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11. 发明专利

JP2005334955A Solder alloy and solder ball 有权
标题翻译：焊接合金和焊球
公开(公告)号：JP2005334955A
公开(公告)日：2005-12-08
申请号：JP2004159208
申请日：2004-05-28
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy with which the strength of a joint boundary can be improved without damaging the fundamental mechanical properties and wettability of the conventional solder alloy, and to provide a solder ball.
SOLUTION: The solder alloy has a composition containing, by mass, 0.1 to
摘要翻译：要解决的问题：提供一种无铅焊料合金，其可以改善接头边界的强度而不损害常规焊料合金的基本机械性能和润湿性，并提供焊球。解决方案：焊料合金具有质量分数为0.1〜1.0％Ag，≤0.2％Ge，余量为不可避免的杂质。或者，焊料合金具有含有0.1〜1.0％Ag，0.1〜10％In，≤0.2％Ge，余量为不可避免的杂质的组成。焊料合金可以含有选自Fe，Ni，Co，Ru，Al，P和Ga中的一种或多种元素，总共≤0.1％。并且，提供具有上述组成成分的焊球。版权所有（C）2006，JPO＆NCIPI

12. 发明专利

JP2004031771A Solder junction 审中-公开
公开(公告)号：JP2004031771A
公开(公告)日：2004-01-29
申请号：JP2002187792
申请日：2002-06-27
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/26 , C22C13/00 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder junction having joined strength for suppressing breakage of a Cu
6 Sn
5 phase formed in soldering electronic components or the like.
SOLUTION: In the solder junction formed on a Cu electrode, the Cu
6 Sn
5 phase formed on a junction interface between the Cu electrode and an Sn-based solder part has an average particle diameter D of D≤2.0 μm in a horizontal face to the Cu electrode. The average particle diameter D is preferably 1.0 μm≤D≤2.0 μm. The Sn-based solder part contains at least one kind of Ag of 0.1 mass% or more and 5 mass% or less and Cu of 0.1 mass% or more and 5 mass% or less, and preferably the balance is substantially composed of Sn.
COPYRIGHT: (C)2004,JPO

13. 发明专利

JP2003041398A Dummy ball for electrolytic plating 审中-公开
标题翻译：用于电镀的DUMMY球
公开(公告)号：JP2003041398A
公开(公告)日：2003-02-13
申请号：JP2001229604
申请日：2001-07-30
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KUBOI TAKESHI , SATO KOJI , DATE MASAYOSHI
IPC分类号： B22D21/00 , B22D25/02 , B22D27/04 , B22F1/00 , B22F9/08 , C25D17/16
摘要： PROBLEM TO BE SOLVED: To provide a dummy ball necessary for forming an external electrode of an electronic component, superior in uniformity of plated film thickness.
SOLUTION: The dummy ball for electrolytic plating, which connects a conductor part of an article to be plated, with one electrode, in a plating solution, has 0.98 or higher of the average value of sphericity in 1,000 dummy balls, and includes 1% or less of dummy balls having sphericity of 0.9 or less.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供形成电子部件的外部电极所需的虚拟球，镀膜厚度的均匀性优异。解决方案：将电镀液的导体部分与一个电极连接在电镀液中的电解电镀用虚拟球具有1000个假球的球形度的平均值的0.98以上，并且包括1％或较少的球形度为0.9以下的虚拟球。

14. 发明专利

JP2014031575A Steel for high hardness cold die and manufacturing method thereof 审中-公开
标题翻译：用于高硬度冷却钢的钢及其制造方法
公开(公告)号：JP2014031575A
公开(公告)日：2014-02-20
申请号：JP2013139745
申请日：2013-07-03
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , SHOJI TATSUYA , FUKUMARU MARIKO , MORISHITA KANA , INOUE KENICHI
IPC分类号： C22C38/00 , B21D37/01 , C21D6/00 , C22C38/60
摘要： PROBLEM TO BE SOLVED: To provide a steel for a cold die providing high hardness of 58 HRC or more, further 60 HRC or more and excellent in machinability and to provide its manufacturing method.SOLUTION: A steel for a high hardness cold die contains, by mass%, C:0.6 to 1.2%, Si:2.5% or less, Mn:2.0% or less, P:0.10% or less, S:0.02 to 0.1%, Cr:3.0 to 9.0%, Mo and W independently or in combination by (Mo+1/2W):1.2% or less, Nb and V independently or in combination by (Nb+1/2V):0.1 to 1.0%, Al:0.04 to less than 0.3% and the balance Fe with inevitable impurities, and has an area ratio of a primary carbide in a sectional structure of 3 to 6% and a hardness of 58 HRC or more. A method of manufacturing the steel for the high hardness cold die includes conducting a temper treatment at 450°C or higher after a quenching treatment of the steel containing a component composition described above to adjust hardness to 58 HRC or more.
摘要翻译：要解决的问题：提供一种用于冷却模具的钢，其提供58HRC或更高的高硬度，进一步为60HRC或更高，并且具有优异的机械加工性并提供其制造方法。解决方案：用于高硬度冷模的钢包含，以质量％计，C：0.6〜1.2％，Si：2.5％以下，Mn：2.0％以下，P：0.10％以下，S：0.02〜0.1％，Cr：3.0〜9.0％（Mo + 1 / 2W）：1.2％以下，Nb和V分别独立地或组合使用（Nb + 1 / 2V）：0.1〜1.0％，Al：0.04〜小于0.3％，余量为Fe 具有不可避免的杂质，并且具有截面结构为3〜6％，硬度为58HRC以上的一次碳化物的面积率。制造高硬度冷模具用钢的方法包括在对含有上述成分组合物的钢进行淬火处理后，在450℃以上进行回火处理，将硬度调节至58HRC以上。

15. 发明专利

JP2009248156A Solder ball, solder layer, solder bump, and method for forming the same 有权
标题翻译：焊球，焊接层，焊接块及其形成方法
公开(公告)号：JP2009248156A
公开(公告)日：2009-10-29
申请号：JP2008100769
申请日：2008-04-08
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： KAWADA TSUNEHIRO , DATE MASAYOSHI , UEMATSU SHIGEHARU
IPC分类号： B23K35/26 , B23K1/00 , B23K101/40 , C22C13/00 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide solder balls composed mostly of Sn with Ag and Cu added, which solve such problems caused by discoloration at the time of soldering such as the poor loading ratio of the solder balls, and defects in determining damaged solder bumps, measuring solder bump height and visual inspection of the solder bumps.
SOLUTION: A solder ball 1 which has an amorphous oxide layer 1a formed by natural oxidation and of which the surface yellowing degree is a given value or less is loaded on a semiconductor package 3 or circuit board 4 having electrode terminals 3a and 4a and is heated so as to be melted. This breaks the amorphous oxide layer 1a and a crystalline oxide layer 2a formed by the heating so that a solder bump 2 which is a projection is formed and connected to the electrode terminals 3a and 4a with solder 1b melted in the solder ball.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供主要由Sn组成的焊料球，添加了Ag和Cu，解决了焊接时变色引起的问题，如焊球负载率差，确定损坏的缺陷焊料凸块，测量焊料凸块高度和焊点的目视检查。解决方案：具有由自然氧化形成的表面黄变度为一定值以下的无定形氧化物层1a的焊球1装载在具有电极端子3a和4a的半导体封装3或电路板4上并被加热以便熔化。这使得非晶氧化物层1a和通过加热形成的结晶氧化物层2a形成，从而形成作为突起的焊料凸块2，并且其中焊料1b在焊料球中熔化而与电极端子3a和4a连接。版权所有（C）2010，JPO＆INPIT

16. 发明专利

JP2005040847A Manufacturing method of solder bowl 审中-公开
标题翻译：焊枪的制造方法
公开(公告)号：JP2005040847A
公开(公告)日：2005-02-17
申请号：JP2003279882
申请日：2003-07-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： SHOJI TATSUYA , DATE MASAYOSHI , SATO KOJI
IPC分类号： B23K35/40 , B23K35/26
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of solder ball which enables an efficient and stable addition of minor additional elements to increase reliability of solder bonding interface.
SOLUTION: A study result on a method for minute addition of Fe, Ni and Co, which are elements capable of controlling intermetallic compound formation during soldering, shows that homogenous addition is possible if a molten solder alloy containing minute amounts of Fe, Ni and Co is dripped and the drop is solidified in a spheric shape, and that even very minute amounts of Fe, Ni and Co can bring sufficient effects. Therefore, in the manufacturing method of the solder ball, the molten solder alloy containing Sn as a main component and one or more kinds of elements among Fe, Ni and Co of 20-500 ppm in total is dripped and the liquid drop is solidified into the spheric shape.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种焊球的制造方法，其能够有效且稳定地添加次要的附加元件以增加焊接界面的可靠性。
解决方案：对于在焊接期间能够控制金属间化合物形成的元素的Fe，Ni和Co微量添加方法的研究结果表明，如果含有微量Fe， Ni和Co被滴落，并且液滴以球形固化，并且甚至非常微量的Fe，Ni和Co可以产生足够的效果。因此，在焊锡球的制造方法中，以Sn为主成分的熔融焊料合金和总计20〜500ppm的Fe，Ni，Co中的一种以上的元素滴加，液滴固化为球形。版权所有（C）2005，JPO＆NCIPI

17. 发明专利

JP2003328195A Dummy ball for barrel plating 审中-公开
标题翻译：用于棒球场的DUMMY球
公开(公告)号：JP2003328195A
公开(公告)日：2003-11-19
申请号：JP2002141121
申请日：2002-05-16
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , SHOJI TATSUYA
IPC分类号： C25D7/00 , C25D17/16
摘要： PROBLEM TO BE SOLVED: To provide dummy balls for barrel plating which hardly cause contamination in a plating bath, have reduced deformation caused by collision and are used, e.g. when an external electrode is formed on the surface of electronic parts by electroplating.
SOLUTION: The dummy balls for barrel plating consist of metallic balls with Cu as a major component. As for the metal with Cu as a major component, metal containing Ni, P, Sn, Al, Si or the like to such a degree that the plating bath is not contaminated can be used for increasing their hardness compared with a Cu simple substance. The alloy based balls are advantageous to the elongation of the lives of the dummy balls and the stabilization of the thickness of a terminal plating film.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供几乎不会在电镀槽中引起污染的滚镀的虚拟球，具有减少由碰撞引起的变形，并且例如使用。当通过电镀在电子部件的表面上形成外部电极时。
解决方案：用于滚镀的虚拟球由以Cu为主要成分的金属球组成。对于以Cu为主要成分的金属，与Cu单体相比，可以使用含有Ni，P，Sn，Al，Si等的金属，以使电镀浴未被污染的程度提高其硬度。合金基球对于虚拟球的寿命的延长和端子电镀膜的厚度的稳定是有利的。版权所有（C）2004，JPO

18. 发明专利

JP2009078299A Solder alloy, solder ball using it, and soldered part excellent in drop impact resistance 有权
标题翻译：焊接合金，使用其的焊球，以及焊接部件优良的耐冲击性
公开(公告)号：JP2009078299A
公开(公告)日：2009-04-16
申请号：JP2008080909
申请日：2008-03-26
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , WAKANO MOTOKI
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder alloy, a solder ball and a soldered part which satisfy requirements for melting points and mechanical strength and also are excellent in drop impact resistance. SOLUTION: The invented solder alloy contains 0.1-2.0 mass% Ag, 0.05-2.0 mass% Zn, and the balance being Sn and inevitable impurities and is excellent in drop impact resistance. The invented solder ball is formed by spheroidizing the solder alloy. The soldered part is formed by connecting the solder alloy and solder ball to an Ni electrode. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供满足熔点和机械强度要求的焊料合金，焊球和焊接部件，并且耐滴落冲击性优异。解决方案：本发明的焊料合金含有0.1-2.0质量％的Ag，0.05-2.0质量％的Zn，余量为Sn和不可避免的杂质，并且具有优异的耐滴落冲击性。本发明的焊球通过球化焊料合金形成。焊接部分通过将焊料合金和焊球连接到Ni电极而形成。版权所有（C）2009，JPO＆INPIT

19. 发明专利

JP2007222939A Brazing filler metal sheet, its production method, and package for electronic parts 审中-公开
标题翻译：制动填充金属片，其制造方法和电子零件包装
公开(公告)号：JP2007222939A
公开(公告)日：2007-09-06
申请号：JP2006229354
申请日：2006-08-25
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： TANAKA SHIGENORI , DATE MASAYOSHI , CHIWATA NOBUHIKO
IPC分类号： B23K35/30 , B23K1/00 , B23K35/40 , B23K101/40 , C22C5/08 , H01L21/52 , H05K3/34
CPC分类号： H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a Pb-free new brazing filler metal sheet in which the problems on thermal damage caused by the increase of joining temperature and the reduction in heat radiability due to a gap caused in a joint are solved, to provide its production method, and to provide a package for electronic parts. SOLUTION: The brazing filler metal sheet has a metal layer composed of an In layer or an In alloy layer on the surface of a foil material of Ag, Cu or an Ag-Cu alloy. Preferably, the average thickness of the foil material of Ag, Cu or an Ag-Cu alloy is 20 to 200 μm, and, the average thickness of the In layer is 10 to 30 μm. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种无铅的新的钎焊料金属片，其中解决了由于接合温度的升高引起的热损伤问题和由于接头引起的间隙引起的热辐射性的降低，提供其生产方法，并提供电子零件包装。解决方案：钎料金属片具有由Ag，Cu或Ag-Cu合金的箔材料的表面上的In层或In合金层构成的金属层。优选地，Ag，Cu或Ag-Cu合金的箔材的平均厚度为20〜200μm，In层的平均厚度为10〜30μm。版权所有（C）2007，JPO＆INPIT

20. 发明专利

JP2007160401A Solder alloy, solder ball, and solder joint using the same 审中-公开
标题翻译：焊接合金，焊球和焊接接头
公开(公告)号：JP2007160401A
公开(公告)日：2007-06-28
申请号：JP2006300629
申请日：2006-11-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： DATE MASAYOSHI , FUJIYOSHI MASARU
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3436 , H05K3/3463
摘要： PROBLEM TO BE SOLVED: To solve problems such as a bad surface texture of a Sn-Cu alloy which leads to judgement of failure in visual examination and failure in mounting of solder balls, to provide a lead-free solder alloy, which is excellent in drop impact strength and suppresses a decrease in joint strength in high-temperature environment, a solder ball, and a solder joint.
SOLUTION: The invention provides a solder alloy consisting of, by mass%: 0.6 to 0.75% of Cu; 0.3 to 1.5% of Ag; more than 0.01% but not more than 0.1% of Ge; and the balance being Sn with inevitable impurities. Preferably, the solder alloy contains 0.5 to 1% of Ag by mass%. Further preferably, the solder alloy contains more than 0.01% but not more than 0.06% Ge by mass%. More preferably, the solder alloy is spherically formed into a solder ball. The invention also provides a solder joint, in which the solder alloy is joined to a Ni electrode.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了解决Sn-Cu合金的表面质地不良的问题，导致目视检查失败和焊球安装失败的判断，提供无铅焊料合金，其中具有优异的落下冲击强度，并抑制高温环境下的接合强度降低，焊球和焊点。解决方案：本发明提供一种焊料合金，以质量％计：0.6〜0.75％的Cu; 0.3〜1.5％的Ag; 大于0.01％但不超过0.1％的Ge; 其余为Sn与不可避免的杂质。优选地，焊料合金含有按质量％计含有0.5〜1％的Ag。进一步优选地，焊料合金含有以质量％计超过0.01％但不超过0.06％的Ge。更优选地，焊料合金球形地形成为焊球。本发明还提供一种焊接接头，其中焊料合金与Ni电极接合。版权所有（C）2007，JPO＆INPIT

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