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    • 25. 发明专利
    • IMAGE DISPLAY DEVICE
    • JPH03280336A
    • 1991-12-11
    • JP7944390
    • 1990-03-28
    • MATSUSHITA ELECTRIC IND CO LTD
    • FURUWARI KAZUYAFUJISHIRO KENJI
    • H01J29/90H01J31/12
    • PURPOSE:To have high quality images always stably by allowing an anode terminal to be in direct contact with a metal pack layer without interposing any terminal on the way, but through provision of resilience, and by surely making the metal pack layer have a high potential. CONSTITUTION:An anode terminal 32 is fixed to a hole at the side face of a front glass container 9 with insulative adhesives 31 while contacting a metal pack layer 30 with resilience interposed. Therein no restriction is imposed to the shape and length of the anode terminal 32, but it is merely required to be secured to the front glass container 9 while contact with the metal pack layer 30 is maintained. Poor connection between terminals can be eliminated by putting together four anode terminals as conventional into one. Thereby a high voltage is surely applied even to the metal pack layer 30 even though high voltage is given to the anode terminal 32, so that an electron beam can always reach the metal pack layer, and stable images of high quality are obtained.
    • 28. 发明专利
    • Plasma display device
    • 等离子体显示设备
    • JP2008256772A
    • 2008-10-23
    • JP2007096232
    • 2007-04-02
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • FURUWARI KAZUYA
    • G09F9/00H04N5/66
    • PROBLEM TO BE SOLVED: To provide a reliable plasma display device which secures sufficient heat dissipation from an IC chip of a drive circuit for driving a display panel and prevents trouble due to heat generation.
      SOLUTION: The plasma display device, includes a panel 10 having a substrate with a display electrode and a substrate with a data electrode disposed to face each other, a printed board 46 driving the panel 10; a flexible wiring board 47 connecting the data electrode to the printed board 46; an IC chip 49 mounted on the flexible circuit board 47; a metal plate 51 having a recessed portion 51a in which the IC chip 49 is fit; and an auxiliary metal plate 42 positioned to face the metal plate 51 via the IC chip 49, and also has a heat conductive member 53 filled between the IC chip 49 and recessed portion 51a. The device prevents malfunction due to heat generation of the IC chip 49 by dissipating the heat through the auxiliary metal plate 42 even if the IC chip 49 and metal plate 51 are at high temperature.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种可靠的等离子体显示装置,其确保用于驱动显示面板的驱动电路的IC芯片的足够的散热并且防止由于发热引起的故障。 解决方案:等离子体显示装置包括具有显示电极的基板和具有彼此面对的数据电极的基板的面板10,驱动面板10的印刷电路板46。 将数据电极连接到印刷电路板46的柔性布线板47; 安装在柔性电路板47上的IC芯片49; 金属板51具有嵌合IC芯片49的凹部51a; 以及经由IC芯片49与金属板51相对配置的辅助金属板42,并且还具有填充在IC芯片49和凹部51a之间的导热部件53。 即使IC芯片49和金属板51处于高温,该装置通过散热辅助金属板42的热量来防止IC芯片49的发热引起的故障。 版权所有(C)2009,JPO&INPIT
    • 29. 发明专利
    • Manufacturing method of semiconductor device for plasma display device
    • 用于等离子显示器件的半导体器件的制造方法
    • JP2005107438A
    • 2005-04-21
    • JP2003344149
    • 2003-10-02
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • SUZUKI TOMOHIKOFURUWARI KAZUYA
    • G09F9/00H01L21/60
    • H01L2224/48091H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To reduce a price of a plasma display device by constituting an address driver circuit block at a lower cost. SOLUTION: In a manufacturing method of a semiconductor device for a plasma display device configured by cutting out a base film of a flexible wiring board from a long-length tape carrier, a plurality of flexible wiring board parts 51 are formed on the tape carrier 50 by arranging a plurality of base films on the tape carrier 50 so that the arrangement direction of a terminal part 52 of the flexible wiring board is coincident with the longitudinal direction of the long-length tape carrier 50, and an IC chip is connected to the flexible wiring board parts 51 of the tape carrier 50, thereafter, the base film is cut out of the tape carrier 50. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:通过以较低成本构成地址驱动器电路块来降低等离子体显示装置的价格。 解决方案:在通过从长条带载体上切割柔性布线板的基膜而构成的等离子体显示装置的半导体装置的制造方法中,形成多个柔性布线基板部51 带载体50通过在带载体50上布置多个基膜,使得柔性布线板的端子部分52的布置方向与长条带载体50的纵向一致,并且IC芯片是 连接到带载体50的柔性布线板部分51,然后从带载体50切出基膜。(C)2005年,JPO和NCIPI