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    • 1. 发明专利
    • Image display device
    • 图像显示设备
    • JP2007333838A
    • 2007-12-27
    • JP2006163134
    • 2006-06-13
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • FURUWARI KAZUYASUZUKI TOMOHIKO
    • G09F9/00H05K1/02H05K1/14H05K7/20
    • PROBLEM TO BE SOLVED: To provide an image display device having an image display panel driving module whose thermal resistance is sufficiently small and is not varied.
      SOLUTION: The image display device comprises: a flexible printed circuit board 52 connected to an image display panel; an IC chip 53 mounted on the flexible printed circuit board 52 and driving the electrodes of the image display panel; and a heat radiation plate 60 bonded to the flexible printed circuit board 52 and having a recessed part 62 wherein the IC chip 53 is arranged. The heat radiation plate 60 is provided with a groove 64 connecting the outer periphery and the recessed part 62 of the heat radiation plate 60.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供具有图像显示面板驱动模块的图像显示装置,该图像显示面板驱动模块的热阻足够小并且不变化。 图像显示装置包括:连接到图像显示面板的柔性印刷电路板52; 安装在柔性印刷电路板52上并驱动图像显示面板的电极的IC芯片53; 以及散热板60,其接合到柔性印刷电路板52上并具有设置有IC芯片53的凹部62。 散热板60设置有连接散热板60的外周和凹部62的凹槽64.版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Plasma display apparatus
    • 等离子显示设备
    • JP2005338707A
    • 2005-12-08
    • JP2004161041
    • 2004-05-31
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • FURUWARI KAZUYAKIMURA NAOAKISUZUKI TOMOHIKO
    • G09F9/00
    • PROBLEM TO BE SOLVED: To reduce the influence of electromagnetic waves generated from IC chips on a driving circuit board in a plasma display apparatus to other parts.
      SOLUTION: The plasma display apparatus comprises: a chassis member 24 on which a driving circuit board for driving a plasma display panel is arranged; IC chips 43 for supplying display data to address electrodes of the panel; a flexible wiring board 40 mounting the IC chips 43, having wires for connecting the IC chips 43 to the address electrodes, wires for connecting the IC chips 43 to a driving circuit and having a conductive pattern for ground; and a metallic plate 46 arranged on positions of the flexible wiring board 40 on which the IC chips 43 are to be mounted. The conductive pattern of the flexible wiring board 40 is electrically connected to the metallic plate 46 and the metallic plate 46 is fixed to the chassis member 24 by screws 48 so as to be electrically and mechanically connected to the chassis member 24.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:将等离子体显示装置中的驱动电路板上的IC芯片产生的电磁波的影响减小到其他部分。 解决方案:等离子体显示装置包括:底座部件24,布置有用于驱动等离子体显示面板的驱动电路板; 用于向面板的寻址电极提供显示数据的IC芯片43; 安装IC芯片43的柔性布线板40,具有用于将IC芯片43连接到寻址电极的导线,用于将IC芯片43连接到驱动电路并具有用于接地的导电图案的导线; 以及金属板46,其布置在要安装IC芯片43的柔性布线板40的位置上。 柔性布线基板40的导电图案与金属板46电连接,金属板46通过螺丝48固定在底盘部件24上,从而与机架部件24电气机械连接。 (C)2006,JPO&NCIPI
    • 5. 发明专利
    • Manufacturing method of semiconductor device for plasma display device
    • 用于等离子显示器件的半导体器件的制造方法
    • JP2005107438A
    • 2005-04-21
    • JP2003344149
    • 2003-10-02
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • SUZUKI TOMOHIKOFURUWARI KAZUYA
    • G09F9/00H01L21/60
    • H01L2224/48091H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To reduce a price of a plasma display device by constituting an address driver circuit block at a lower cost. SOLUTION: In a manufacturing method of a semiconductor device for a plasma display device configured by cutting out a base film of a flexible wiring board from a long-length tape carrier, a plurality of flexible wiring board parts 51 are formed on the tape carrier 50 by arranging a plurality of base films on the tape carrier 50 so that the arrangement direction of a terminal part 52 of the flexible wiring board is coincident with the longitudinal direction of the long-length tape carrier 50, and an IC chip is connected to the flexible wiring board parts 51 of the tape carrier 50, thereafter, the base film is cut out of the tape carrier 50. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:通过以较低成本构成地址驱动器电路块来降低等离子体显示装置的价格。 解决方案:在通过从长条带载体上切割柔性布线板的基膜而构成的等离子体显示装置的半导体装置的制造方法中,形成多个柔性布线基板部51 带载体50通过在带载体50上布置多个基膜,使得柔性布线板的端子部分52的布置方向与长条带载体50的纵向一致,并且IC芯片是 连接到带载体50的柔性布线板部分51,然后从带载体50切出基膜。(C)2005年,JPO和NCIPI
    • 7. 发明专利
    • Electrode joining method of plasma display panel, and plasma display panel
    • 等离子显示面板的电极接合方法和等离子体显示面板
    • JP2006049917A
    • 2006-02-16
    • JP2005228501
    • 2005-08-05
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • AKIGUCHI NAOSHITSUKAHARA NORITOSUZUKI TOMOHIKOYAMAMOTO TAKAYUKI
    • H05K3/36H01J9/36H01J11/02H01J11/20H01J11/46H05K1/14H05K3/28
    • PROBLEM TO BE SOLVED: To provide an electrode joining method of a substrate, and the substrate, which can deal with a high-voltage impressing state and large-current implementation, which can realize a joining quality with high reliability, and which can be free from leading to an increase in man-hour.
      SOLUTION: While an adhesive sheet 4 in which electric conductive particles 5 are distributed, is in tight contact with a joining electrode section 2a for a first substrate on the first substrate 1, and a joining electrode section 7a for a second substrate of an electrode 7 on the second substrate 8, by heating and pressurizing, they are made to be conductive with each other through the electric conductive particles 5, And the adhesive sheet 4 is made to be in tight contact with an insulating coat end surface 3a for the first substrate electrode, and an insulating coat end surface 6a for the second substrate electrode, by heating and pressurizing.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供能够实现高可靠性的接合质量的能够应对高压施加状态和大电流实现的基板和基板的电极接合方法,以及哪些 可以免于导致工时增加。 解决方案:在其中分布有导电颗粒5的粘合片4与第一基底1上的第一基底的接合电极部分2a紧密接触,并且第二基底的接合电极部分7a 通过加热加压使第二基板8上的电极7通过导电粒子5彼此导电,并且使粘合片4与绝缘涂层端面3a紧密接触, 第一基板电极和用于第二基板电极的绝缘涂层端面6a,通过加热和加压。 版权所有(C)2006,JPO&NCIPI
    • 8. 发明专利
    • Plasma display apparatus
    • 等离子显示设备
    • JP2005338706A
    • 2005-12-08
    • JP2004161040
    • 2004-05-31
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • FURUWARI KAZUYAKIMURA NAOAKISUZUKI TOMOHIKO
    • H05K1/11G09F9/00H05K1/14
    • PROBLEM TO BE SOLVED: To sufficiently secure the discharging structure of IC chips and to constitute address driver circuit blocks at low costs.
      SOLUTION: The plasma display apparatus comprises: IC chips 43 for supplying display data to address electrodes on a plasma display panel; a flexible wiring board 40 mounting the IC chips 43 and having wires for connecting the IC chips 43 to the address electrodes of the plasma display panel and wires for connecting the IC chips 43 to drive circuits; and a metallic plate 46 arranged on positions of the flexible wiring board 40 on which the IC chips 43 are to be mounted. The metallic plate 46 has dents 46a with which the IC chips 43 are engaged and the dents 46a are filled with heat conductive members 47.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了充分确保IC芯片的放电结构,并以低成本构成地址驱动器电路块。 解决方案:等离子体显示装置包括:用于向等离子体显示面板上的寻址电极提供显示数据的IC芯片43; 安装IC芯片43并具有用于将IC芯片43连接到等离子体显示面板的寻址电极的导线和用于将IC芯片43连接到驱动电路的导线的柔性布线板40; 以及金属板46,其布置在要安装IC芯片43的柔性布线板40的位置上。 金属板46具有与芯片43接合的凹部46a,凹部46a填充有导热构件47.版权所有(C)2006,JPO&NCIPI