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    • 21. 发明专利
    • NONVOLATILE FERROELECTRIC SUBSTANCE MEMORY
    • JPH10112190A
    • 1998-04-28
    • JP26406496
    • 1996-10-04
    • HITACHI LTDHITACHI VLSI ENG
    • TAKEUCHI MIKIYOSHIDA HIROSHITANIGAWA HIROYUKI
    • G11C14/00G11C11/22
    • PROBLEM TO BE SOLVED: To obtain a ferroelectric substance memory suitable for a low voltage operation by setting an accumulation potential to two values of a voltage higher than a power source potential and 0V at the time of rewriting information. SOLUTION: In an information rewriting operation, a word line W1 is activated in a state in which bit line pair BL1, BB1 are precharged to the half of a power source voltage Vcc. Potentials of 0V or Vcc are complementary held in accumulation parts SN(1, 1) SB(1, 1) and a signal voltage is generated in between the bit line pair BL1, BB1 by the activation of the work line W1. A sense amplifier SA1 amplifies this signal to hold it at the potential of 0V or Vcc. When a rewriting voltage is applied on the bit line pairs BL1, BB1, the rewriting of information is executed. Here, a voltage Vbh higher than a voltage in which the power source voltage Vcc and threshold voltages of switching transistors are added is applied as the rewriting voltage. Then, either the SN(1, 1) or the SB(1, 1) of the accumulation parts becomes an accululation potential near to the voltage Vbh.
    • 29. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH0418755A
    • 1992-01-22
    • JP12111690
    • 1990-05-14
    • HITACHI LTD
    • HISAMOTO MASARUTAKEUCHI MIKITAKEDA EIJI
    • H01L27/11G11C11/401H01L21/8242H01L21/8244H01L27/108
    • PURPOSE:To obtain a semiconductor device very high in degree of integration by a method wherein an SOI transistor is used, whereby an N-type transistor and a P-type transistor are arranged adjacent to each other without forming a well. CONSTITUTION:A silicon oxide layer 200 is formed on a P-type silicon substrate 100, a single crystal silicon layer, an oxide film layer, and a silicon nitride layer are deposited thereon, then active regions 30, 31, 40, and 41 are formed through patterning, and then a transistor is set in characteristics through the distribution of impurities in a channel section. Then, a gate oxide film 260 and contacts 130 and 140 are formed, ions are implanted into the contacts 130 and 140, a tungsten silicide is deposited and patterned into a gate 60. Furthermore, a gate oxide film 210 is formed. Then, a gate 50 and word wires 10 and 11 are formed the same as the gate 60, and a bit wire contact 20 and a contact 70 are provided to carry out a wiring. By this setup, an N-type and a P-type flip-flop data holder and a selection transistor are formed in the smallest layout.
    • 30. 发明专利
    • SEMICONDUCTOR MEMORY
    • JPS62274771A
    • 1987-11-28
    • JP11727786
    • 1986-05-23
    • HITACHI LTD
    • TAKEUCHI MIKITAKEDA EIJIITO KIYOO
    • H01L27/10G11C11/401H01L21/8242H01L27/108
    • PURPOSE:To realize higher integration while preventing the S/N from degrading by a method wherein the plates of capacitor sections are connected with each other inside a silicon substrate and the storage capacitor sections and switching element sections are both made three-dimensional. CONSTITUTION:A semiconductor memory of this design is constituted of a charge-storing capacitor 1 and switching MOS transistor 2, and the drain of the MOS transistor 2 is connected to a bit line 3 and the gate thereof to a word line 4. The capacitors 1 are so formed as to surround an Si layer at a certain depth or lower, and a region to serve as the capacitor 1 is represented by a hatched rectangle 16. Plates 9 are formed in grooves 17, and are connected with each other inside the substrate, with a rectangle 16 serving as a memory cell. Insulation between capacitors is established by an SiO2 layer 10 in the upper region, and by a P layer 5 in the lower region. The vertical MOS transistors 2 built along the hole serve as switches, allowing signal charges into or out of the capacitor 1.