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1. 发明专利

JP2012197520A Plating method 有权
标题翻译：涂层方法
公开(公告)号：JP2012197520A
公开(公告)日：2012-10-18
申请号：JP2012162872
申请日：2012-07-23
申请人： Mitsui High Tec Inc , Mitsui Denki:Kk , 株式会社三井ハイテック , 株式会社三井電器
发明人： MINAMI MASAKI , SENBA YOSHIJI
IPC分类号： C25D17/06 , C25D17/08
摘要： PROBLEM TO BE SOLVED: To provide a plating method high in production efficiency and capable of performing high quality plating process in which no current carrying trace is left and plated thickness is uniform.SOLUTION: In a plating method, a metallic square plate material 12 having a rectangular shape in plan view is allowed to pass through a treatment tank group 11 to be plated, the treatment tank group including a plating liquid tank 78 and cleaning liquid tanks 80 and 95 which are linearly arranged. The plating method includes: a first step of conveying the square plate material 12 to the front side of the treatment tank group 11 by an inlet-side conveyor 13; and a second step of, by a holding and conveying means 15, holding the both sides of the square plate material 12, which has been conveyed by the inlet-side conveyor 13, with a plurality of rods 14 and 14a hung down, respectively, energizing from at least the one rod 14 during the square plate material 12 passes through the plating liquid tank 78, and allowing the square plate material 12 to sequentially pass through each of the treatment tanks of the treatment tank group 11 in an immersed or non-immersed state; and a third step of receiving the square plate material 12, which has passed through the treatment tank group 11, by an outlet-side conveyor 16 to convey to the following step.
摘要翻译：要解决的问题：提供一种生产效率高且能够进行不留下载流痕迹的高质量电镀工艺并且镀层厚度均匀的电镀方法。解决方案：在电镀方法中，允许在平面图中具有矩形形状的金属方板材12通过待镀的处理槽组11，包括镀液罐78和清洗液的处理槽组直线排列的罐80和95。电镀方法包括：通过入口侧输送机13将方板材料12输送到处理槽组11的前侧的第一步骤; 以及第二步骤，通过保持和输送装置15，分别保持已经被入口侧输送机13输送的方形板材料12的两侧，多个杆14和14a分别悬挂，在正方形板材12期间，从至少一个杆14通电通过镀液罐78，并且允许方板材料12顺序地通过处理槽组11的处理槽中浸没或非浸渍，沉浸状态以及第三步骤，通过出口侧输送机16接收已经通过处理槽组11的方板材料12，以输送到下一步骤。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011029335A Leadframe, method for manufacturing leadframe, and method for manufacturing semiconductor device using the leadframe 审中-公开
标题翻译：铅笔，制造铅笔的方法和使用铅笔制造半导体器件的方法
公开(公告)号：JP2011029335A
公开(公告)日：2011-02-10
申请号：JP2009172368
申请日：2009-07-23
申请人： Mitsui Denki:Kk , Mitsui High Tec Inc , 株式会社三井ハイテック , 株式会社三井電器
发明人： MORI SHUJI , MINAMI MASAKI , FUJIMOTO HIROYUKI , SENBA YOSHIJI , MIYAHARA KEI , KOBAYASHI NOBUHIRO , YABU SHINJU , SATO TAKAHIRO , KAWABATA MINORU , YOSHIMOTO SHUNICHI
IPC分类号： H01L23/50
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a leadframe which method prevents the formation of a plating burr, and the leadframe manufactured by the manufacturing method, and to provide a method of manufacturing a semiconductor device using the leadframe.
SOLUTION: An upper-side terminal 13 is projected on the upper surface of the leadframe material 11. A first resist film 27 and a second resist film 28 are formed as masks on the upper surface and the lower surface of the leadframe material 11, respectively. A first metal plating layer 31 and a second metal plating layer 32 are formed on the upper surface of the upper-side terminal 13 and in an area for forming a lower-side terminal 19 on the under surface of the leadframe material 11, using the first resist film 27 and the second resist film 28, respectively, to form the leadframe 10.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造防止电镀毛刺形成的引线框的方法和通过制造方法制造的引线框，并提供使用引线框制造半导体器件的方法。解决方案：上侧端子13突出在引线框架材料11的上表面上。第一抗蚀剂膜27和第二抗蚀剂膜28形成为引线框架材料的上表面和下表面上的掩模 11。在引线框架材料11的下表面上，在上侧端子13的上表面和用于形成下侧端子19的区域中形成第一金属镀层31和第二金属镀层32，第一抗蚀剂膜27和第二抗蚀膜28分别形成引线框架10.版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2009197291A Plating apparatus 有权
标题翻译：电镀设备
公开(公告)号：JP2009197291A
公开(公告)日：2009-09-03
申请号：JP2008042091
申请日：2008-02-22
申请人： Mitsui Denki:Kk , Mitsui High Tec Inc , 株式会社三井ハイテック , 株式会社三井電器
发明人： MINAMI MASAKI , SENBA YOSHIJI
IPC分类号： C25D17/00 , C25D7/12 , C25D17/06
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which has a high production efficiency and can form a plated film which does not leave an energization mark thereon, has uniform plated film thickness and shows high quality.
SOLUTION: The plating apparatus 10 has a treatment tank group 11 which is linearly arranged and includes a plating liquid tank 78 and cleaning liquid tanks 80 and 95, and passes a metallic square plate material 12 showing a rectangular shape when viewed from the upper part through the treatment tank group 11 to plate the square plate material 12 with a metal. The plating apparatus also includes: an inlet-side conveyor 13 which transports the square plate material 12 to the front side of the treatment tank group 11; a sandwiching and transporting means 15 which sandwiches the both sides of the square plate material 12 that has been transported by the inlet-side conveyor 13 respectively with a plurality of rods 14 and 14a hung down, can pass an electric current from at least one of the rods 14, and sequentially passes the square plate material 12 through each treatment tank of the treatment tank group 11 in an immersed or non-immersed state; an outlet-side conveyor 16 which receives the square plate material 12 that has been transported by the sandwiching and transporting means 15 and has passed the treatment tank group 11; and a trestle 17 for holding them.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有高生产效率并且可以形成不在其上留下通电标记的镀膜的电镀装置，具有均匀的镀膜厚度并且显示出高质量。解决方案：电镀装置10具有线性排列的处理槽组11，包括电镀液箱78和清洗液箱80,95，并且当从上部通过处理槽组11，用金属板方形板材料12。电镀装置还包括：将方板材料12输送到处理槽组11的前侧的入口侧输送机13; 通过分别由多个杆14和14a悬挂的入口侧输送机13输送的正方形板材12的两侧夹持的夹持和输送装置15可以从下列中的至少一个传递电流：杆14，并且顺序地将方板材料12通过处理槽组11的处理槽处于浸没或非浸没状态; 出口侧输送机16，其接收由夹持输送机构15输送并经过处理槽组11的方板材料12; 和一个支架17。版权所有（C）2009，JPO＆INPIT

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