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21. 发明专利

JPH06104375A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH06104375A
公开(公告)日：1994-04-15
申请号：JP29587092
申请日：1992-11-05
申请人： HITACHI LTD
发明人： TSUBOSAKI KUNIHIRO , WATANABE HIROSHI , MIKINO HIROSHI , SHIOTSUKI TOSHIHIRO , SUZUKI HIROMICHI , MIYAKI YOSHINORI , NAITO TAKAHIRO , AKEYAMA KENJI , TOIDA TOKUJI , SUMIYA AKIRO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To increase the manufacturing yield of and reliability upon an LSI package using a compound lead frame. CONSTITUTION:An insulating substrate 3a for mounting a semiconductor chip is arranged on the central part of a lead frame. Many conductor wirings 5 are formed around a chip mounting region 4 on the main surface of the insulating substrate 3a. On the other hand, multiple leads 6 are arranged outside the insulating substrate 3a and one ends of respective leads 6 are extended to the parts near the insulating substrate 3a. Furthermore, one-sided ends of suspended leads 7 are junctioned with the four corners of the insulating substrate 3a to be supported and fixed by these four suspended leads 7.

22. 发明专利

JPH05240467A 失效
公开(公告)号：JPH05240467A
公开(公告)日：1993-09-17
申请号：JP3937592
申请日：1992-02-26
申请人： HITACHI LTD , HITACHI SHIMIZU ENG KK
发明人： KAWAGUCHI YUSHI , WATANABE HIROSHI , OGAWA TAKEO , KAWAMOTO YASUO
IPC分类号： F24F5/00 , F24F11/02
摘要： PURPOSE:To save the energy and improve the performance by a method wherein the widely stabilized operating condition of a constant temperature and constant humidity device is produced and the output of a heater or the like is kept constant. CONSTITUTION:A gas bypassing electronic expansion valve is provided in the refrigerating circuit of a constant temperature and constant humidity device while the gas bypassing electronic expansion valve is controlled by a method wherein the controlling amount of opening degree of the gas bypassing expansion valve 27 is obtained so that the control output of the output control amount 24 of a heater approaches a target output amount 25 of heater by a gas bypassing expansion valve controller 26 based on the control output of the output amount of heater 24 of a heater controller 23. According to this method, the output of the heater can be balanced with the output of a cooler simply.

23. 发明专利

JPH05204869A INFORMATION PROCESSOR 失效
公开(公告)号：JPH05204869A
公开(公告)日：1993-08-13
申请号：JP1479492
申请日：1992-01-30
申请人： HITACHI LTD
发明人： SUENAGA MASASHI , FUKUMARU HIROAKI , MIYAZAKI YOSHIHIRO , TAKATANI SOICHI , KANEKAWA NOBUYASU , WATANABE HIROSHI , MATSUMOTO TOSHIO , YOKOYAMA KAZUHARU
IPC分类号： G06F12/08 , G06F15/16 , G06F15/163 , G06F15/177
摘要： PURPOSE:To continue the operation of a processor unit provided with cache memory from the occurrence to the restoration of a fault after the fault occurs on the system on one side of a multiplexed bus. CONSTITUTION:When a bus 210 is disabled, the cache memory 411 is separated logically from this information processor. During that time, the processor unit 110 continues its operation by the cache memory 412. When the bus 210 can be used again, all the data in which only the cache memory is reloaded and no main storage is reloaded are stored in the main storage of the cache memory 412 after the copy of data in the main storage is completed and the cache memory 412 is invalidated by inhibiting its operation, and the separate state of the cache memory 411 is cancelled, and the operation inhibition of the cache memory is cancelled, then, an ordinary operation can be continued.

24. 发明专利

JPH0582368A IGNITION COIL FOR INTERNAL COMBUSTION ENGINE 失效
公开(公告)号：JPH0582368A
公开(公告)日：1993-04-02
申请号：JP1073492
申请日：1992-01-24
申请人： HITACHI LTD
发明人： KUSAKA YOSHIMI , YOSHINARI TAKASHI , WATANABE HIROSHI
IPC分类号： H01F38/12 , F02P15/00 , H01F30/00
摘要： PURPOSE:To make the title-coil small-sized and lightweight by a constitution wherein a magnet which generates, in a magnetic path, a magnetic flux in the direction opposite to that of a magnetic flux formed by a primary coil is provided. CONSTITUTION:The title coil is provided with the following: two coils 1; central iron cores 2 which are arranged at the inside of the individual coils 1; and a side-face iron core 3 which is arranged at the outside of the respective coils 1 and which is installed in common. A closed magnetic circuit for the respective coils 1 is formed of the central iron cores 2 and the side-face iron core 3. The whole assembly is molded integrally by using a thermoplastic resin 4. The coils 1 which are composed of each primary coil 5 and each secondary coil 6 and high-voltage terminals 8 which have molded metals integrally by using a thermoplastic resin are housed in a thermoplastic resin case 7. A thermoset insulating casting resin is vacuum-injected into the case 7. Thereby, the charge amount of a magnetic flux which is passed through a magnetic substance can be increased up to the sum of the saturation flux density of the magnetic substance and of the magnetic flux density due to a reverse bias of a magnet.

25. 发明专利

JPH0566045A CONTROLLING METHOD FOR TEMPERATURE OF CONSTANT-TEMPERATURE AND CONSTANT-HUMIDITY APPARATUS 失效
公开(公告)号：JPH0566045A
公开(公告)日：1993-03-19
申请号：JP12089491
申请日：1991-05-27
申请人： HITACHI LTD , HITACHI SHIMIZU ENG KK
发明人： WATANABE HIROSHI , KAWAGUCHI YUSHI , SHIMIZU MASASHI
IPC分类号： F24F11/02
摘要： PURPOSE:To shorten a period of time until set temperature and humidity are stabilized by eliminating an overshoot or hunting of a wet bulb temperature particularly at the time of a high temperature and a high humidity in a constant-temperature and constant-humidity apparatus. CONSTITUTION:A heater 15 for a humidifier, a heater 17 for a heater, an evaporator and a blower are provided in a space partitioned by a heat insulator. There is provided a temperature regulator 2 for PiD-controlling an SSR 14 for a humidifier and an SSR 16 for a heater according to a deviation between a temperature and a humidity measured by a dry bulb sensor 3 and a wet bulb sensor 4 and temperature and humidity set values set at an apparatus controller 1 side.

26. 发明专利

JPH04322329A SYSTEM AND METHOD FOR INFORMATION PROCESSING COPYING WITH MANY MACHINE TYPES 失效
公开(公告)号：JPH04322329A
公开(公告)日：1992-11-12
申请号：JP9198091
申请日：1991-04-23
申请人： HITACHI LTD
发明人： KOIZUMI SHINOBU , KUSHIMA ICHIRO , WATANABE HIROSHI , JINNO TOSHIAKI , DOUMEN NOBUYOSHI
IPC分类号： G06F9/45 , G06F11/36
摘要： PURPOSE:To offer and object program form, which can realize the same execution performance as an object program peculiar to a machine time and is common to plural machine types or computers, and a machine language program generating system with respect to tj:me system or translation from a source program to a machine language program in an electronic computer. CONSTITUTION:A compiler 1001 translates a source program 1004 to an abstract object program (Arm Code) 1005 including an instruction word string of an abstract computer ARM having plural registers and the assigment instructions of abstract registers. An installer 1015 converts an Arm Code 1009 to a machine language program 1011 of an execution computer 1012 based on specification information 1010 of the execution computer 1012 consisting of register use designation 1019 and machine instruction selection rules 1020. Consequently, a machine language instruction string effectively using the registers of the execution computer is generated by optimization of abstract register use due to the compiler and the actual register assigning function of the installer, and high function instructions provided in the execution computer can be used by the instruction word string pattern substituting function of the installer.

27. 发明专利

JPH04315445A BONDING WIRE AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING SAME 失效
公开(公告)号：JPH04315445A
公开(公告)日：1992-11-06
申请号：JP8223891
申请日：1991-04-15
申请人： HITACHI LTD
发明人： WATANABE HIROSHI , OKIKAWA SUSUMU , MIKINO HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To secure anti-static effect and to enable continuous wire bonding by coating of the surface of a coated bonding wire with an anti-static agent. CONSTITUTION:A coated wire 1 used for a QFP package semiconductor integrated circuit device, which consists of an Au wire 2 that is the core, a polyurethane 3 as the coat insulating resin material for the Au wire 2, and an anti-static agent 4 which coats this polyurethane 3. Outer terminals of a semiconductor chips are wire-bonded to external connection leads by the coated wire 1, thereby manufacturing a semiconductor integrated circuit device.

28. 发明专利

JPH0364034A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0364034A
公开(公告)日：1991-03-19
申请号：JP20006989
申请日：1989-08-01
申请人： HITACHI LTD
发明人： IWATA YUTAKA , ICHITANI MASAHIRO , AKATOKI HITOSHI , WATANABE HIROSHI , MIKINO HIROSHI
IPC分类号： H01L21/56
摘要： PURPOSE:To obtain a semiconductor device having multi-stage outer leads accurately with low cost by arranging a dummy frame between two lead frames in a sandwich shape, molding the whole with resin then punching and cutting the whole with the dummy frame being sandwiched. CONSTITUTION:The dummy frame 13 of same material as upper and lower lead frames 11, 12 is sandwiched between the lead frames 11, 12 in a shape where nothing is formed in sections inner than the dam bars 11c, 12c of these lead frames, and the whole is molded with resin. The outer part of the resin- molded frame 1 is punched and cut, as required, with the dummy frame 13 being sandwiched, and the dummy frame 13 is pulled out. Since the dummy frame 13 supporting outer leads 11a, 12a on the outside of the resin frame 1 is interposed during the cutting operation, there is no possibility of shifted cutting, resulting in accurate punching.

29. 发明专利

JPH033308A IGNITION COIL FOR INTERNAL COMBUSTION ENGINE 失效
公开(公告)号：JPH033308A
公开(公告)日：1991-01-09
申请号：JP13606789
申请日：1989-05-31
申请人： HITACHI LTD , HITACHI AUTOMOTIVE ENG
发明人： ONARI TAKAHIDE , WATANABE HIROSHI , KIKUCHI KATSUHIKO
IPC分类号： H01F38/12
摘要： PURPOSE:To avoid the disconnection of a primary coil lead wire by burying the primary coil lead wire in a thermosetting resin such as epoxy resin etc. CONSTITUTION:Within the title ignition coil for internal combustion engine wherein a primary coil 2 and a secondary coil 4 are contained in a coil case 15 previously molded out of a thermoplastic synthetic resin 12 after connecting the terminal of the primary coil 2 to another primary terminal 8, a thermosetting synthetic resin 10 such as epoxy resin etc., is injected into the said coil case 15 to be thermoset and further after assembling component parts such as iron cores 13, 11, etc., into the coil part, the said ignition coil is exterior- molded out of the thermoplastic synthetic resin 12 such as polybutylene tetrapbthalate etc., a lead copper wire 8 of the primary coil 2 is buried in the epoxy resin 10 due to the shape of the primary terminal 8 to be electrically connected so that the copper wire 9 may be structured not to be buried in the exterior-molded resin 12. Through these procedures, the thermosetting synthetic resin 10 such as epoxy, etc., in small linear expansion coefficient can avoid the disconnection of the primary coil lead wire.

30. 发明专利

JPH02277251A METHOD AND APPARATUS FOR WIRE BONDING 失效
公开(公告)号：JPH02277251A
公开(公告)日：1990-11-13
申请号：JP9854989
申请日：1989-04-18
申请人： HITACHI LTD
发明人： WATANABE HIROSHI , OKIKAWA SUSUMU , MIKINO HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To enhance reliability of a bonding operation by a method wherein, when a covered wire is connected, it is held by using a fixation means provided with a contact face of a rough face with respect to an inner lead. CONSTITUTION:When a first part formed on a semiconductor chip 13 is connected to a second part on an inner lead 6 of a lead frame 11 by using a covered wire 21 to which an insulator 24 has been applied at the circumference of a metal wire 22, the covered wire is held by using a fixation means 7 provided with a contact face of a rough face with respect to an inner lead 7 when at least the covered wire 21 is bonded to the second part. As a result, it is possible to prevent a resonance, of the inner lead 6, which is caused by an ultrasonic oscillation from a bonding tool 20; accordingly, the covered film 24 of the covered wire 21 can be removed surely. Thereby, it is possible to sharply enhance bonding reliability at a wire bonding operation using the covered wire.

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