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21. 发明专利

JPH03211391A FALLING FILM EVAPORATOR 失效
公开(公告)号：JPH03211391A
公开(公告)日：1991-09-17
申请号：JP612090
申请日：1990-01-17
申请人： HITACHI LTD
发明人： TAKAHASHI KENJI , OGURO TAKAHIRO , YASUDA HIROSHI , YAMASHITA TETSUHARU , MURAKAMI KYOSHIRO , ZUSHI SHIZUO
IPC分类号： F28D3/00 , F25B39/02
摘要： PURPOSE:To increase the quantity of a liquid refrigerant flowing into a heat exchanger tube and contrive an increased cooling efficiency of a cooler, by a construction wherein a pressure loss of the liquid refrigerant across a gap between a refrigerant distributing plate and the heat exchanger tube is equal to a pressure loss of a refrigerant gas during passage through a refrigerant vapor extraction pipe from a refrigerant distributing chamber to an evaporation chamber. CONSTITUTION:A liquid refrigerant introduced through a refrigerant inlet part 2 of a shell 1 flows through a refrigerant distributing chamber 30, and flows down on the outside of heat exchanger tubes 4, whereas cold water flows into a water chamber 14 via a cold water inlet part 6. Between a liquid refrigerant distributing plate 15 and each of the tubes 4 provided is a gap 38, through which the liquid refrigerant 37 flows down. A refrigerant vapor generated through evaporation of the liquid refrigerant and a vapor in the distributing chamber 30 are passed through a vapor extraction pipe 32 into an evaporation chamber 31, where the vapors are mixed, and the resulting vapor mixture flows through a refrigerant gas discharge pipe 35 to a compressor. Where a pressure loss during passage through the vapor extraction pipe 31 is designed to be equal to a pressure loss across the gaps 38 provided at the peripheries of the heat exchanger tubes 4 for distribution of the refrigerant, only the liquid refrigerant 37 flows into the heat exchanger tubes 4 via the gap parts 38, and only the refrigerant gas flows through the extraction pipe 32 into the evaporation chamber 31. Thus, cooling efficiency of a cooler can be enhanced.

22. 发明专利

JPH02310613A METHOD AND DEVICE FOR COOLING ELECTRONIC COMPUTER 失效
公开(公告)号：JPH02310613A
公开(公告)日：1990-12-26
申请号：JP13137389
申请日：1989-05-26
申请人： HITACHI LTD
发明人： TAKAHASHI KENJI , OGURO TAKAHIRO , YASUDA HIROSHI , YAMASHITA TETSUHARU , ZUSHI SHIZUO , MURAKAMI KYOSHIRO
IPC分类号： F25D31/00 , F25D13/00 , G06F1/20 , H01L23/427 , H05K7/20
摘要： PURPOSE:To reduce a waiting time at the time of starting a computer by using a flow liquid film evaporator for the evaporator of a refrigerating cycle. CONSTITUTION:The evaporator 6 of the refrigerating cycle is set to be the flow liquid film type evaporator. Since, coolant evaporates on the outer surface of a heating tube at the inner part of the dropping liquid film type evaporator, evaporated coolant gas immediately flows into a compressor 7 by piping 5 through the compressor 7 provided in the shell of the evaporator 6. Consequently, coolant gas does not reside in the shell of the evaporator 6, responsiveness is quick, and a system immediately rises at the time of starting a cooler, whereby a cooling quantity in a normal stable state after starting can be quickly obtained. A temperature sensor 30 detects the water temperature of cooling water and an invertor 11 controls the number of revolution of the motor of the compressor 7.

23. 发明专利

JPH0273657A RADIAL FLOW HEAT SINK AND SEMICONDUCTOR COOLER USING THE SAME 失效
公开(公告)号：JPH0273657A
公开(公告)日：1990-03-13
申请号：JP22465588
申请日：1988-09-09
申请人： HITACHI LTD
发明人： ASHIWAKE NORIYUKI , OGURO TAKAHIRO , KOBAYASHI AKIMINE , ZUSHI SHIZUO
IPC分类号： H01L23/473 , H05K7/20
摘要： PURPOSE:To individually feed cooling fluids, to easily feed out, and to obtain a heat sink structure having high heat sink performance by providing an axial through hole at the center of laminated fins, introducing the fluid into the hole, and radially feeding along the laminated fins. CONSTITUTION:Platelike fins 2 having a through hole 1 are radially disposed to be laminated through a space member 3 to compose a heat sink of a semiconductor cooler. Cooling fluid 4 introduced into the axial passage 5 of the cooler is radially converted by a bottom plate 8 to flow radially in a small gap 7 formed of many platelike fins. A heat generating element composed of the heat sink is attached through a bottom plate 8, heat is transferred sequentially to the fins by the member 3 applied to the fins, and transferred from the fins to cooling fluid 6 flowing radially in the narrow gap 7. The gap 7 between the fins is so held that the heat dissipation efficiency of the heat sink becomes maximum by the member 3.

24. 发明专利

JPH01187840A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01187840A
公开(公告)日：1989-07-27
申请号：JP1238188
申请日：1988-01-22
申请人： HITACHI LTD
发明人： KODAMA HIRONORI , YAMADA KAZUJI , SOGA TASAO , MITSUYOSHI TADAHIKO , OGURO TAKAHIRO , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/36 , H01L23/40 , H05K7/20
摘要： PURPOSE:To obtain electric insulation and to provide high cooling performance by forming a thin electrically insulating layer at least one of contact faces of a superconducting member and a housing. CONSTITUTION:A hard film 25 having excellent corrosion resistance and insulation is formed on the surface of a fin 18. The film 25 is formed by performing an anodic oxidation at 200V of compounding voltage at a room temperature in 3-% ammonium tartrate solution adjusted to 8 of pH, with approx. 100Angstrom of thickness. The voltage resistance of the oxide film is approx. 1000V, and it is understood that it can sufficiently satisfy approx. 100V of the voltage resistance required to insulate between LSI chips. Heat generated at an LSI chip 1 is temporarily transmitted to the base of a thermal conductive member 7, uniformly diffused in the base, then transferred to the fins 18, transferred through a helium gas layer presented on the layer 25 and a small gap 19 formed on both side faces of the fins 18, and finally derived of coolant flowing to a cooler 26 attached to the top of a housing 15.

25. 发明专利

JPH01178578A EQUIPMENT FOR PURIFYING INERT FLUOROCARBON LIQUID 失效
公开(公告)号：JPH01178578A
公开(公告)日：1989-07-14
申请号：JP260088
申请日：1988-01-11
申请人： HITACHI LTD
发明人： KASAI KENICHI , KONNO YUKA , NAKAJIMA TADAKATSU , OGURO TAKAHIRO , ZUSHI SHIZUO
IPC分类号： B01D11/04 , B23K1/015 , C09K5/00 , H05K7/20
摘要： PURPOSE:To easily purify the title liquid for long-term service, by mixing pure water with an inert fluorocarbon liquid contaminated during use to dissolve contaminants in the water, and separating said liquid from the water. CONSTITUTION:An inert fluorocarbon liquid (FC) contaminated during long-term use in a unit 1 wherein machinery is cooled or heated by means of FC is introduced through a pump P1 into a purifier 5. Pure water (WT) from a pure water (WT) tank 7 is introduced through a pump P5 into the purifier 5, where it is mixed with FC to dissolve therein contaminants contained in the FC. A centrifuge 6 is then turned for separation of the FC from the water. The FC from which contaminants have been removed passes through a filter 11 and a dehumidifying agent 12 for moisture removal and is introduced into an FC reserve tank 8, where it is reserved for reuse in the unit tank 1. On the other hand, the WT in which contaminants have been dissolved passes through a filter 9 and an ion exchange resin 10 for removal of the contaminants and is returned as the same Wt as before to the WT reserve tank 7.

26. 发明专利

JPH01166544A COOLING STRUCTURE FOR MULTI-CHIP MODULE 失效
公开(公告)号：JPH01166544A
公开(公告)日：1989-06-30
申请号：JP32393787
申请日：1987-12-23
申请人： HITACHI LTD
发明人： GO HIROSHI , ZUSHI SHIZUO , MIYAMOTO MITSUO , OGURO TAKAHIRO
IPC分类号： H01L23/36
摘要： PURPOSE:To effectively bring a thermal conductor into contact with the fins of a housing, and to improve its thermal conductivity by inserting a spring between thermal conductors corresponding to adjacent semiconductor chips. CONSTITUTION:Thermal conductors 3 are respectively pressed by the elastic force of a spring 5 between the conductor 3 and a housing 4 to semiconductor chips 2. The conductor 3 has heat transfer fins 7, which are engaged through small gaps 9 with housing fins 8 formed on the housing 4. Springs 6 are inserted between the adjacent conductors 3, thereby effectively bringing the fins 7 into pressure contact with the fins 8. Thus, a structure in which no gap exists in the heat passage from the chip 2 to the upper face of the housing 4 is prepared, thereby improving its heat transfer performance.

27. 发明专利

JPS6476742A HEAT CONDUCTIVE SHEET 失效
公开(公告)号：JPS6476742A
公开(公告)日：1989-03-22
申请号：JP23221887
申请日：1987-09-18
申请人： HITACHI LTD
发明人： ASHIWAKE NORIYUKI , OGURO TAKAHIRO
IPC分类号： H05K7/20 , H01L23/36
摘要： PURPOSE:To obtain a sufficient contact state with small contact load, even for a solid surface with a large warp, and realize a thermal conduction sheet wherein contact resistance between solid surfaces is kept small, by arranging many fine through holes in a thin film, and providing thermal conduction members capable of plastic deformation, on both surfaces of the thin film in the through holes. CONSTITUTION:Through holes 7 with about 100mum diameter are made at about 200mum arrangement pitches in a polymeric film 6 (e.g., PIG) of about 20mum thick. Inner peripheral surfaces of the through holes are metallized by deposition of, e.g., Cr-Ni-Au. When a solid surface 2 is pressed against a solid surface 1 by applying a contact load W, minute thermal conduction members 5 arranged to penetrate a thin film 4 are deformed. Since the minute thermal conduction members 5 are independent from each other, and arranged at specific intervals, each of the thermal conduction member 5 independently deforms even if the solid surface 2 has a large warp. As a result, a sufficient contact state can be obtained with remarkably small contact load as compared with prior arts, and the reduction effect of contact thermal resistance is large.

28. 发明专利

JPS61290743A COOLING APPARATUS FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61290743A
公开(公告)日：1986-12-20
申请号：JP13171785
申请日：1985-06-19
申请人： HITACHI LTD
发明人： KAWAMURA KEIZO , OGURO TAKAHIRO
IPC分类号： H01L23/473 , H01L23/433
摘要： PURPOSE:To reduce the thermal resistance between a semiconductor chip and the thermal conductor and to remove the heat of the package effectively, by providing with high thermal conductive sheet which contains thermal conductive fluid filling a number of fine through-holes, between the semiconductor chip and the thermal conductor. CONSTITUTION:Between a semiconductor chip 1 and the thermal conductor 12, high thermal conductive sheet 13 is put with being contacted to both of the chip 1 and the conductor 12. The sheet 13 has a number of through-holes 14 which are filled with thermal conductive fluid 18, a number of trenches 16 for communicating the through-holes 14 with one another, and a surrounding trench communicating with the trenches 16 and surrounding the through holes 14. Heat evolved in the semiconductor chip 1 is conducted to the thermal conductor 12 through the sheet 13 being connected to the back face of the chip 1 and the fluid 18, and then is dissipated outwardly from the thermal conductor 12 by cooling medium. Thus the heat of the package can be effectively removed.

29. 发明专利

JP2004221607A Cooling system for electronic device, and electronic device equipped with cooling system 有权
公开(公告)号：JP2004221607A
公开(公告)日：2004-08-05
申请号：JP2004053155
申请日：2004-02-27
申请人： Hitachi Kokusai Electric Inc , Hitachi Ltd , 株式会社日立国際電気 , 株式会社日立製作所
发明人： KUROKAWA KENJU , SAITO AKIRA , FUKUKAWA TOSHIO , HARADA MAKIO , YAZAWA HIDEO , OGURO TAKAHIRO
IPC分类号： F25D9/00 , H01L23/473 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To facilitate a cooling pipe fitting, prevent leakage of a liquid coolant, and improve operating efficiency, while preventing condensation and freezing by controlling the heat exchanging capacity of a heat exchanging unit in a cooling system for an electronic device and the electronic device equipped with the cooling system. SOLUTION: A part of the cooling section is made flat, the flat section is allowed to contact each electronic part to cool it to facilitate the pipe fitting, the leakage of the liquid coolant is prevented by reducing the number of pipe connection sections, operating efficiency is improved, while preventing condensation and freezing, by controlling the heat exchanging capacity of the heat exchanging unit in the cooling system according to the atmospheric temperature, the temperature inside the electronic device and the temperature of the liquid coolant. Further, in the electronic device having the two electronic systems, the condensation and freezing are prevented in the cooling system on the standby side electronic system by sharing a liquid coolant tank of each cooling system for two electronic systems. COPYRIGHT: (C)2004,JPO&NCIPI

30. 发明专利

JP2001177021A AIR-COOLED HEAT SINK 失效
公开(公告)号：JP2001177021A
公开(公告)日：2001-06-29
申请号：JP35698999
申请日：1999-12-16
申请人： HITACHI LTD
发明人： NISHIHARA ATSUO , OGURO TAKAHIRO
IPC分类号： H05K7/20 , H01L23/36 , H01L23/467
摘要： PROBLEM TO BE SOLVED: To especially enhance the lower part of an air-cooled heat sink in cooling performance by improving the speed distribution of a cooling air flow inside an air-cooled sink so as not to make the speed of a cooling air flow lower at the roots than at the tips of the fins. SOLUTION: A heat sink is divided into a fore and a rear part, and fluid resistors are fitted to the tips of fins belonging to the fore part of the heat sink so as to enable an electronic part of large heat release value to be effectively cooled down with cooling air as small as possible. Then, a fan or a blower sending cooling air can be lessened in size. The fan or the blower itself produces less noises or noises produced when cooling air passes through the case can be lessened.

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