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    • 13. 发明专利
    • SOLDER JOINTING METHOD OF INK JET PRINT HEAD
    • JPH09164692A
    • 1997-06-24
    • JP32670395
    • 1995-12-15
    • HITACHI KOKI KK
    • WATANABE KEIJITAMAHASHI KUNIHIRO
    • B41J2/16B41J2/015
    • PROBLEM TO BE SOLVED: To form a uniform thickness, reduce absorbing gas, and heighten adhesion to a ground by using a solder-clad cladding material for a joint surface of a thin plate, and layering it so as to joint. SOLUTION: A joint surface of a thin plate which forms an ink passage of an ink jet head is formed by layering and jointing a cladding material whose surface is directly clad with a solder 5. In a method for cladding the thin plate with the solder 5, the melted solder 5 is laid on the surface of the thin plate activated by a flux, and cooled. Next, these are positioned and temporarily fixed by spot welding with an orifice plate 1 of the thin plate, a restrictor plate 2, a diaphragm plate 3, and a filter plate 4 in this order. It is heated in a vacuum furnace, loaded with welding force, and heated to a predetermined temperature. Thereafter, it is held for a predetermine time and cooled. The clad solder on the thin plate has one or more layer. After jointing, for a composition of the solder layer, any base of In-Sn, Pb-Sn, Au-Sn, Ag-Sn, and Sn is used as a main component.