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11. 发明专利

JP2002009199A TAPE CARRIER FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002009199A
公开(公告)日：2002-01-11
申请号：JP2001155724
申请日：2001-05-24
申请人： HITACHI CABLE , HITACHI LTD
发明人： TAGA KATSUTOSHI , OKABE NORIO , KAMEYAMA YASUHARU , ONDA MAMORU , ANJO ICHIRO
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To solve the problem that a soldering ball does not contact a land, soldering wetting inferiority occurs, voids are produced in an opening and soldering is not contacted on the land when the diameter of the opening provided on the land part of an insulation film is reduced for fine pitches. SOLUTION: A tape carrier for a semiconductor device is provided with the insulation film 101 and a land for ball formation 103 formed on at least one side of the insulation film 101 and exposed to the other face of the insulation film 101 through the opening 101a provided on the insulation film 101. A conductor layer 105 for shallowing the inside of the opening 101a is provided on only a part exposing the land for soldering ball formation 103 in prescribed thickness.

12. 发明专利

JP2001107001A ADHESIVE MATERIAL IN FORM OF FILM, WIRING TAPE AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001107001A
公开(公告)日：2001-04-17
申请号：JP28497699
申请日：1999-10-06
申请人： HITACHI CABLE , HITACHI LTD
发明人： ONDA MAMORU , ITO RYOICHI , SATO TOSHIYA , TSUYUNO ENJIYOU
IPC分类号： H01L23/12 , C08G59/40 , C09J7/02 , C09J109/02 , C09J113/00 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive material in the form of a film and a wiring tape which have high bonding strength and are tack-free and excel in workability, and a semiconductor device having excellent reflow resistance which is prepared by using the same. SOLUTION: An adhesive material in the form of a film is composed of an adhesive composition comprising an epoxy resin composition which is solid at 25 deg.C and 100-200 pts.wt., based on 100 pts.wt. said epoxy resin composition, fine particles of a crosslinkable acrylonitrile/butadiene based rubber containing carboxyl groups in the molecular structure, and a wiring tape and a semiconductor device can be obtained by using this adhesive material in the form of a film.

13. 发明专利

JPH118471A MANUFACTURE OF MULTILEVEL INTERCONNECTION BOARD AND MOUNTING METHOD OF ELECTRONIC COMPONENT BY USING THE MULTILEVEL INTERCONNECTION BOARD 失效
公开(公告)号：JPH118471A
公开(公告)日：1999-01-12
申请号：JP16124597
申请日：1997-06-18
申请人： HITACHI LTD , HITACHI CABLE
发明人： ISHINO MASAKAZU , TENMYO HIROYUKI , ONDA MAMORU
IPC分类号： H05K3/40 , H05K3/36 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilevel interconnection board which enables the improvement in the precision of a conductive paste filling position, without the use of an elaborate apparatus. SOLUTION: An adhering material layer consisting of an adhesive layer 104 and a protective layer 105 which is removably provided on the adhesive layer 104 is laminated on the rear of a film substrate having circuit patterns. Via holes 106 which pierce through the film substrate and the adhering material layer are formed. A conductive paste is applied to the protective layer 5 to fill the via holes 106 with the conductive paste. After that, the protective layer 105 is removed from the adhesive layer 104.

14. 发明专利

JPH10125846A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH10125846A
公开(公告)日：1998-05-15
申请号：JP27649196
申请日：1996-10-18
申请人： HITACHI LTD , HITACHI VLSI ENG , HITACHI CABLE
发明人： SHIMOISHI TOMOAKI , MIYAZAKI CHUICHI , NAKAGAWA CHIKAKO , ONDA MAMORU
IPC分类号： H01L23/12 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To make substrate targets recognizable from the back side in a semiconductor chip bonding step and from the front side in a lead-to-electrode bonding step by forming the substrate targets extruding out on a flexible wiring board. SOLUTION: The semiconductor device comprises a semiconductor chip 1 and flexible wiring board 2 bonded to the chip 1 through an elastic adhesive with two substrate targets 3a, 3b on the flexible wiring board 2 so as to extrude out from the chip 1 adhered to the wiring board 2. The targets 3a, 3b are visually recognizable from the front and back sides, so that they are recognizable from the back side in a semiconductor chip bonding step and from the front side in a step of bonding leads 2d to electrodes 1a.

15. 发明专利

JPH10107178A STRUCTURE FOR ELECTRONIC CIRCUIT BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH10107178A
公开(公告)日：1998-04-24
申请号：JP18208997
申请日：1997-07-08
申请人： HITACHI LTD , HITACHI CABLE
发明人： ISHINO MASAKAZU , TENMYO HIROYUKI , EGUCHI KUNIYUKI , ONDA MAMORU
IPC分类号： H05K3/36 , H01L23/12 , H05K3/00 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To enhance an insulating characteristic between interconnections with adhesion strength reinforced between sheets and with gaps filled by a method wherein a plurality of sheets on which wiring patterns are formed are thermocompression-bonded only in via parts and the gaps generated between the sheets are filled with a resin so as to be integrated. SOLUTION: A copper foil 502 and a copper foil 503 are laminated in advance on both faces of a polyimide sheet 501, a protective tape 505 is bonded to the rear of the polyimide sheet 501, and its surface side is coated with a resist 504 so as to be dried. The resist 504 is exposed and developed, the resist is removed from only places in which via holes are to be formed, and the via holes 506 are formed in the polyimide sheet 501 so as to correspond to opening parts in the copper foil 502. Then, a plurality of wiring sheets 601 which are formed in his manner are piled up, electrodes 602 for connection are aligned, only the via holes 506 are bonded by a thermocompression-bonding operation, and gaps which are generated between the respective wiring sheets 601 are filled with an epoxy resin so as to be integrated.

16. 发明专利

JPH1041359A TAPE CARRIER FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1041359A
公开(公告)日：1998-02-13
申请号：JP19670396
申请日：1996-07-25
申请人： HITACHI CABLE , HITACHI LTD
发明人： KAMEYAMA YASUHARU , OKABE NORIO , TAGA KATSUTOSHI , ONDA MAMORU , ANJO ICHIRO
IPC分类号： H01L21/60 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To cut an inner lead at specified point in one step, without deforming the lead. SOLUTION: The tape carrier has an insulation film 1 having a device hole at specified position and inner leads extending from a polyimide tape 1 to run across the device hole. A cutting part 11 capable of being cut by the contact of a bonding tool is formed at specified region of the inner lead 10. This reduces the strength of the cutting part 11, compared with other part. Hence the inner lead 10 is cut off from the cutting part 11 by only contacting the bonding tool, just before bonding.

17. 发明专利

JPH1041344A TAPE CARRIER FOR SEMICONDUCTOR DEVICES 失效
公开(公告)号：JPH1041344A
公开(公告)日：1998-02-13
申请号：JP19670196
申请日：1996-07-25
申请人： HITACHI CABLE , HITACHI LTD
发明人： KAMEYAMA YASUHARU , OKABE NORIO , TAGA KATSUTOSHI , ONDA MAMORU , ANJO ICHIRO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To certainly cut at a notch even with a fine pitch. SOLUTION: The tape carrier has an insulation film 2 having device holes 4 and inner leads extending across the device holes on the film 2. The inner lead is composed of a faned out part 13 protrudent into the device hole 4 from a metal conductor, faned in part 14 connected to the faned out part 13 so as to lay on the opposite insulative film 2 and notch 15 formed at the boundary between both parts 13, 14. The faned in part 14 has a larger width than that of the faned in part 13.

18. 发明专利

JPH1032285A BENDABLE WIRING BOARD, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH1032285A
公开(公告)日：1998-02-03
申请号：JP18778696
申请日：1996-07-17
申请人： HITACHI LTD , HITACHI CABLE
发明人： OGINO MASAHIKO , NAGAI AKIRA , EGUCHI KUNIYUKI , SEGAWA MASANORI , ISHII TOSHIAKI , KOKADO HIROYOSHI , HATTORI RIE , ANJO ICHIRO , TSUBOSAKI KUNIHIRO , MIYAZAKI CHUICHI , ONDA MAMORU , OKABE NORIO
IPC分类号： H01L21/60 , H01L23/12 , H01L23/40 , H05K1/00 , H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To realize a semiconductor device which can be assembled without producing a gap between a buffer layer and a semiconductor support board and mounted preventing a wiring section from bulging or bursting out due to a reflow carried out at mounting by a method wherein the buffer layer is divided into sub-layers which are each smaller than a certain value in length in a certain direction. SOLUTION: A polyimide film 6 of continuous length and with epoxy adhesive agent 7 is subjected to punching for the formation of windows. Then, an electrolytic copper foil is bonded by thermocompression through the intermediary of the polyimide film 6, photosensitive resist is applied onto the rolled copper foil and baked, a pattern is projected onto the photoresist for light exposure, the resist is developed for the formation of an etching mask. Then, the copper foil 6 is etched in ferric chloride, and the resist is separated off for the formation of a copper wiring 8. A metal mask of line/space with 0.15mm/2mm and thickness 150μm is laid on a bendable wiring board 8, and a buffer layer 5 composed of elastomer divided into pieces each 2mm or below in length in a certain direction is formed. Therefore, a semiconductor device of this constitution can be protected against interfacial delamination caused by expansion at heating.

19. 发明专利

JPS55159895A TREATMENT OF CHEMICAL COPPERRPLATING WASTE WATER 失效
公开(公告)号：JPS55159895A
公开(公告)日：1980-12-12
申请号：JP6793079
申请日：1979-05-30
申请人： HITACHI CABLE , HITACHI LTD
发明人： AIDA TAKEHISA , YAMAGISHI RIYOUZOU , ONDA MAMORU
IPC分类号： C22B15/00 , C02F1/70
摘要： PURPOSE:To quickly reduce Cu into metallic copper and remove at ordinary temperature, by a procedure in which Cu-containing waste water and Cu-containing washing water, discharged from a Cu-plating treatment process, are adjusted to have a specific pH range and then mixed with sodium hydrosulfite. CONSTITUTION:An NaOH solution or an H2SO4 solution is added to Cu-containing waste water and Cu-containing washing water, discharged from a Cu-plating treatment, to regulate the pH to 6.5-7.5, and then the waters so treated are mixed with sodium hydrosulfite to reduce Cu into metallic copper, allowed to stand for 1hr or more, mixed with a high-molecular coagulant solution with stirring to form flocs, and then subjected to a sedimentation and separation process. Thus, the treatment of the Cu-containing waste water and Cu-containing washing water can be quickly and simply performed without the need for heating device. Particularly, Cu is removed in the form of a complex and hence the method is effectively applicable to the removal of copper in waste water which cannot be separated by the neutralization method.

20. 发明专利

JP2004197010A Heat resistant adhesive, method for producing the same, and semiconductor device using the same 审中-公开
公开(公告)号：JP2004197010A
公开(公告)日：2004-07-15
申请号：JP2002369163
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C09J163/00 , C09J9/02 , C09J183/04 , H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01087 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an adhesive comprised of a thermosetting resin composition, which is liquid at room temperature(25°C) and excellent in workability such as casting etc. because of its low viscosity and gives after curing a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, and a semiconductor device using it. SOLUTION: The heat resistant adhesive comprises a thermosetting resin composition whose essential components are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by general formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by general formula (2) (wherein A is a divalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

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