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    • 11. 发明专利
    • Method of manufacturing motor core
    • 制造电机芯的方法
    • JP2013150449A
    • 2013-08-01
    • JP2012009130
    • 2012-01-19
    • Mitsui High Tec Inc株式会社三井ハイテック
    • NAKAMURA IZUMI
    • H02K15/02
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a motor core with a low iron loss by removing processing distortion that causes an iron loss so as to effectively reduce an iron loss value, without increase in the number of producing steps.SOLUTION: In a method of manufacturing a motor core, an iron core piece 10 is punched out and formed from a thin-plate material 17 having a plate thickness of 0.1-0.5 mm by pressing, and shaving processing of a press processing end surface 22 is performed, and then, the iron core pieces 10 are laminated to obtain a lamination iron core. The shaving processing is performed at once. A clearance c between a die 26 and a punch 25 at the shaving processing is 1% or more and less than 5% of the plate thickness of the thin-plate material 17. Further, the shaving processing is performed in a range of 15-45% of the plate thickness of the thin-plate material 17 from the press processing end surface 22.
    • 要解决的问题:提供一种制造低铁损的电动机芯的方法,通过消除导致铁损的加工变形,从而有效地降低铁损值,而不增加制造步骤的数量。解决方案:在 制造电动机芯的方法,通过压制冲压出由厚度为0.1-0.5mm的薄板材料17形成的铁芯片10,并且进行冲压加工端面22的剃须加工, 然后,将铁芯片10层叠,得到层叠铁芯。 一次执行剃须处理。 剃须处理时,模具26与冲头25之间的间隙c为薄板坯料17的板厚的1%以上且小于5%。此外,剃须处理在15度范围内进行, 来自压制加工端面22的薄板材17的板厚的45%。
    • 12. 发明专利
    • Laminated core and manufacturing method therefor
    • 层压芯及其制造方法
    • JP2013123345A
    • 2013-06-20
    • JP2011271522
    • 2011-12-12
    • Mitsui High Tec Inc株式会社三井ハイテック
    • UMEDA KAZUHIKOIZUMI MASAHIRO
    • H02K15/02H02K1/18
    • Y02T10/641
    • PROBLEM TO BE SOLVED: To provide a laminated core which is not deformed and can maintain predetermined dimensions, by preventing large diameter annular core pieces from being held while swelling, and to provide a manufacturing method therefor.SOLUTION: In a laminated core 18 formed by stacking, in a mold, a plurality of annular core pieces 10 obtained by punching a sheet bar material with a punch and a die, recesses 12, 13 are formed previously in the annular core pieces 10. The laminated core 18 includes a plurality of linear recesses 19, 20 in the periphery thereof, and the width w2 of the linear recesses 19, 20 on the radial inside is larger than the width w1 on the radial outside thereof.
    • 要解决的问题:为了提供通过防止大直径的环形芯片在膨胀时被保持而不变形并且可以保持预定尺寸的层叠铁芯,并提供其制造方法。 解决方案:在通过在模具中堆叠通过用冲头和模具冲压薄板坯材而获得的多个环形芯片10而形成的层叠铁芯18中,预先在环形芯中形成凹部12,13 层叠铁芯18在其周边包括多个线状凹部19,20,径向内侧的线状凹部19,20的宽度w2大于其径向外侧的宽度w1。 版权所有(C)2013,JPO&INPIT
    • 13. 发明专利
    • Method for making laminated iron core
    • 制造层压铁芯的方法
    • JP2013118732A
    • 2013-06-13
    • JP2011263925
    • 2011-12-01
    • Mitsui High Tec Inc株式会社三井ハイテック
    • ISHIKAWA ZENICHINAGATOSHI TSUTOMUNAKAMURA SHUICHIYAMATO SHIGETOSHISASAKI KATSUHIRO
    • H02K15/02
    • PROBLEM TO BE SOLVED: To provide a method for making a laminated iron core, capable of preventing the laminated iron core from being scratched when taking out it even when a speed of pressing and roll lamination is increased.SOLUTION: A method for making a laminated iron core includes: dropping core pieces 11 punched out by using a punch 12 and a blanking die 13 on a blanking die holder 14 where the blanking die 13 is fixed; sequentially rotationally laminating the core pieces 11 on a reception base 15 arranged at the bottom of the blanking die holder 14; and lowering a laminated iron core 17 dropped from the blanking die holder 14 and placed on the reception base 15 to separate them from a laminated iron core 18 in an upper part. In the method, upper and lower limit values of an angle range of a crankshaft for outputting a lowering command signal are (a-6dn) degrees and (b-6dn) degrees, respectively, where an angle of the crankshaft at a bottom dead point of the punch 12 is 180 degrees, angles of the crankshaft when the roll lamination is started and finished are a degrees and b degrees, respectively, a rotation speed of the crankshaft is n times/minute, and a delay time from the output of the lowering command signal to a cylinder 19 for lifting up and down the reception base 15, to the lowering of the reception base 15 is d seconds.
    • 要解决的问题:提供一种制造层压铁芯的方法,即使当压延和辊压层压的速度增加时也能够防止层压铁芯在取出时被划伤。 < P>解决方案:一种层压铁芯的制造方法,包括:在冲裁模具13固定的冲裁模具座14上使用冲头12和冲切模13冲压出的芯片11; 将芯片11依次旋转地层叠在布置在冲裁模具保持器14的底部的接收基座15上; 并且降低从冲裁模具座14落下并放置在接收基座15上的层叠铁芯17,以使其与上部的层叠铁芯18分离。 在该方法中,用于输出下降指令信号的曲轴的角度范围的上限值和下限值分别为(a-6dn)度和(b-6dn)度,其中曲轴在下死点的角度 冲头12的旋转速度为180度,当卷层压开始和完成时曲轴的角度分别为度数和b度,曲轴的转速为n次/分钟,并且延迟时间从 将用于将接收基座15上下升降的气缸19的指令信号降低到接收基座15的下降为d秒。 版权所有(C)2013,JPO&INPIT
    • 14. 发明专利
    • Lead frame, manufacturing method of lead frame, and semiconductor device using lead frame
    • 引线框架,引线框架的制造方法和使用引线框架的半导体器件
    • JP2013033822A
    • 2013-02-14
    • JP2011168599
    • 2011-08-01
    • Mitsui High Tec Inc株式会社三井ハイテック
    • SHIMIZU KOJIMITSUI MASANORI
    • H01L23/50
    • H01L23/4951H01L21/4842H01L23/3107H01L23/49503H01L23/49548H01L24/03H01L2224/48091H01L2224/48247H01L2924/12042H01L2924/181H01L2924/00H01L2924/00012H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide a lead frame which prevents resin burrs from adhering to a die pad in a semiconductor device where the die pad is exposed from a bottom surface, a manufacturing method of the lead frame, and the semiconductor device using the lead frame.SOLUTION: In a lead frame 10 used in a semiconductor device 20 where a rear surface of a die pad 11 having a semiconductor element 21 mounted thereon is exposed, first metal burrs 16 protruding in a direction of a package lower surface are formed at an outer peripheral part on the rear surface of the die pad 11, and a tip of each first metal burr 16 is flat. Further, multiple external terminals 26 having the same surfaces as the rear surface of the die pad 11 are formed around the die pad 11. Second metal burrs 27 protruding in the direction of the package lower surface are formed at terminal outer peripheral parts of the multiple external terminals 26, and a tip of each metal burr 27 is flat.
    • 要解决的问题:提供一种引线框架,其防止树脂毛刺粘附到芯片基板从底面露出的半导体器件中的管芯焊盘,引线框架的制造方法和半导体器件 使用引线框架。 解决方案:在半导体器件20中使用的引线框架10中,其中安装有半导体元件21的管芯焊盘11的后表面被暴露,形成在封装下表面的方向上突出的第一金属毛刺16 在芯片垫11的后表面的外周部分,并且每个第一金属毛刺16的末端是平坦的。 此外,具有与芯片焊盘11的背面相同的表面的多个外部端子26形成在芯片焊盘11周围。在封装下表面的方向上突出的第二金属毛刺27形成在多个端子的外围部分 外部端子26,并且每个金属毛刺27的末端是平坦的。 版权所有(C)2013,JPO&INPIT
    • 15. 发明专利
    • Manufacturing method of mold package
    • 模具包装的制造方法
    • JP2013016636A
    • 2013-01-24
    • JP2011148305
    • 2011-07-04
    • Denso Corp株式会社デンソーMitsui High Tec Inc株式会社三井ハイテック
    • ARAKI MAKOTOFUJII TETSUOKAJIWARA YOSHITOKIHIRATSUKA TETSUTSUGU
    • H01L21/56H01L23/34
    • H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/92247H01L2924/181H01L2924/00012H01L2924/00014
    • PROBLEM TO BE SOLVED: To ensure a good clamp property even if a mold which is not provided with a protrusion and same as a conventional one is used for resin molding, and to suppress the generation of resin burrs on a body portion, by a protrusion provided on the body portion of a heat sink.SOLUTION: A heat sink 10 is a plane surface shape having a body portion 13 and projecting piece portions 14 projected outward from the body portion 13. At least a part of the projecting piece portion 14 is made to be a clamped portion 16 suppressed by a clamp during resin molding, and a part except for the clamped portion 16 of the heat sink 10 is clipped and pressed by a punch and a die, thereby providing a protrusion 17 on a peripheral edge portion of the body portion 13 except for the clamped portion 16 of the other surface 12 of the heat sink 10. Therefore, the protrusion 17 is provided by pressing the part except for the clamped portion 16 of the heat sink 10, so that the thickness of the clamped portion 16 of the heat sink 10 can be made same as the thickness of a conventional one which is not provided with a protrusion.
    • 要解决的问题为了确保即使没有设置突起并且与常规的模具相同的模具用于树脂模制而具有良好的夹持性能,并且抑制了主体部分上的树脂毛刺的产生, 通过设置在散热器的主体部分上的突起。 解决方案:散热器10是具有主体部分13和从主体部分13向外突出的突出片部分14的平面形状。突出片部分14的至少一部分被制成夹紧部分16 在树脂成形时由夹具抑制,并且除了散热器10的夹持部分16之外的部分被冲头和模具夹紧并按压,从而在主体部分13的周边部分上提供突起17,除了 即散热器10的另一个表面12的夹紧部分16.因此,通过按压除了散热器10的夹紧部分16之外的部分来提供突起17,使得夹紧部分16的热量 槽10可以与未设置突起的常规的厚度相同。 版权所有(C)2013,JPO&INPIT
    • 16. 发明专利
    • Semiconductor device and manufacturing method of the same
    • 半导体器件及其制造方法
    • JP2012227329A
    • 2012-11-15
    • JP2011093040
    • 2011-04-19
    • Mitsui High Tec Inc株式会社三井ハイテック
    • SHIMIZU KOJINARIMATSU HIROAKI
    • H01L23/50
    • H01L2224/45144H01L2224/48247H01L2224/49171H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can reduce a length of a bonding wire and increase an interval of inner leads and neighboring connection terminals connected to the inner leads.SOLUTION: A semiconductor device 10 comprises a semiconductor element 13 mounted on an element mounting part 12 and provided at the center in a resin encapsulated package 11, and a plurality of connection terminals 15 arranged side by side on the inside of side edges of the package 11 and exposed on a rear face. Each of the connection terminals 15 are electrically connected with the electrode parts of the semiconductor element 13. An inner lead 19 extends from each connection terminal 15, and a relay terminal 21 is provided at an intermediate position of an electrode part of the semiconductor element 13 corresponding to an inner end 20 of the inner lead 19. The electrode part and the relay terminal 21 are linked by a first bonding wire 28 and the relay terminal 21 and the inner end 20 are linked by a second bonding wire 29.
    • 解决的问题:为了提供一种半导体器件及其制造方法,其可以减小接合线的长度并增加内引线和连接到内引线的相邻连接端的间隔。 解决方案:半导体器件10包括安装在元件安装部分12上并设置在树脂密封封装11的中心处的半导体元件13和在侧边缘的内侧并排布置的多个连接端子15 并暴露在背面上。 每个连接端子15与半导体元件13的电极部分电连接。内引线19从每个连接端子15延伸,并且中继端子21设置在半导体元件13的电极部分的中间位置 对应于内引线19的内端20.电极部分和中继端子21通过第一接合线28和中继端子21连接,并且内端20通过第二接合线29连接。 版权所有(C)2013,JPO&INPIT
    • 17. 发明专利
    • Manufacturing device of laminated core
    • 层压芯的制造装置
    • JP2012210148A
    • 2012-10-25
    • JP2012171366
    • 2012-08-01
    • Mitsui High Tec Inc株式会社三井ハイテック
    • NAGAI AKIRAKATO TAKESHIYOSHIDA KOHEI
    • H02K15/12H02K1/27
    • PROBLEM TO BE SOLVED: To provide a manufacturing device of a laminated core, which does not change a mold to different rotor laminated cores, eliminates the need of preparing other kinds of molds, and can shorten a lead time of a production line.SOLUTION: In a manufacturing device of a laminated core, a laminated core body 14 in which a magnet piece 15 is inserted in magnet insertion holes 12 and 13 is put between a mold 10 and a holding die 11, and mold resin 19 is filled from a resin collecting portion 16 by a plunger 27 vertically moved to fix the magnet piece 15 to the magnet insertion holes 12 and 13. A resin channel 31 extending from the resin collecting portion 16 toward the magnet insertion holes 12 and 13 is provided between the mold 10 and the laminated core body 14, and a guide member 18 equipped with a gate 30 communicating to the magnet insertion holes 12 and 13 is disposed on a downstream side of the resin channel 31.
    • 要解决的问题:为了提供不将模具改变成不同的转子层叠铁芯的层叠铁芯的制造装置,不需要制备其它类型的模具,并且可以缩短生产线的交货期 。 解决方案:在层叠铁心的制造装置中,将磁铁片15插入到磁体插入孔12和13中的叠层铁芯体14放置在模具10和保持模11之间,并且模制树脂19 由树脂收集部分16通过垂直移动的柱塞27填充以将磁片15固定到磁体插入孔12和13上。设置从树脂收集部分16向磁体插入孔12和13延伸的树脂通道31 在树脂通道31的下游侧设置有与模具10和层叠铁芯体14之间的导向构件18,以及具有与磁铁插入孔12,13连通的门30的引导构件18.(C) 2013年,JPO&INPIT
    • 18. 发明专利
    • Plating method
    • 涂层方法
    • JP2012197520A
    • 2012-10-18
    • JP2012162872
    • 2012-07-23
    • Mitsui High Tec IncMitsui Denki:Kk株式会社三井ハイテック株式会社三井電器
    • MINAMI MASAKISENBA YOSHIJI
    • C25D17/06C25D17/08
    • PROBLEM TO BE SOLVED: To provide a plating method high in production efficiency and capable of performing high quality plating process in which no current carrying trace is left and plated thickness is uniform.SOLUTION: In a plating method, a metallic square plate material 12 having a rectangular shape in plan view is allowed to pass through a treatment tank group 11 to be plated, the treatment tank group including a plating liquid tank 78 and cleaning liquid tanks 80 and 95 which are linearly arranged. The plating method includes: a first step of conveying the square plate material 12 to the front side of the treatment tank group 11 by an inlet-side conveyor 13; and a second step of, by a holding and conveying means 15, holding the both sides of the square plate material 12, which has been conveyed by the inlet-side conveyor 13, with a plurality of rods 14 and 14a hung down, respectively, energizing from at least the one rod 14 during the square plate material 12 passes through the plating liquid tank 78, and allowing the square plate material 12 to sequentially pass through each of the treatment tanks of the treatment tank group 11 in an immersed or non-immersed state; and a third step of receiving the square plate material 12, which has passed through the treatment tank group 11, by an outlet-side conveyor 16 to convey to the following step.
    • 要解决的问题:提供一种生产效率高且能够进行不留下载流痕迹的高质量电镀工艺并且镀层厚度均匀的电镀方法。 解决方案:在电镀方法中,允许在平面图中具有矩形形状的金属方板材12通过待镀的处理槽组11,包括镀液罐78和清洗液的处理槽组 直线排列的罐80和95。 电镀方法包括:通过入口侧输送机13将方板材料12输送到处理槽组11的前侧的第一步骤; 以及第二步骤,通过保持和输送装置15,分别保持已经被入口侧输送机13输送的方形板材料12的两侧,多个杆14和14a分别悬挂, 在正方形板材12期间,从至少一个杆14通电通过镀液罐78,并且允许方板材料12顺序地通过处理槽组11的处理槽中浸没或非浸渍, 沉浸状态 以及第三步骤,通过出口侧输送机16接收已经通过处理槽组11的方板材料12,以输送到下一步骤。 版权所有(C)2013,JPO&INPIT
    • 19. 发明专利
    • Method for manufacturing laminated core
    • 制造层压芯的方法
    • JP2012125029A
    • 2012-06-28
    • JP2010272769
    • 2010-12-07
    • Mitsui High Tec Inc株式会社三井ハイテック
    • HIRAYAMA YUICHIAONO TAKETOISOMURA NAOTERU
    • H02K15/02H02K1/18H02K1/22H02K1/27
    • H02K15/03
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated core that facilitates detachment of a dummy plate used in resin sealing and minimizes gouges in resin filled in magnet insertion holes.SOLUTION: In a method for manufacturing a laminated core, permanent magnets 14 are inserted into magnet insertion holes 12 and 12a of a core main body 13. With the core main body 13 sandwiched between an upper die 15 and a lower die 16, then, the magnet insertion holes 12 and 12a are filled with resin 18 from a resin reservoir pot 17 provided in either one of the upper die 15 and the lower die 16 so as to fix the permanent magnets 14. A dummy plate 19 is arranged in between the core main body 13 and the either one of the dies 15 and 16 in which the resin reservoir pot 17 is formed. The dummy plate 19 has gate holes 35 and 35a that guide the resin 18 from the resin reservoir pot 17 to the magnet insertion holes 12 and 12a and that overlap part of the magnet insertion holes 12 and 12a as well as a surface of the core main body 13. After the resin 18 is infused into the magnet insertion holes 12 and 12a via the gate holes 35 and 35a and then cured, the dummy plate 19 is detached from the core main body 13, and the resin 18 overflowing from the magnet insertion holes 12 and 12a is removed.
    • 要解决的问题:提供一种便于剥离树脂密封中使用的虚拟板的层压芯的制造方法,并使填充在磁体插入孔中的树脂中的沟槽最小化。 解决方案:在层叠铁芯的制造方法中,将永久磁铁14插入铁芯主体13的磁铁插入孔12和12a中。芯体主体13夹在上模15和下模16之间 然后,从设置在上模15和下模16中的任一个的树脂贮存器17中将磁体插入孔12和12a填充树脂18,以固定永久磁铁14.假定板19布置 在芯主体13和形成有树脂储存罐17的模具15,16中的任一个之间。 虚拟板19具有将树脂18从树脂储存罐17引导到磁体插入孔12和12a并且与磁体插入孔12和12a的一部分以及芯主体的表面重叠的门孔35和35a 在树脂18经由闸门孔35和35a输入到磁体插入孔12和12a中然后固化之后,虚设板19从芯主体13分离,并且从磁体插入溢出的树脂18 孔12和12a被去除。 版权所有(C)2012,JPO&INPIT
    • 20. 发明专利
    • Stator laminated core and manufacturing method thereof
    • 定子层压芯及其制造方法
    • JP2011182582A
    • 2011-09-15
    • JP2010045630
    • 2010-03-02
    • Mitsui High Tec Inc株式会社三井ハイテック
    • HASHIMOTO AKIHIROUMEDA KAZUHIKO
    • H02K1/14H02K1/18H02K15/02
    • PROBLEM TO BE SOLVED: To provide a stator laminated core suppressing the deterioration of torque characteristics and a manufacturing method of the stator laminated core.
      SOLUTION: In the stator laminated core 10, a stator core piece 20 formed by punching the periphery of a punched hole 35 from a magnetic metal plate 30 with the punched hole 35 composed of the punching trace of a rotor core piece 31 is caulked and laminated through caulkings 21. According to the manufacturing method thereof, thin regions 28 formed by pushing in the thickness direction are formed to the pole pieces 24 of the stator core piece 20, and the caulkings 21 are formed in the thin regions 28.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种抑制转矩特性劣化的定子叠层铁芯和定子叠片铁芯的制造方法。 解决方案:在定子层叠铁芯10中,通过利用由转子芯片31的冲压轨迹组成的冲孔35从磁性金属板30冲压冲孔35而形成的定子铁芯片20是 通过铆接21铆接和层压。根据其制造方法,通过在厚度方向上推动而形成的薄区域28形成在定子铁心片20的极片24上,并且填缝21形成在薄区域28中。 版权所有(C)2011,JPO&INPIT