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11. 发明专利

JPS52115185A VAPOR PHASE GROWING APPARATUS 失效
公开(公告)号：JPS52115185A
公开(公告)日：1977-09-27
申请号：JP3121876
申请日：1976-03-24
申请人： HITACHI LTD
发明人： AKIBA MASAKUNI , SUZUKI JIYUN , NAGATOMO HIROTO , MISONOO YUKIO
IPC分类号： H01L21/205 , H01L21/31 , H01L21/48
摘要： PURPOSE:To reduce the number of steps and the variation of grown film thicknesses and increase yield by integrally composing a mechanism for transporting semiconductor wafers, a cleaning mechanism as well as a mechanism for vapor phase growing and a mechanism for observing the growth.

12. 发明专利

JPS60122359A OPTICAL INSPECTING DEVICE 失效
公开(公告)号：JPS60122359A
公开(公告)日：1985-06-29
申请号：JP13715784
申请日：1984-07-04
申请人： HITACHI LTD
发明人： AKIBA MASAKUNI , NAGATOMO HIROTO , SUZUKI JIYUN
IPC分类号： G01N21/88 , G01N21/94 , G01N21/956
摘要： PURPOSE:To detect a foreign matter pattern automatically by irradiating a rotatable plate body to be inspected with light and detecting its reflected light through a polarizing plate. CONSTITUTION:A semiconductor wafer 21 to be inspected is rotated together with a mount table 4 and the wafer 21 and polarizing plate 8 varies in relative position relation to allow the polarizing plate 8 to cut off the reflected light of only a horizontal wave polarized in a specific direction by the etched surface A of the wafer 21 with a specific tilt angle by the irradiation of parallel laser luminous flux from a light source 7. Unpolarized light as the major part of the reflected light from a foreign matter surface B is not cut off by the polarizing plate 8 at the relative positions of the polarizing plate 8 and wafer 21, but photodetected by a photoelectric converter 15 to detect the foreign matter pattern automatically.

13. 发明专利

JPS5870527A ALIGNER 失效
公开(公告)号：JPS5870527A
公开(公告)日：1983-04-27
申请号：JP16870281
申请日：1981-10-23
申请人： HITACHI LTD
发明人： MAEJIMA HIROSHI , SUZUKI JIYUN , NAGATOMO HIROTO , NISHIZUKA HIROSHI
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30 , H01L21/68
摘要： PURPOSE:To prevent damage to a photoresist when a wafer surface is pressed to a leveling pad and to improve the accuracy of an aligner by a method wherein a surface material softer than a photoresist is coated on the surface of a globular or flat plane leveling pad. CONSTITUTION:A wafer 1 applied a photoresist 5 on the surface is horizontally supported by a wafer chuck 2 to permit up and down movement and oscillating motion by an external structure not shown in a drawing. A leveling pad 6 is projected and provided at the lower side of a supporting arm 7 provided at an aligner fixed section. Three pads 6 are positioned at the circumferential direction of the surface section of a wafer 1 to agree the planes connecting respective tip positions at the semiglobular tip sections 6a with a reference plane. Specular finish is done to the surface of the semiglobular base section 8 and a surface material 9 softer than the resist 5 is coated on the surface and furthermore, innumerable near-circular recessed sections 10 are formed on the surface. Damage to the resist 5 occurred when the pads 6 are pressed to the surface of the wafer 1 is prevented.

14. 发明专利

JPS5599739A WAFER TREATING METHOD AND ITS EQUIPMENT 失效
公开(公告)号：JPS5599739A
公开(公告)日：1980-07-30
申请号：JP713379
申请日：1979-01-26
申请人： HITACHI LTD
发明人： NAGATOMO HIROTO , TAKAGAKI TETSUYA , SEKI HISAO , TERASAKI SHIROU , SUZUKI JIYUN , HORIMUKI HITOSHI
IPC分类号： H01L21/677 , H01L21/22 , H01L21/306 , H01L21/67 , H01L21/68
摘要： PURPOSE:To miniaturize the equipment, as well to improve working efficiency, by a mechanism wherein loading is made by cartridge unit, surface treatment is made by piece, heat treatment is made by batch and automatizing all works concerned. CONSTITUTION:Wafers are picked up piece by piece from cartridge which contains wafers in plurality and are surface treated in a form of individual treatment, and surface treated wafers are put side by side on heat treatment jig in plurality and after this, the heat tretment jig is set into heat treatment equipment and thus, wafers are performed heat treatment in a form of batch treatment, then jig is taken out and wafers are transferred into vacant cartridge and are carry-out.

15. 发明专利

JPS54101390A FOREIGN MATTER INSPECTOR 失效
公开(公告)号：JPS54101390A
公开(公告)日：1979-08-09
申请号：JP727778
申请日：1978-01-27
申请人： HITACHI LTD
发明人： AKIBA MASAKUNI , NAGATOMO HIROTO , SUZUKI JIYUN
IPC分类号： H01L21/66 , G01B11/30 , G01N21/21 , G01N21/88 , G01N21/94 , G01N21/95 , G01N21/956
摘要： PURPOSE:To discriminate foregin matter rapidly and automatically by radiating parallel rays to the object under inspection from its side faces and detecting the reflected light through a polarizing plate. CONSTITUTION:For example, the semiconductor wafer in a cartridge 2 is trnsferred onto a rest table 4 and is fixed at its central part. The laser rays of a parallel ray generator 7 are then radiated parallel to the wafer surface from the side face of the semiconductor wafer 21. While the rest table 4 is being rotated, the reflected light is detected through a photoelectric transducer 15 and the sizes and number of foreign matter are detected based on the reflected light in the state where a polarizing plate 8 is installed at such a rotating angle at which the polarized light is cut by the polarizing plate 8 and only the non-polarized light may be detected. Since the inspection of the reflected light is accomplished by magnifying the wafer surfaces with the lenses 9, 10, 13, the field of view is narrow and therefore the detecting part is moved by moving the rest table 4 with feed driving parts 5, 6 relatively to the light detecting system consisting of the lenses 9, 10, etc., whereby the semiconductor wafer is completely inspected over its entire surface.

16. 发明专利

JPS5447576A PLASMA CVD APPARATUS 失效
公开(公告)号：JPS5447576A
公开(公告)日：1979-04-14
申请号：JP11336277
申请日：1977-09-22
申请人： HITACHI LTD
发明人： AKIBA MASAKUNI , NAGATOMO HIROTO , SUZUKI JIYUN , YOSHIMI TAKEO
IPC分类号： C23C16/50 , H01L21/205 , H01L21/31 , H01L21/56
摘要： PURPOSE:To avert flake deposition on the work by making a table for placing on and fixing of the work such as semiconductor wafer 180{754D 12 C invertable and performing plasma CVD in the state where the work fixing face is faced downward. CONSTITUTION:After a bell-jar body 1 is lowered down to a specified position by reverse-rotating a guide post 16 constituting a CVD apparatus, an inverting motor 40 is run forward to turn a jell-jar cover body 21 180 deg.C, bringing the wafer mounting face of a table 34 upward. Next, a wafer 33 is fixed thereto by means of a pin 42 and a lever 43 and the motor 40 is run backward to turn the cover 21 180 deg.C, bringing the wafer mounting face downward. Thereafter, the body 1 is ascended by reverse-rotating the guide post 16to be integrated with the cover body 21 positioned upward. Next, the table 34 and wafer 35 are heated with a heater 35, and the inside is evacuated by using an exhaust pipe 13, thence SiH4, NH3, N2 gases are fed through a nozzle 11. After these, the table 34 is rotated at a low speed by a motor 30 and plasma is produced between the table 34 and ectrode 2.

17. 发明专利

JPS52150978A MOUNTING POSITION GOODNESS OR BANDNESS IDENTIFICATION METHOD OF MOUNTED PART S 失效
公开(公告)号：JPS52150978A
公开(公告)日：1977-12-15
申请号：JP6767476
申请日：1976-06-11
申请人： HITACHI LTD
发明人： SUZUKI JIYUN , IMATA TSUTOMU
IPC分类号： H01L21/68 , H01L21/60 , H01L21/66
摘要： PURPOSE:To identify whether the mounting of a pellet is good or not from the quantity of light detected by a slit group by using one of bonding pads on the pellet as a detecting mark, disposing a reference plate having slits of the same pattern as that of the detection part over said mark and detecting the light reflected form the mark through the slit group.

18. 发明专利

JPS52143756A PRODUCTION OF THIN SEMICONDUCTOR PLATES 失效
公开(公告)号：JPS52143756A
公开(公告)日：1977-11-30
申请号：JP6002076
申请日：1976-05-26
申请人： HITACHI LTD
发明人： MAEJIMA HIROSHI , NAGATOMO HIROTO , SUZUKI JIYUN
IPC分类号： C30B15/34 , H01L21/208
摘要： PURPOSE:To perform controlling of plate thickness by supplying semiconductor powder to a crucible provided in a pressured vessel, extruding the material in a molten state to make a thin plate and locally melting the thin plate through zone melting.

19. 发明专利

JPS52139378A INTEGRATED TREATMENT APPARATUS FOR SEMICONDUCTOR WAFERS 失效
公开(公告)号：JPS52139378A
公开(公告)日：1977-11-21
申请号：JP5537376
申请日：1976-05-17
申请人： HITACHI LTD
发明人： NAGATOMO HIROTO , SUZUKI JIYUN , MAEJIMA HIROSHI , KANETANI MUTSUYO , OKUDA RIYOUICHI , TAKAGAKI TETSUYA
IPC分类号： H01L21/677 , H01L21/205 , H01L21/22 , H01L21/30 , H01L21/304 , H01L21/50
摘要： PURPOSE:To obviate human intervening and at the same time make the entire apparatus compact by integrating and automating all the treating works, setting of treating conditions and control within control processes of diffusion process in particular.

20. 发明专利

JPS5227367A PHOTO RESIST PROCESSING APPARATUS 失效
公开(公告)号：JPS5227367A
公开(公告)日：1977-03-01
申请号：JP10297175
申请日：1975-08-27
申请人： HITACHI LTD
发明人： SUZUKI JIYUN , MAEJIMA HIROSHI , NAGATOMO HIROTO , KANETANI MUTSUYO
IPC分类号： H01L21/027 , G03F7/26 , H01L21/30 , H01L21/302
摘要： PURPOSE:To obtain a photo resist processing equipment, through which stabilized and consistent processing can be ensured, continuous processing for different lots of various types is possible, and good yield is secured for photo resist processing.

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