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    • 15. 发明专利
    • THIN FILM FORMING DEVICE
    • JPH01319681A
    • 1989-12-25
    • JP15060688
    • 1988-06-17
    • MITSUBISHI ELECTRIC CORP
    • KOBAYASHI TOSHIYUKIKINOSHITA YOSHIMIODA MASAO
    • C23C16/50H01L21/205H01L21/31
    • PURPOSE:To form thin films which are dense and have good adhesion and quality by constituting an electrode which is disposed in a reaction chamber and accelerations ion particles to a network shape and irradiating substrate surfaces with light of a short wavelength through this electrode, thereby activating the surfaces. CONSTITUTION:A reaction gas G2 such as N2 is converted to plasma in a plasma generating section 5 and the plasma is introduced from a gaseous plasma feed section 6 into the reaction chamber 3 in which a prescribed degree of the vacuum is maintained by evacuation from a discharge part 7. A gaseous raw material G1 such as SiH4 is introduced simultaneously therewith from a gaseous material feed section 5 into the reaction chamber. Both the gases are brought into a mixed reaction to form the ions. The ion particles are accelerated by a power source 9 via the electrode 81 and are brought into collision against the surfaces of the substrates 1 heated to and held at a prescribed temp. by a heater 2 to form the thin films consisting of Si3N4, etc. The electrode 81 of the above-mentioned thin film forming device is constituted to the network shape and the surfaces of the substrates 1 are irradiated with the light from the short wavelength light source 1 transmitted through said electrode, by which the surfaces are activated. The thin films which are dense, have the good adhesive property to the substrates 1, decrease the impact damage by particles and have good step coverage are obtd. in this way.
    • 16. 发明专利
    • THIN FILM FORMING APPARATUS
    • JPS63184322A
    • 1988-07-29
    • JP1645987
    • 1987-01-26
    • MITSUBISHI ELECTRIC CORP
    • KOBAYASHI TOSHIYUKIKINOSHITA YOSHIMIODA AKIO
    • H01L21/31H01L21/205
    • PURPOSE:To cause a large amount of gas particles to collide with a substrate at a high speed, form a dense thin film on the substrate and improve its adhesion and film forming rate by providing an electrode to generate electric field for accelerating plasma gas particles toward the substrate. CONSTITUTION:High speed gas particles in the direction of arrow mark B indicating the flow to the substrate among the gas particle flow directions A and B indicated by the arrow mark increase by application of an electric field across an electrode 8, which is provided opposite to a substrate 1 and heater 2 and is arranged so as to interpose the material gas G1 and second gas G2 supplied from the supply parts 4, 6 with the substrate 1 and the heater 2. Namely, the electric field works on the ionized gas and particles are accelerated to a high speed. In the case of forming a thin film of silicon nitride, N2 is used as the second gas G2, but when a silicon oxide film is to be formed, N2O gas is used in place of N2 gas. When an amorphous silicon is to be formed, Ar gas is used in place of N2 gas, respectively in the similar processings.
    • 17. 发明专利
    • SEMICONDUCTOR MANUFACTURING EQUIPMENT
    • JPS63166216A
    • 1988-07-09
    • JP31411186
    • 1986-12-27
    • MITSUBISHI ELECTRIC CORP
    • ODA MASAOKOBAYASHI TOSHIYUKIKINOSHITA YOSHIMI
    • H01L21/31H01L21/205H01L21/263
    • PURPOSE:To form a silicon oxide film and a silicon nitride film, and, further, form an amorphous silicon film with a high speed, by installing an introduction gas feeding inlet independently of a reaction gas feeding inlet, and introducing an introduction gas into a reaction chamber after turning it into plasma. CONSTITUTION:Before a silicon oxide film is formed on a substrate 2, oxygen or nitrogen suboxide 14 is introduced into a reaction chamber 1 after it is supplied to a plasma generating tube 18 and excited with microwave. The oxygen or the nitrogen suboxide in a excited state reacts with silane 5 which is introduced through a reaction gas feeding inlet 5 and decomposed by a carbon dioxide gas laser beam 2, and forms a silicon oxide film on the substrate 2. When a silicon nitride film is formed on the substrate 2, nitrogen or ammonia 14 is supplied and introduced into the reaction chamber 1 after it is excited with microwave. The nitrogen or ammonia in a excited state forms a silicon nitride film in the same manner. When an amorphous silicon film is formed on the substrate 2 with a high speed, argon 14 is supplied, and, in the same process, the amorphous silicon film can be rapidly formed together with the decomposition action of silane 5.
    • 19. 发明专利
    • Fluid removal tool
    • 流体移除工具
    • JP2009101459A
    • 2009-05-14
    • JP2007275036
    • 2007-10-23
    • Mitsubishi Electric Corp三菱電機株式会社
    • MINATOYA TOSHIHIDEKINOSHITA YOSHIMI
    • B23B41/08B03C1/00B03C1/30B23B45/14
    • PROBLEM TO BE SOLVED: To provide a fluid removal tool capable of removing fluid out of a container without leaking the fluid into a working space. SOLUTION: The fluid removal tool 100 opens a hole 16 in a tank 13 which contains PCB oil and removes the PCB oil from the tank 13 through the hole 16. The fluid removal tool 100 includes a drill blade 51, a tool body 20, and a drill blade coming-off preventing metal fitting 56. The drill blade includes a top end portion 52 and a shank portion 54. The tool body 20 movably supports the drill blade 51 in an axial direction. A fluid penetration space 21 in which the front end portion 52 is disposed and which opens on a line in the axial direction of the drill blade 51, and a through-hole 28 which is communicated with the fluid penetration space 21 and in which the shank portion 54 is inserted are formed in the tool body 20. The drill blade coming-off preventing metal fitting 56 locks the drill blade 51 to the tool body 20, and regulates movement of the drill blade 51 in a reversal direction. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供能够将流体从容器中除去而不将流体泄漏到工作空间中的流体移除工具。 解决方案:流体移除工具100在容纳有PCB油的罐13中打开孔16,并通过孔16从罐13移除PCB油。流体去除工具100包括钻刀51,工具主体 钻头刀片包括顶端部分52和柄部分54.工具主体20沿轴向方向可移动地支撑钻刀51。 流体通过空间21,其中前端部52设置并且在钻杆51的轴向上的线上开口;以及通孔28,其与流体穿透空间21连通,并且其中柄 插入的部分54形成在工具主体20中。防止金属配件56的钻头刀片将钻刀51锁定到工具主体20上,并且调节钻刀51沿反向的运动。 版权所有(C)2009,JPO&INPIT
    • 20. 发明专利
    • Drive force transmission device
    • 驱动力传动装置
    • JP2007002894A
    • 2007-01-11
    • JP2005181891
    • 2005-06-22
    • Mitsubishi Electric Corp三菱電機株式会社
    • KINOSHITA YOSHIMIYOSHIDA KAZUO
    • F16H7/02B08B5/04F16G1/28F16H55/38
    • F16H57/0402F16H55/171
    • PROBLEM TO BE SOLVED: To prevent scattering of abrasion powder generated by friction between a timing belt and a timing pulley or to reduce an amount of abrasion powder staying in systems of the timing belt and the timing pulley.
      SOLUTION: A drive force transmission device includes a pair of timing pulleys 1 respectively secured to a rotary shaft 12 driven by a rotating machine and a rotary shaft 12 on a follower side which makes a pair with the rotary shaft 12 on the driving side, and the timing belt 4 having teeth engaging with teeth of the timing pulleys 1. The drive force transmission device transmits rotation of the rotary shaft 12 to the timing belt 4 via the timing pulley 1. In the drive force transmission device, the rotary shaft 12 inserted in a rotary shaft hole 7 is provided with exhaust holes 15 through which air can be exhausted by suction, and suction holes 3 are formed in the timing pulley 1 in such a manner that the suction holes 3 extend through the timing pulley 1 from bottom lands 2 between the teeth to the inner periphery of the timing pulley 1. The timing pulley 1 is so secured to the rotary shaft 12 that the suction holes 3 communicate with the exhaust holes 15.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了防止同步带和正时皮带轮之间的摩擦产生的磨损粉末的散射或减少在同步皮带和正时皮带轮的系统中停留的磨损粉末的量。 解决方案:驱动力传递装置包括一对正时皮带轮1,其分别固定在由旋转机械驱动的旋转轴12和从动侧的旋转轴12上,所述旋转轴12与驱动中的旋转轴12成对 侧面以及具有与正时皮带轮1的齿啮合的齿的同步皮带4.驱动力传递装置经由正时滑轮1将旋转轴12的旋转传递到同步皮带4.在驱动力传递装置中, 插入旋转轴孔7中的轴12设置有排气孔15,空气可以通过抽吸孔排出,并且吸气孔3以规定的滑轮1的方式形成在吸气孔3中,吸气孔3延伸穿过正时皮带轮1 从位于齿之间的底部平台2到同步皮带轮1的内周。正时皮带轮1被固定到旋转轴12,使得吸入孔3与排气孔15连通。版权所有(C)2007 ,J.P O&INPIT