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21. 发明专利

JP2011222554A Wiring board with built-in semiconductor chip 审中-公开
标题翻译：接线板，内置半导体芯片
公开(公告)号：JP2011222554A
公开(公告)日：2011-11-04
申请号：JP2010086347
申请日：2010-04-02
申请人： Denso Corp , 株式会社デンソー
发明人： HIROSE SHINICHI , MAEDA YUKIHIRO , NAKANO TAKASHI , FUJII TETSUO , HARADA YOSHIHARU
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/16225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board with a built-in semiconductor chip for simplifying a manufacture process and eliminating the lack of current capacity without increasing a body size while a power transistor and a signal processing circuit portion coexist in a chip.SOLUTION: A large current electrode and a plurality of small current electrodes whose flowing current is smaller than the large current electrode are formed on one face of a semiconductor chip embedded in an insulating substrate including thermoplastic resin. Wiring portions connected to the small current electrodes are positioned just above the small current electrodes, have first pads formed of a conductor pattern connected to the small current electrodes and includes a plurality of first pads positioned just above the adjacent small current electrodes and on the same layer as the first pads. Wiring portions connected to the large current electrode are made of metal pieces and include lateral wiring portions positioned on the same layer as the plurality of first pads. The metal piece is positioned just above the large current electrode and serves as a second pad and is thicker than the first pad positioned on the same layer.
摘要翻译：要解决的问题：为了提供具有内置半导体芯片的布线板，用于在功率晶体管和信号处理电路部分共存的同时简化制造工艺并消除电流容量的不足而不增加体积芯片。解决方案：在包含热塑性树脂的绝缘基板中的半导体芯片的一个面上形成有大电流电极和流动电流小于大电流电极的多个小电流电极。连接到小电流电极的接线部分位于小电流电极的正上方，具有由连接到小电流电极的导体图案形成的第一焊盘，并且包括位于相邻的小电流电极正上方的多个第一焊盘层作为第一垫。连接到大电流电极的接线部分由金属片制成，并且包括位于与多个第一焊盘相同的层上的横向布线部分。金属片位于大电流电极正上方，用作第二焊盘，并且比位于同一层上的第一焊盘更厚。版权所有（C）2012，JPO＆INPIT

22. 发明专利

JP2009038196A Electronic device and wire bonding method 审中-公开
标题翻译：电子设备和电线连接方法
公开(公告)号：JP2009038196A
公开(公告)日：2009-02-19
申请号：JP2007200831
申请日：2007-08-01
申请人： Denso Corp , 株式会社デンソー
发明人： KOBAYASHI WATARU , MAEDA YUKIHIRO , IMADA SHINJI , KASUGAI HIROSHI , FUJII TETSUO
IPC分类号： H01L21/60 , H01L23/50
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/78 , H01L2224/85 , H01L2224/85205 , H01L2224/85385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To perform bonding by making a support base support the connection part for a wire in a lead frame without floating it from the support base in a wire bonding method for executing wire connection to the lead frame composed by forming a groove on a surface by press work.
SOLUTION: In order to turn the connection part 30a for the wire 50 to a shape bent downwards from the groove 35 when a part 30b of the lead frame 30 positioned on the opposite side of the connection part 30a for the wire 50 from the groove 35 is horizontally positioned and the lower surface 32 of the lead frame 30 is turned to the ground direction, the lead frame 30 is bent at the part of the groove 35, the bent lead frame 30 is turned back to a straight shape by being loaded on the flat surface 310 of the support base 300 and pressed, and wire bonding is executed in the state.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了通过使支撑基座支撑引线框架中的线的连接部而不将其从支撑基座浮动的引线接合方法来支撑接合，用于执行与由成形构成的引线框架的导线的连接通过压力加工在表面上形成凹槽。解决方案：当引线框架30的位于线50的连接部分30a的相对侧上的部分30b从槽35向下弯曲时，为了使线50的连接部分30a向下弯曲，槽35水平定位，引线架30的下表面32转向地面方向，引线架30在槽35的一部分弯曲，弯曲的引线框架30通过被装载在支撑基座300的平坦表面310上并被按压，并且在该状态下执行引线接合。版权所有（C）2009，JPO＆INPIT

23. 发明专利

JP2008218634A Wire bonding method and wire bonding apparatus 有权
标题翻译：电线接线方法和线接线装置
公开(公告)号：JP2008218634A
公开(公告)日：2008-09-18
申请号：JP2007052639
申请日：2007-03-02
申请人： Denso Corp , 株式会社デンソー
发明人： KASUGAI HIROSHI , MAEDA YUKIHIRO , YAMAKAWA HIROYUKI , IMADA SHINJI
IPC分类号： H01L21/60
CPC分类号： H01L2224/05624 , H01L2224/05647 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/48847 , H01L2224/78 , H01L2224/78302 , H01L2224/78308 , H01L2224/85 , H01L2224/85075 , H01L2224/85181 , H01L2224/85205 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/207 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To keep an end part of a capillary contactless with fume without forming a ventilation hole for exhausting the fume, in a wire bonding method for joining a wire to a joined member using the capillary.
SOLUTION: By blowing out a gas from inside an inner hole 101 of the capillary 100 toward the end part 102 of the capillary 100, an air flow from the end part 102 of the capillary 100 toward the joined members 10 and 20 is formed. In this state, a bonding wire is joined to the joined members 10 and 20.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了保持毛细管的末端部分与烟气无接触，而不形成用于排出烟雾的通气孔，以使用毛细管将线材接合到接合部件的引线接合方法。解决方案：通过从毛细管100的内孔101向毛细管100的端部102吹出气体，从毛细管100的端部102朝向连接部件10和20的气流是形成。在这种状态下，接合线接合到接合部件10和20.版权所有（C）2008，JPO＆INPIT

24. 发明专利

JP2008147550A Wire bonding method 有权
标题翻译：线接法
公开(公告)号：JP2008147550A
公开(公告)日：2008-06-26
申请号：JP2006335577
申请日：2006-12-13
申请人： Denso Corp , 株式会社デンソー
发明人： MAEDA YUKIHIRO , YAMAKAWA HIROYUKI , KASUGAI HIROSHI , IMADA SHINJI
IPC分类号： H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/48599 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/8501 , H01L2224/85045 , H01L2224/85051 , H01L2224/85205 , H01L2224/85909 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To remove dirt attached to a capillary without replacing the capillary, in a wire bonding method for joining wire to a joined member by a capillary for ball bonding. SOLUTION: The present invention provides a wire bonding method including a cleaning step, in which a tip part of a capillary 100 is pressed against a ball 41 being a cleaning member for cleaning the tip part formed on a wiring 50, and in this state, by vibrating the capirally 100, dirt K attached to the end part of the capirally 100 is scraped off. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了通过用于球接的毛细管将线接合到接合构件的引线接合方法中去除附着在毛细管上的污垢而不更换毛细管。解决方案：本发明提供一种引线接合方法，其包括清洁步骤，其中毛细管100的末端部分被压在作为用于清洁形成在布线50上的末端部分的清洁部件的球体41上，这种状态下，通过振动罩100，刮掉附着在帽状物100的端部的污垢K. 版权所有（C）2008，JPO＆INPIT

25. 发明专利

JP2007317695A Fixing structure and fixing method of electronic device 有权
标题翻译：电子设备的固定结构和固定方法
公开(公告)号：JP2007317695A
公开(公告)日：2007-12-06
申请号：JP2006142511
申请日：2006-05-23
申请人： Denso Corp , 株式会社デンソー
发明人： KOBAYASHI WATARU , MAEDA YUKIHIRO , NAGASAKA TAKASHI , FUJII TETSUO , FUKUDA YUTAKA
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To achieve a novel fixing structure of electronic device for mounting an electronic device on a heat plate in which heat dissipation properties can be enhanced while exhibiting adhesive properties between the electronic device and the heat plate.
SOLUTION: In the fixing structure of electronic device, an electronic device 10 is mounted on one surface 21 of a heat plate 20, and bonded through adhesive 30. A fine split 22 is provided on one surface 21 of the heat plate 20 and located in the adhesive 30 under such a state that the tip side end of the fine split 22 touches the electronic device 10.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了实现将电子装置安装在热板上的电子装置的新颖的固定结构，其中可以提高散热性能，同时具有电子装置和加热板之间的粘合性能。解决方案：在电子设备的固定结构中，电子设备10安装在加热板20的一个表面21上，并通过粘合剂30粘合。细分22设置在加热板20的一个表面21上并且在细分22的尖端侧端接触电子设备10的状态下位于粘合剂30中。（C）2008年，JPO＆INPIT

26. 发明专利

JP2007073674A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2007073674A
公开(公告)日：2007-03-22
申请号：JP2005257822
申请日：2005-09-06
申请人： Denso Corp , 株式会社デンソー
发明人： FUKUDA YUTAKA , SAITO MITSUHIRO , NAGATANI TOSHIHIRO , MAEDA YUKIHIRO , IMAIZUMI NORIHISA , ASAI YASUTOMI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a structure for reducing thermal resistance to improve the heat dissipating property of the power element, in a semiconductor device equipped with a power element. SOLUTION: The semiconductor device is equipped with vertical type semiconductor elements 11-14 constituted so as to make current flow between a source pad formed on the front surface side of the semiconductor substrate and a drain pad formed on the rear surface of the substrate, lead wires 31-34, 41-44 and ribbon lead wires 21-24 as wirings and heat sinks, and resin 90 which seals one end side of the semiconductor elements 11-14 and lead wires 31-34, 41-44. In this case, lead wires 41-44 are connected directly to respective drain pads of respective semiconductor elements 11-14 while one of the ribbon lead wires 21-24 are connected directly to respective source pads of respective semiconductor elements 11-14, and the other parts are connected to the lead wires 31-34. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在配备有功率元件的半导体器件中提供用于降低热阻的结构，以提高功率元件的散热性能。解决方案：半导体器件配备有垂直型半导体元件11-14，其构成为在半导体衬底的前表面侧上形成的源焊盘和形成在半导体衬底的背面上的漏极焊盘之间形成电流基板，引线31-34,41-44和带状导线21-24作为布线和散热器，以及密封半导体元件11-14的一端侧和引线31-34,44-44的树脂90。在这种情况下，引线41-44直接连接到各个半导体元件11-14的各个漏极焊盘，而其中一个带状引线21-24直接连接到各个半导体元件11-14的各个源极焊盘，并且其他部分连接到引线31-34。版权所有（C）2007，JPO＆INPIT

27. 发明专利

JP2006294974A Electronic equipment and its manufacturing method 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2006294974A
公开(公告)日：2006-10-26
申请号：JP2005115625
申请日：2005-04-13
申请人： Denso Corp , 株式会社デンソー
发明人： NAKANO TETSUO , MAEDA YUKIHIRO
IPC分类号： H05K1/18 , H01L25/04 , H01L25/18 , H05K3/32
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2924/00014 , H01L2924/19105 , H01L2924/19107 , H05K3/0061 , H05K3/3415 , H05K3/3421 , H05K5/0069 , H05K2201/09745 , H05K2201/10189 , H05K2201/10446 , H05K2203/0173 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To eliminate an interference factor at the time of connecting a wiring board with a connector member and to fully ensure a connecting space even if a build is miniaturized in electronic equipment in which the wiring board and the connector member are electrically connected by a bonding wire and are loaded in a case.
SOLUTION: A connector member 30 is constituted as a terminal installation side 33 whose opposite side of an outer connecting side 32 is flat. A pad 23 to which a wire 40 is connected is provided on one plane 21 of a wiring board 20. The pad 23 is electrically connected with a terminal 31 by the wire 40. The wiring board 20 and the connector member 30 are mutually connected and integrated, and are loaded and furnished in a case 10 in the state that one plane 21 of the wiring board 20 and the terminal installation side 33 are faced to the case 10. On the loading side 12 of the case 10 there is provided a recess 13 for containing the wire 40.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了消除在将布线板与连接器构件连接时的干扰因素，并且即使在电路设备中构造小型化也能充分确保连接空间，其中布线板和连接器构件通过接合线电连接并被装载到壳体中。解决方案：连接器构件30构成为外连接侧32的相对侧平坦的端子安装侧33。在布线板20的一个平面21上设置连接有导线40的焊盘23.焊盘23通过导线40与端子31电连接。布线基板20和连接器部件30相互连接，一体化，并且在布线板20的一个平面21和端子安装侧33面对壳体10的状态下在壳体10中装载和布置。在壳体10的装载侧12上设置有凹部包含导线40的13。版权所有（C）2007，JPO＆INPIT

28. 发明专利

JP2004186365A Manufacturing method of electronic device 有权
公开(公告)号：JP2004186365A
公开(公告)日：2004-07-02
申请号：JP2002350789
申请日：2002-12-03
申请人： Denso Corp , 株式会社デンソー
发明人： MAEDA YUKIHIRO , IMAI HIROKAZU , OKADA NOBUHIKO
IPC分类号： H01L23/50
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/85013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic device wherein a protection mask is formed for preventing the scattering of solder or flux produced in a solder bonding step preceding a wire bonding step by using a substrate having wiring portions including soldering portions and wire bonding portions, for reducing the number of separating steps, and for minimizing residues by reducing the adhesion of the protection mask. SOLUTION: The method comprises steps of giving plasma cleaning to one surface 11 of a substrate 10 where the wiring portions 20 are formed, heating the substrate 10 in an oxygen atmosphere for permitting oxygen to adsorb to the wiring portions 20, covering the wiring portions 20 with the protection mask 60 except the soldering portions 21, distributing solder 40, mounting parts, carrying out solder reflow, separating the protection mask 60, and carrying out wire bonding at the wire bonding portions 22 of the wiring portions 20. Since the oxygen adsorption reduces the adhesion of the protection mask 60, the number of the steps for separating the protection mask 60 can be reduced and thus residues can be minimized. COPYRIGHT: (C)2004,JPO&NCIPI

29. 发明专利

JP2003282750A Electronic device and manufacturing method thereof 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2003282750A
公开(公告)日：2003-10-03
申请号：JP2002078519
申请日：2002-03-20
申请人： Denso Corp , 株式会社デンソー
发明人： ISHIKAWA TAKESHI , NAKANO TETSUO , OTANI YUJI , MAEDA YUKIHIRO , MASUDA MICHIHIRO
IPC分类号： H01L23/02 , H01L23/10 , H01L23/24
CPC分类号： H01L24/73 , H01L2224/32225 , H01L2224/45124 , H01L2224/48227 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To ensure moisture resistance on a bonding surface while ensuring the reliability of wire connection, in an electronic device in which a first bonding surface and a second bonding surface for aluminum wire bonding are covered with silicon gel. SOLUTION: In a case 10, a first substrate 20 for mounting a power element 21 and a second substrate 30 having a pad 31 are housed, and a pad 22 of the power element 21 as the first bonding surface and the pad 31 of the substrate 30 as the second bonding surface are connected by an aluminum bonding wire 40. These bonding surfaces 22, 31 are covered with the silicon gel 50, and thicknesses (a), (b) of the gel 50 are not less than 100 μm and not more than 1 mm. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了确保电线连接的可靠性，在用硅胶覆盖第一接合面和铝线接合用第二接合面的电子设备中，为了确保接合面的耐湿性。解决方案：在情况10中，容纳用于安装功率元件21的第一基板20和具有焊盘31的第二基板30，并且容纳作为第一接合表面的功率元件21的焊盘22和焊盘31 作为第二接合面的基板30由铝接合线40连接。这些接合面22,31被硅胶50覆盖，凝胶50的厚度（a），（b）不小于100 μm且不大于1mm。版权所有（C）2004，JPO

30. 发明专利

JP2003007756A Connection structure using wire bonding 审中-公开
标题翻译：使用电线连接的连接结构
公开(公告)号：JP2003007756A
公开(公告)日：2003-01-10
申请号：JP2001195326
申请日：2001-06-27
申请人： Denso Corp , 株式会社デンソー
发明人： IMADA SHINJI , MAEDA YUKIHIRO
IPC分类号： H01L25/18 , H01L21/60 , H01L25/04
CPC分类号： H01L2224/0401 , H01L2224/05624 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48455 , H01L2224/48624 , H01L2224/78 , H01L2224/78302 , H01L2224/85 , H01L2224/8518 , H01L2224/85205 , H01L2224/85951 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H01L2924/20754 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To suppress the destruction of an Au wire in a secondary-side bonding section, in a connection structure for wire-bonding the Au wire, with the secondary side being an Al pad.
SOLUTION: In a bonding section on the secondary bonding side where the Al pad 21 and the Au wire 40 are bonded, an interface between Au and an Au-Al alloy layer 60 extended in the thickness direction of the wire 40 stays inside the wire 40.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了抑制次级侧接合部中的Au线的破坏，在用于将Au线引线接合的连接结构中，二次侧为Al衬垫。解决方案：在Al焊盘21和Au线40接合的二次接合侧的接合部分中，Au和在导线40的厚度方向上延伸的Au-Al合金层60之间的界面保持在线40内。

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