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    • 28. 发明专利
    • Positive resist composition and pattern forming method using the same
    • 空值
    • JP4524207B2
    • 2010-08-11
    • JP2005057634
    • 2005-03-02
    • 富士フイルム株式会社
    • 慎一 漢那博美 神田陽樹 稲部
    • G03F7/039
    • PROBLEM TO BE SOLVED: To provide a resist which shows little deterioration in the sensitivity when applied to liquid immersion exposure compared to dry exposure and causes extremely little elution of an acid into an immersion liquid, and which is suitable for liquid immersion exposure. SOLUTION: The positive resist composition for liquid immersion exposure contains (A) a resin the solubility of which with an alkali developing solution is increased by an effect of an acid, and (B) a compound which generates an acid by irradiation with active rays or radiation. When the composition is applied to form a coating film on a substrate, the composition exhibits a static contact angle of ≥72° to pure water and a static contact angle of ≤70° to an alkali developing solution. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供一种抗蚀剂,当与干式曝光相比,当应用于浸液曝光时,其灵敏度几乎没有劣化,并且导致酸极少地浸入浸渍液中,并且适用于液浸曝光 。 解决方案:用于液浸曝光的正型抗蚀剂组合物含有(A)通过酸的作用使其与碱性显影液的溶解度增加的树脂,(B)通过照射产生酸的化合物 活跃的射线或辐射。 当组合物用于在基材上形成涂膜时,该组合物与纯水呈静态接触角≥72°,与显影液的静态接触角≤70°。 版权所有(C)2006,JPO&NCIPI