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21. 发明专利

JPS61204952A LEADLESS PACKAGE 失效
公开(公告)号：JPS61204952A
公开(公告)日：1986-09-11
申请号：JP4470785
申请日：1985-03-08
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , KASAI YOSHIHIKO , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI
IPC分类号： H01L23/04 , H01L23/50 , H05K5/00
摘要： PURPOSE:To obtain a package characterized by a low height when it is mounted on a printed board, good heat resistance and airtight property, by providing glass as an insulating material at the lower surface of a body comprising a metal plate, providing a plurality of electrodes, which are contacted with the lower surface or the side surface, penetrate the glass and are extended on the body, and insulating and sealing the glass and the electrodes in an airtight manner. CONSTITUTION:Glass 6 is sealed along the lower surface of a metal body 1 to a side surface 4b. Meanwhile, electrodes 10 have flat parts 10a, which are contacted with the lower surface of the glass 6. The electrodes penetrate the inside of glass 6 and are extended on the body 1 through small holes 5 (5a) of the body 1. The electrodes 10 passing the small holes 5 other than the grounding electrode are insulated from the body 1. The grounding electrode passing through the small hole 5a is electrically connected to the body 1. On packages 20a and 20b after completion, a quartz crystal element, an IC substrate, a compound element circuit substrate and other elements are mounted. They are connected to the electrodes 10, and thereafter a cap 2 is attached.

22. 发明专利

JP2002319640A PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT, AND MANUFACTURING METHOD THEREFOR 失效
公开(公告)号：JP2002319640A
公开(公告)日：2002-10-31
申请号：JP2001122729
申请日：2001-04-20
申请人： NIPPON AVIONICS CO LTD , FUJI DENKA KK
发明人： ANDO KENICHI , KAWAKAMI YUICHI , SAITO MASAO , SUZUKI MASAO
IPC分类号： C09J1/00 , C09J5/00 , H01L23/02 , H01L23/04 , H01L23/06
摘要： PROBLEM TO BE SOLVED: To reduce weight and to improve heat radiating property in a package for a semiconductor integrated circuit, for which the semiconductor integrated circuit is fixed, in a base member (10) whose upper part is opened and a metal lid plate (22) mounted on the opening of the base member is seam-jointed to the base member and sealed airtightly. SOLUTION: The base member (10) is provided with a body part (12) made of aluminum, whose upper part is opened, and the metal seal frame (14) of high electrical resistance, jointed to the opening edge of the body part and the metal lid plate (22) is seam-jointed to the seal frame (14). The seam frame (14), having high electrical resistance, is made of kovar (R), and it is preferable that the lid plate (22) be made of the kovar as well. It is preferable that gold plating or nickel plating be applied to the kovar. The metal seal frame (14) is jointed by a discharge plasma sintering process and the metal lid plate (22) is seam-jointed to the seal frame (14).

23. 发明专利

JPH0963670A AIRTIGHT TERMINAL 失效
公开(公告)号：JPH0963670A
公开(公告)日：1997-03-07
申请号：JP24368195
申请日：1995-08-29
申请人： HERUTSU KK , FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16
摘要： PROBLEM TO BE SOLVED: To provide an airtight terminal which can be mounted on a printed board at a small occupying space, and of a low cost lower than a conventional airtight terminal. SOLUTION: In an airtight terminal in which a lead terminal insert hole 2 is provided on a metal base 1, a lead terminal 3 is inserted to the lead terminal insert hole 2, and sealed with a glass 4, a glass layer 9 is jointed on the rear surface of the metal base 1 in order to prevent the contact of the rear side to the mounted board. As a result, since the glass layer is provided on the rear side of the metal base, the airtight terminal can be mounted directly to the above printed board, and since the process to install an insulating sheet when a device part D is installed is made unnecessary, the loading is made easier, and the cost can be reduced.

24. 发明专利

JPH0945398A AIRTIGHT TERMINAL 失效
公开(公告)号：JPH0945398A
公开(公告)日：1997-02-14
申请号：JP21520595
申请日：1995-08-01
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16
摘要： PROBLEM TO BE SOLVED: To provide an airtight terminal by constituting an air terminal which requires many grand terminals and has directionality (polarity) and is difficult in integral molding so as to accurately cope with a diversity. SOLUTION: An airtight terminal is sealed and installed by glass 4 by inserting a lead terminal 3 into a lead terminal inserting hole so as to penetrate through an airtight space formed of a box-shaped metallic base after the lead terminal inserting hole 2 is arranged in a bottom part of the box-shaped base 1. The box-shaped base is composed of a bottom part bottom plate 11, an intermediate frame-shaped ring 12 and an upper frame shaped ring 13, and an internal grand terminal 7 is arranged on the inner periphery of the intermediate frame-shaped ring. Since this base is divided and the internal grand terminal is arranged in the intermediate frame-shaped ring, a height, a position and the number of internal grand terminals can be easily controlled, and an airtight terminal which requires many grand terminals and has directionality (polarity) and is difficult in integral molding can be formed as the airtight terminal which can be accurately and diversely constituted.

25. 发明专利

JPH0620732A LAMINATED GLASS FOR GAS-TIGHT TERMINAL 失效
公开(公告)号：JPH0620732A
公开(公告)日：1994-01-28
申请号：JP32947791
申请日：1991-11-18
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： C03C8/14 , C03C8/24 , C03C14/00 , C03C27/06 , H01R9/16
摘要： PURPOSE:To provide lamination glass for a gas-tight terminal having a favorable adhesive property to metal, a small dielectric constant, and a large strength as sealing glass for composing the gas-tight terminal. CONSTITUTION:A high-strength glass layer 61 in which a lot of ceramic powders are added is provided at a center, and 1, 2 or more intermediate glass layers 62 in which added quantity of ceramic powders is decreased gradually are provided on the surface and back of it. An outermost glass layer 63 in which added quantity of ceramic powders is smaller than that in the intermediate glass layers is provided on the intermediate glass layer. Lamination glass for a gas-tight terminal having a favorable attachment property to metal, a low dielectric constant, and a favorable strength can thus be provided. The gas-tight terminal can thus be manufactured with light, weight thin and short dimension, and having an improved lead terminal sealing strength.

26. 发明专利

JPH02177276A SEALED TERMINAL 失效
公开(公告)号：JPH02177276A
公开(公告)日：1990-07-10
申请号：JP33229588
申请日：1988-12-28
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16 , H01G4/228 , H03H9/02
摘要： PURPOSE:To make terminals superior in toughness, tensile strength, thermal shock resistance and electrical insulation characteristics, and ensure the low cost of the terminals by forming a metal sealing base with iron or low carbon steel, using an iron nickel cobalt alloy for the terminals and and applying soda glass added with boric oxide for sealing the terminals. CONSTITUTION:Metal sealing bases 1 and 8 are made of iron or low-carbon steel, and terminals 6, 7, and 17 to 20 are made of an iron-nickel-cobalt alloy containing 28 to 30% of nickel and 15 to 18% of cobalt. Furthermore, the aforesaid terminals are electrically sealed in terminal insertion holes 4, 5, and 9 to 12, using soda glass such as soda barium glass or soda lime glass having a thermal expansion coefficient between the coefficient pertaining to the bases 1 and 8 and the terminals. In this case, the quantity of boric oxide added to the soda glass is 3% to 20%.

27. 发明专利

JPS6411351A PACKAGE FOR SEALING CIRCUIT COMPONENT 失效
公开(公告)号：JPS6411351A
公开(公告)日：1989-01-13
申请号：JP16685087
申请日：1987-07-06
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , GOUNJI TAKU , TANI ATSUSHI , KISHI SHOICHI , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI , YAMADERA SHINICHI
IPC分类号： H01L23/50 , H01L23/06
摘要： PURPOSE:To eliminate the need for connecting earth terminals with silver solder and make a package lighter without using metal frames by using a base wherein the earth terminals are mounted at an electrode plate of a package base and further, by sealing earth and lead terminals, thereby forming a book-type body made of insulating materials around the above base. CONSTITUTION:A base 21 is equipped with a flat plate type electrode plate 22 and a number of earth terminals 5 are extended to the outside and are connected with a plate 24. A lead terminal 3 extends in the direction of the electrode plate 22 from the plate 24 and a pointed end 32 is formed into a sectional U-shape and allows circuit components 30 to be easily connected to the lead terminal 3. The other pointed end 51 of the terminal 5 has the same functions. A book-type body 26 made of insulating materials 4 is formed around the base 21 and it not only seals terminals 5 and 3 but also makes this package form an air-tight space 28 wherein circuit components are sealed. When the package is used, the plate 24 is cut-off from the terminals 5 and 3 so that mutual contact is cut between the above terminals and plate 24 and mounting of the circuit components 30 into the air-tight space 28 allows the circuit components 30 to be connected to the terminals 5 and 3. After that, the package is pressed using pressure after putting a lid 8 on it.

28. 发明专利

JP2001326002A AIRTIGHT TERMINAL 失效
公开(公告)号：JP2001326002A
公开(公告)日：2001-11-22
申请号：JP2000143028
申请日：2000-05-16
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16 , H01L23/02 , H01L23/06 , H01L23/10 , H01L23/12 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To provide an airtight terminal improved in heat radiation. SOLUTION: The airtight terminal comprises a glass layer 3 provided inside the outer circumference metal 1 and a lead terminal 4 which is sealed penetrating the glass layer up and down. The outer circumference metal is made of copper or copper alloy and the lead terminal is made of iron nickel alloy, and the glass, which has a thermal expansion coefficient lower than the copper or copper alloy of the outer circumference but higher than the iron nickel alloy of the lead terminal, seals them. Since the whole of the outer circumference metal is made of copper or copper alloy, the thermal radiation is better than the conventional product. And the component number is small and the additional process such as soldering is not necessary, thus saving cost.

29. 发明专利

JPH09283650A PACKAGE FOR HERMETICAL SEALING 失效
公开(公告)号：JPH09283650A
公开(公告)日：1997-10-31
申请号：JP11839296
申请日：1996-04-16
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a package which reduces the manufacturing manhour of the package and the cost of the package and has a full proof strength and a mechanical strength even if the package is thinned. SOLUTION: In a package for hermetically sealing use of a structure, wherein an internal electrode 62 is provided on a package substrate 61 constituted of ceramics and/or glass ceramics and the electrode 62 is connected with an external electrode 66 provided on the bottom of the substrate 61 via a conductive line 67, which penetrates the substrate 61, the ceramics an/or the glass ceramics of the substrate 61 is constituted into a simple-layer tabular shape and the electrode 62 is formed on the substrate 61 into a projected shape having a height of at least 50μm or higher. An insulator base body, which is used as the package substrate 61, has not a step. That is, as the base body is constituted into the signal-layer tubular shape, the manufacturing manpower of the package can be reduced and the cost of the package can be significantly reduced at the time of mass production of the package. Moreover, as the base plate of the substrate 61 is constiutted of the single-layer tabular-shaped insulator base body, the package can be provided as a tinned correspondence article having a mechanical strength.

30. 发明专利

JPH08227746A AIRTIGHT TERMINAL AND AIRTIGHT PACKAGE 失效
公开(公告)号：JPH08227746A
公开(公告)日：1996-09-03
申请号：JP5796995
申请日：1995-02-22
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16
摘要： PURPOSE: To provide a highly airtight and highly reliable airtight terminal and airtight package in which a cover can be inexpensively and efficiently sealed to the airtight terminal. CONSTITUTION: In this airtight terminal, a lead terminal insert part 9 is provided on the bottom part of a box metal base 8, a lead terminal 4 is extended through the lead terminal insert part, the whole bottom part of the base is covered with an insulating agent 2, and the lead terminal extended through the box metal base is sealed. A flange 81 extended outward is provided on the outer circumferential part of the upper end surface of the box metal base. Since the flange extended outward is provided on the upper end outer circumference of the metal base, a resistance welding can be performed. Therefore, a highly airtight and highly reliable airtight package can be efficiently and inexpensively manufactured.

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