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    • 19. 发明专利
    • Solid-state image sensing device and its manufacturing method
    • 固态图像感应装置及其制造方法
    • JP2005294495A
    • 2005-10-20
    • JP2004106815
    • 2004-03-31
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • IZUNO CHIZUO
    • H01L27/14H04N5/335H04N5/369H04N5/372
    • PROBLEM TO BE SOLVED: To provide a solid-state image sensing device capable of preventing the generation of dust resulting from a package, and to provide a manufacturing method for the solid-state image sensing device.
      SOLUTION: The solid-state image sensing device (1) has the package (101), solid-stage image sensing elements (103) fixed into recesses (102) formed to the package (101), and a transparent plate (105) mounted so as to cover the recesses (102) on the package (101). In the solid-stage image sensing device (1), a plurality of trenches (11) are formed towards the outside from the outer edges of the recesses (102) at places (101d) facing the transparent plate (105) on the package (101), the trenches (11) are filled with an adhesive (13), and the package (101) and the transparent plate (105) are bonded through the adhesive (13). In the solid-state image sensing device (1), the surfaces of the package (101) in the recesses (102) are covered with films (14) composed of the adhesive (13), and the adhesive (13) filled into the trenches (11) and the films (14) are connected continuously.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种能够防止由封装产生的灰尘的固体摄像装置,并提供固体摄像装置的制造方法。 固体摄像装置(1)具有封装(101),固定在形成于封装(101)的凹部(102)中的固体摄像元件(103)和透明板( 105),以便覆盖包装(101)上的凹部(102)。 在固体图像感测装置(1)中,在与包装上的透明板(105)相对的位置(101d)处,从凹部(102)的外边缘向外侧形成多个沟槽(11) 101)中,沟槽(11)填充有粘合剂(13),并且封装(101)和透明板(105)通过粘合剂(13)结合。 在固体摄像装置(1)中,凹部(102)中的包装体(101)的表面被由粘接剂(13)构成的薄膜(14)覆盖,粘接剂(13)被填充到 沟槽(11)和薄膜(14)连续连接。 版权所有(C)2006,JPO&NCIPI