。解决方案：电路基板23由半透明构件形成，并且作为显示部分的印刷部分28和29设置在与电路基板23上的同步传感器15的安装面相反的一侧。因此，位置激光束通过同步传感器15并且从电路基板23的背面侧与同步传感器15的安装侧或激光束的扫描侧相反方向容易地识别出同步传感器15的位置，并且即使在具有作为彩色机器的多个同步传感器15的光学写入单元中也简单地指定缺陷位置。版权所有（C）2007，JPO＆INPIT

27. 发明专利

JP3872463B2 Printed board 有权
公开(公告)号：JP3872463B2
公开(公告)日：2007-01-24
申请号：JP2003310094
申请日：2003-09-02
申请人：オリオン電機株式会社
发明人：竜男片山
IPC分类号： H05K1/02 , H05K1/18 , H05K3/00 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , H05K1/0266 , H05K1/18 , H05K3/3468 , H05K2201/09936 , H05K2203/159

28. 发明专利

JP2006319280A Wiring board and manufacturing method thereof 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2006319280A
公开(公告)日：2006-11-24
申请号：JP2005143058
申请日：2005-05-16
申请人： Fujifilm Holdings Corp , 富士フイルムホールディングス株式会社
发明人： MUROKI SEISUKE
IPC分类号： H05K1/02 , H05K3/10
CPC分类号： H05K1/0269 , H05K1/095 , H05K3/046 , H05K3/125 , H05K2201/0391 , H05K2201/09936 , H05K2203/013 , H05K2203/0528 , H05K2203/161
摘要： PROBLEM TO BE SOLVED: To simply and inexpensively provide a wiring board of high visibility.
SOLUTION: A coloring pattern 44 is printed onto a flexible substrate 12 using a heat transfer printer 10. A conductive coloring ink ribbon 28 consists of cyanogen, magenta and yellow ink ribbons into which conductive powder is mixed. The coloring pattern 44 formed using the conductive coloring ink ribbon 28 is conductive. The coloring pattern 44 is divided by color such as into coloring patterns 44a to 44f by each pattern energizing the same circuit signal. The coloring pattern 44 divided by color can be identified from a pattern energizing another circuit signal. An FPC 48 having the coloring pattern 44 divided by color has high visibility of a pattern to suppress the occurrence of erroneous connection etc.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：简单且廉价地提供高可见性的接线板。解决方案：使用热转印打印机10将着色图案44印刷到柔性基板12上。导电着色墨带28由掺杂有导电粉末的氰原，品红色和黄色墨带组成。使用导电着色墨带28形成的着色图案44是导电的。着色图案44由通过相同电路信号的每个图案被颜色划分成着色图案44a至44f。可以从对另一个电路信号通电的图案来识别着色图案44的颜色。具有着色图案44的颜色分割的FPC48具有高图形可见性，以抑制错误连接的发生等。（C）2007，JPO＆INPIT

29. 发明专利

JP2006140330A Method and device for manufacturing printed wiring board 审中-公开
标题翻译：制造印刷电路板的方法和装置
公开(公告)号：JP2006140330A
公开(公告)日：2006-06-01
申请号：JP2004328901
申请日：2004-11-12
申请人： Fuji Photo Film Co Ltd , 富士写真フイルム株式会社
发明人： SASAKI YOSHIHARU
IPC分类号： H01L21/027 , G03F7/20 , H05K3/00 , H05K3/06
CPC分类号： G03F7/161 , G03F7/2012 , H05K1/0266 , H05K3/0073 , H05K3/0082 , H05K3/064 , H05K2201/09936 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To manufacture a printed wiring board by stabilizing the line width of a pattern. SOLUTION: A resist layer is laminated on a substrate by a laminating device 2, and information on a lamination time is exposed on the substrate. The information on the lamination time is read out before the exposure by an exposure device 3 to determine whether or not an elapsed time from the start of lamination up to the present is within a specified hold time. When it is determined that the elapsed time is not within the hold time, the exposure device 3 issues an alarm to inform an operator of the determination result. Thus, the operator can remove the substrate from the exposure device 3 because the sufficient line width of the substrate cannot be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过使图案的线宽度稳定来制造印刷线路板。解决方案：通过层压装置2将抗蚀剂层层压在基板上，并且在基板上露出层叠时间的信息。关于层压时间的信息在曝光装置3曝光之前被读出，以确定从层叠开始到现在的经过时间是否在指定的保持时间内。当确定经过时间不在保持时间内时，曝光装置3发出报警，通知操作者确定结果。因此，由于不能获得足够的基板宽度，操作者可以从曝光装置3移除基板。版权所有（C）2006，JPO＆NCIPI

30. 发明专利

JP2005311281A Wiring board having identifiable data and manufacturing method of the wiring board 有权
标题翻译：具有标识数据的接线板和接线板的制造方法
公开(公告)号：JP2005311281A
公开(公告)日：2005-11-04
申请号：JP2004228135
申请日：2004-08-04
申请人： Phoenix Precision Technology Corp , 全懋精密科技股▲分▼有限公司
发明人： HSU SHIH-PING , CHEN SHANG-WEI , TANG SUO-HSIA , SHIH CHAO-WEN
IPC分类号： G06K1/00 , H05K1/02 , H05K3/00 , H05K3/10 , H05K3/40 , H05K3/46
CPC分类号： H05K1/0266 , H05K1/0269 , H05K3/107 , H05K3/4644 , H05K2201/09781 , H05K2201/09927 , H05K2201/09936
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, having traces or identifiable data, starting from the halfway point of a manufacturing process of wiring board products to the final step in the process, and to provide a manufacturing method of the wiring board.
SOLUTION: The manufacturing method of a wiring board has a step of preparing a wiring board, having an insulating layer which has a free space that is not used at least for a layout of wiring within the layer, a step of forming a plurality of openings in the free space of the insulating layer, and a step of forming a patterned wiring layer on a surface of the insulating layer and then forming metallically identifiable data in the openings in the free space. Thus, a wiring board, having traces or identifiable data and a manufacturing method of the wiring board, can be provided.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有迹线或可识别数据的布线板，从布线板产品的制造过程的中途开始到该工艺的最后步骤，并且提供布线的制造方法板。解决方案：布线板的制造方法具有制备布线板的步骤，该布线板具有绝缘层，该绝缘层至少具有至少用于层内布线布局的自由空间，形成在绝缘层的自由空间中的多个开口，以及在绝缘层的表面上形成图案化布线层，然后在自由空间的开口中形成金属识别数据的步骤。因此，可以提供具有迹线或可识别数据的布线板以及布线板的制造方法。版权所有（C）2006，JPO＆NCIPI

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