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11. 发明专利

JPS51126064A LEAD FRAME MATERIAL 失效
公开(公告)号：JPS51126064A
公开(公告)日：1976-11-02
申请号：JP4967975
申请日：1975-04-25
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/68 , H01L23/48 , H01L23/50
摘要： PURPOSE:To obtain lead frame material as to possess clad part on one part of the lead and moreover, to possess the lead group in the lead frame lenghtwise direction.

12. 发明专利

JPS60152099A SORTING DEVICE 失效
公开(公告)号：JPS60152099A
公开(公告)日：1985-08-10
申请号：JP714384
申请日：1984-01-20
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H05K13/02 , H01L21/66 , H05K13/00

13. 发明专利

JPS59130435A Wedge for supersonic wire bonder 失效
标题翻译：超级线束接头
公开(公告)号：JPS59130435A
公开(公告)日：1984-07-27
申请号：JP17294283
申请日：1983-09-21
申请人： Hitachi Ltd
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L2224/78 , H01L2224/78313 , H01L2224/78318 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2224/48 , H01L2924/00012
摘要： PURPOSE:To obtain the stable bonding characteristics by supplying the wire directly to a wire pressing plane through the wire guiding hole opened on side plane of the wedge to limit the play of the wire to the utmost. CONSTITUTION:An inlet 23a of a wire guiding hole 23 is located on a body of a wedge 21 and an outlet 23b is on a wire pressing plane 22. These openings 23a and 23b are connected straight so that a front end of a wire 24 inserted from the inlet 23a comes out from the outlet 23b instantly through a blind hole 23c. The wire guiding hole opened on the wedge body is extended to the wire pressing plane arranged at the wedge end. Thus the wire can be held by the position substantially close to its front end while reducing the play.
摘要翻译：目的：为了通过在楔形件的侧面开口的导线孔将线材直接供给到电线按压平面来获得稳定的接合特性，以最大限度地限制电线的播放。构成：线引导孔23的入口23a位于楔21的主体上，出口23b在线压平面22上。这些开口23a和23b直线连接，使得线24的前端插入从入口23a通过盲孔23c立即从出口23b出来。在楔体上打开的导丝孔延伸到布置在楔形端的线挤压平面。因此，线可以被基本上靠近其前端的位置保持，同时减少游隙。

14. 发明专利

JPS5968297A Marking method of molded article 失效
标题翻译：模制品的标记方法
公开(公告)号：JPS5968297A
公开(公告)日：1984-04-18
申请号：JP17766782
申请日：1982-10-12
申请人： Hitachi Ltd
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： B41F17/36 , B41M5/26 , B41M5/327 , H01L21/02 , H01L23/00
CPC分类号： B41M5/267 , H01L2223/54406 , H01L2223/54486
摘要： PURPOSE:To provide an easily visible mark on a surface of a molded article with favorable productivity, by a method wherein capsules containing a coloring matter are incorporated into a material for a molded article, and after molding, the surface of the molded article is irradiated with energy to break capsule films. CONSTITUTION:The capsules 2 each of which has a coloring matter 3 such as a pigment or a dye sealed in the film 4 are mixed into a resin which is a molding material for obtaining the molded article 1. The film 4 has the same color as that of the resin, so that the capsules mixed in the resin can not be distinguished from the resin. The resin containing the capsules 2 is molded by a transfer molding method or the like, for example to produce a non-airtight sealed package of a semiconductor device, and then the molded article 1 is irradiated with laser light 6 through a mask 8 and a lens 10. Accordingly, a projected image analogous to a pattern 9 formed in the mask 8 is produced on the surface of the article 1, whereby the films 4 of the capsules 2 contained in the resin are broken, the coloring matter 3 is exposed to produce the mark 5.
摘要翻译：目的：为了在成型品的表面上以良好的生产率提供容易看到的痕迹，通过将含有着色剂的胶囊并入成型品的材料中的方法，在成型后，照射成型品的表面有能量打破胶囊膜。构成：将具有密封在膜4中的着色剂3（例如颜料或染料）的胶囊2混合成为用于获得成型品1的成型材料的树脂。膜4具有与使树脂中混合的胶囊不能与树脂区分开。含有胶囊2的树脂通过传递模塑法等进行模制，例如制备半导体装置的非气密密封包装，然后通过掩模8和模制品1照射模制品1 因此，在物品1的表面上产生类似于在掩模8中形成的图案9的投影图像，由此包含在树脂中的胶囊2的膜4被破坏，着色剂3暴露于产生标记5。

15. 发明专利

JPS5919344A 2-field optical device 失效
标题翻译：双场光学器件
公开(公告)号：JPS5919344A
公开(公告)日：1984-01-31
申请号：JP12754282
申请日：1982-07-23
申请人： Hitachi Ltd
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/68 , H01L21/60
摘要： PURPOSE:To recognize wide and narrow fields with one image pickup unit by aligning in parallel wide and narrow field optical systems along the optical axis of the image pickup unit and providing a movable mirror between the both systems. CONSTITUTION:Wide and narrow field optical systems 12, 13 are aligned in parallel along the optical axis of an image pickup unit 11, and a movable mirror 16 is provided between the systems 12 and 13. When the mirror 16 is rotated at the position parallel to the optical axis x1, the reflected light from an object 10 propagtes linearly into the system 12 as it is, passes through a half mirror 17 to reach the unit 11, thereby observing the image in wide field. When the mirror 16 is rotated at 45 deg. to the optical axis x1, the image is observed in narrow field.
摘要翻译：目的：利用一个摄像单元来识别宽和窄的场，通过沿着图像拾取单元的光轴并行的宽和窄场光学系统进行对准，并在两个系统之间提供可移动镜。构成：宽和窄场光学系统12,13沿着图像拾取单元11的光轴对准，并且可移动反射镜16设置在系统12和13之间。当反射镜16在平行的位置旋转时对于光轴x1，来自物体10的反射光直接传播到系统12中，通过半透半反镜17到达单元11，从而在宽视野中观察图像。当镜子16旋转45度时。到光轴x1，在窄场中观察图像。

16. 发明专利

JPS5917172A Contact socket for inspection 失效
标题翻译：联系插座进行检查
公开(公告)号：JPS5917172A
公开(公告)日：1984-01-28
申请号：JP12570882
申请日：1982-07-21
申请人： Hitachi Ltd
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： G01R31/26 , G01R1/04
CPC分类号： G01R1/0433
摘要： PURPOSE:To obtain a socket for inspection which allows the secure and easy inspection of a semiconductor device having numbers of external leads by providing even a cover-side socket board with a contact part for connecting with external leads of the semiconductor device. CONSTITUTION:Contact pins 4 for connecting with the external leads 2 of the semiconductor device 1 are provided to a socket board 3 on a main body side. Further, contact pins 9 in zigzag array relation with those pins 4 are provided to the cover-side socket board 7. Therefore, the device 1 is inserted in the board 3 and the board 7 is rotated around a shaft 6 and clamped with a lock lever 5 to connect the leads 2 to the pins 4 and 9, obtaining the socket for inspection which allows the secure and easy inspection of the semiconductor device having numbers of external leads.
摘要翻译：目的：为了获得用于检查的插座，通过提供具有用于与半导体器件的外部引线连接的接触部分的盖侧插座板，可以安全且容易地检查具有多个外部引线的半导体器件。构成：将与半导体装置1的外部引线2连接的接触引脚4设置在主体侧的插座基板3上。此外，与盖板侧插座板7设置有与销钉4以锯齿形排列关系的接触销9.因此，装置1插入板3中，并且板7围绕轴6旋转并且被锁定杆5将引线2连接到销4和9，获得用于检查的插座，其允许对具有多个外部引线的半导体器件的安全和容易的检查。

17. 发明专利

JPS58161334A WIRE BONDING DEVICE 失效
公开(公告)号：JPS58161334A
公开(公告)日：1983-09-24
申请号：JP4259882
申请日：1982-03-19
申请人： HITACHI LTD , HITACHI OME ELECTRONIC CO
发明人： FUJIOKA SHIYUNICHIROU , MORITA OSAMU
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To increase the strength of bonding and improve the reliability by additionally providing an ultrasonic vibrator for vibration so that vibration applied to a bonding tool works in the two directions of a plane and controlling the wire bonding device. CONSTITUTION:An ultrasonic vibrator 3' is fitted on one extension of a bonding axis in addition to the ultrasonic vibrator 3 fitted to a horn 4, and both vibrators 3, 3' are controlled synchronously so that a bonding ball 5 draws loci of vibration 10 in the two directions of the plane. That is, composite vibration is rounded. Accordingly, since the ball 5 draws optimum loci of vibration 10, the ball after bonding takes a circle, and the strength and reliability of each bonding are made constant at all times.

18. 发明专利

JPS58143540A WIRE BONDING DEVICE 失效
公开(公告)号：JPS58143540A
公开(公告)日：1983-08-26
申请号：JP2596582
申请日：1982-02-22
申请人： HITACHI LTD , HITACHI OME ELECTRONIC CO
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/603 , H01L21/60
摘要： PURPOSE:To prevent the cooling of a ball under formation, and to obtain an excellent globular shape by previously heating an atmospheric gas used for a discharge section. CONSTITUTION:A tip section and an electrode 6 are set up internally to a torch tube 5, the torch tube 5 is communicated with the source of the atmospheric gas 7 consisting of an inert gas such as argon on the left side of the figure, a heaer 8 is mounted at a position on the stream side upper than the tip section of a wire 1, and the atmospheric gas 7 is flowed properly so as to pass through the heater 8 and is in contact with the wire 1. Consequently, the atmospheric gas 7 flowing in the torch tube 5 is heated at the high temperature of several hundred degrees until it reaches the wire 1, thus bringing the atmosphere of the ball to a high-temperature one. Accordingly, the ball 3 under formation by discharge is not cooled by the flow of the atmospheric gas, and the extremely excellent spherical ball is obtained.

19. 发明专利

JPS55166932A PELLET POSITIONING MECHANISM 失效
公开(公告)号：JPS55166932A
公开(公告)日：1980-12-26
申请号：JP7467979
申请日：1979-06-15
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU
IPC分类号： H01L21/677 , H01L21/58 , H01L21/68
摘要： PURPOSE:To obtain a precise and secure positioning when performing a bonding by holding the corner section of the upper periphery of a pellet with the V-type grooves located at the point of a pair of positioning nails and then by performing positioning of the pellet using the positioning hole of a reversed guadrangular pyramid type cavity. CONSTITUTION:A pair of positioning nails 7, having a V-shaped groove 6 at the point approaching each other on a supporting base 5, is provided. At the approaching center section of the nails, a positioning hole 11, which roughly determines the position directional property of the pellet 2, is provided. The positioning hole 11 is a cavity with a reversed quadrangular pyramid shape which depth is less than the thickness of the pellet, it has a flat bottom and a hole 12 is provided for vacuum adhorption. As a result, the pellet 2 brought on the supporting base 5 is put in the positioning hole 11 and a coarse positioning is performed, and in order to have a precise and secure positioning with a pair of positioning nails, the feeding of the pellet to a collet is performed precisely and securely, thereby preventing a bonding miss and a pellet damage as well as enabling to perform an automation easily.

20. 发明专利

JPS55140248A METHOD OF PACKAGING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS55140248A
公开(公告)日：1980-11-01
申请号：JP4796279
申请日：1979-04-20
申请人： HITACHI LTD
发明人： FUJIOKA SHIYUNICHIROU , UEMATSU SHIYUNEI
IPC分类号： H01L23/02 , H01L23/057 , H01L23/50
摘要： PURPOSE:To prevent occurrence of improper package of a semiconductor device by bonding the flat portion between a package base and a frame with glass, bending the lead wire by utilizing the adhering strength and an auxiliary pressing force by a jig and attaching a cover thereon. CONSTITUTION:A flat frame 3 is mounted on a package base 2 secured with a semiconductor pellet 1 thereto and connected to a wire 4. A lead wire 5 is secured via a jig 6 by utilizing the adhering strength of the frame 3 to the base 2 and bent in predetermined shape. According to this method, the package base 2 can be effectively isolated from the frame 3. A cover 3 is finally coated thereon.

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