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11. 发明专利

JP2011192485A Manufacturing method of mems device and substrate 有权
标题翻译： MEMS器件和衬底的制造方法
公开(公告)号：JP2011192485A
公开(公告)日：2011-09-29
申请号：JP2010056565
申请日：2010-03-12
申请人： Fujitsu Ltd , 富士通株式会社
发明人： INOUE HIROAKI , NAKATANI TADASHI , UEDA TOMOSHI
IPC分类号： H01H49/00 , B81B3/00 , B81C1/00 , H01H59/00
CPC分类号： H01H59/0009 , Y10T428/24521 , Y10T428/24562
摘要： PROBLEM TO BE SOLVED: To improve precision of electrode gap or the like by reducing warping of a movable part when a sacrifice layer is formed. SOLUTION: The manufacturing method of an MEMS device comprises a process to prepare a substrate 11 which is provided with a first substrate 11a in which a cavity 21 is formed and a second substrate 11c which is jointed to a surface side on which the cavity is formed of the first substrate, and in which a slit 16 to demarcate a movable part KB is formed in a position corresponding to the cavity, and a thermal oxidation film 22 is selectively formed at a position corresponding to the movable part on the surface opposed to the first substrate of the second substrate, a process to form a first electrode layer 12a on the surface on the opposite side to the surface on which the thermal oxidation film is formed in the movable part, a process to form a sacrifice layer 31 on the first electrode layer and the second substrate, a process to form a second electrode layer on the sacrifice layer, and a process to remove the sacrifice layer 31 and the thermal oxidation film 22 after forming the second electrode layer. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过在形成牺牲层时减小可动部件的翘曲来提高电极间隙等的精度。解决方案：MEMS器件的制造方法包括制备衬底11的工艺，衬底11设置有其中形成腔21的第一衬底11a和第二衬底11c，第二衬底11c连接到表面侧，空腔由第一基板形成，并且其中划定可动部分KB的狭缝16形成在与空腔相对应的位置，并且热氧化膜22选择性地形成在与表面上的可移动部分相对应的位置与第二基板的第一基板相对的是在可移动部分中形成有热氧化膜的表面的相反侧的表面上形成第一电极层12a的工艺，形成牺牲层31的工艺在第一电极层和第二基板上，在牺牲层上形成第二电极层的工艺，以及在形成所述Se之后去除牺牲层31和热氧化膜22的工艺电极层。版权所有（C）2011，JPO＆INPIT

12. 发明专利

JP2011119126A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2011119126A
公开(公告)日：2011-06-16
申请号：JP2009275610
申请日：2009-12-03
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKATANI TADASHI , INOUE HIROAKI , UEDA TOMOSHI
IPC分类号： H01H59/00 , B81B3/00
CPC分类号： H01H59/0009 , H01P1/12
摘要： PROBLEM TO BE SOLVED: To provide an electronic device capable of restraining leak current and reducing power consumption caused by the leak current. SOLUTION: The electronic device has a substrate 11 including an active layer 11c, a signal electrode SL formed on the surface of the active layer, a first drive electrode 14 formed on the surface of the active layer and connected to a ground, and a second drive electrode 15 including first sections 15a, 15c formed on the surface of active layer and a second section 15b connected with the first sections and located at an upper part of the first drive electrode. Ring-shaped grooves 22, 23 penetrating the active layer 11c and surrounding the first sections 15a, 15c are formed on the substrate 11. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制泄漏电流并降低由漏电流引起的功耗的电子设备。解决方案：电子器件具有包括有源层11c，形成在有源层的表面上的信号电极SL的基板11，形成在有源层的表面上并连接到地的第一驱动电极14，以及第二驱动电极15，其包括形成在有源层的表面上的第一部分15a，15c和与第一部分连接并位于第一驱动电极的上部的第二部分15b。穿过有源层11c并围绕第一部分15a，15c的环形槽22,23形成在基板11上。版权所有：（C）2011，JPO＆INPIT

13. 发明专利

JP2009205753A Magnetic disk apparatus and data storage method 有权
标题翻译：磁盘设备和数据存储方法
公开(公告)号：JP2009205753A
公开(公告)日：2009-09-10
申请号：JP2008047986
申请日：2008-02-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： INOUE HIROAKI , SUDA ISAO
IPC分类号： G11B20/18
CPC分类号： G11B5/5521
摘要： PROBLEM TO BE SOLVED: To provide a magnetic disk apparatus, a magnetic disk program and a data storage method detecting a side erase track while suppressing use capacity of a memory. SOLUTION: The magnetic disk apparatus 1 uses a head 50 to write data in a plurality of unit areas arranged in an adjacent relationship to each other in a magnetic disk 60, and includes: a first recording section recording, in a RAM 12, the position of a unit area which is a target of data write; a first counting section counting the number of times of data write operation performed for the unit area corresponding to the position recorded by the first recording section; and a second recording section recording, in a nonvolatile storage medium different from the RAM 12, a side position being the position of a unit area adjacent to the unit area whose number of records counted by the first counting section is the prescribed number or more. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种抑制存储器的使用容量的磁盘装置，磁盘程序和检测侧面擦除轨迹的数据存储方法。解决方案：磁盘装置1使用磁头50在磁盘60中以彼此相邻的关系布置的多个单元区域中写入数据，并且包括：第一记录部分，其在RAM 12中记录作为数据写入目标的单位区域的位置; 第一计数部分，对与由第一记录部分记录的位置对应的单位区域进行数据写入操作的次数; 以及第二记录部分，在与RAM 12不同的非易失性存储介质中，记录与由第一计数部分计数的记录数为规定数量的单位区域相邻的单位区域的位置的侧面位置。版权所有（C）2009，JPO＆INPIT

14. 发明专利

JP2010199507A Packaged device and producing method of packaged device 有权
标题翻译：包装装置的制造方法和包装装置的制造方法
公开(公告)号：JP2010199507A
公开(公告)日：2010-09-09
申请号：JP2009045873
申请日：2009-02-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： INOUE HIROAKI , KATSUKI TAKASHI , NAKAZAWA FUMIHIKO
IPC分类号： H01L23/02
CPC分类号： B32B37/12 , B32B2309/027 , B32B2309/68 , B32B2310/0806 , B32B2457/00 , B81B2207/096 , B81C1/00301 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a packaged device suitable for separating electrically the device and a packaging section base material.
SOLUTION: The packaged device has a device substrate in which a device D accompanied by a surface S1 to be joined is formed, and a packaging unit 80 which has an insulating layer 82 constituting a surface S2 to be joined, and is joined to the device substrate. The surface S1, S2 to be joined are joined. In the insulating layer 82, all or a part of a peripheral side face 82b is higher than an end face 82a in metal concentration. An outline of the surface S1 to be joined retreats inward from an outline of the surface S2 to be joined. In the manufacturing method, the device substrate in which the device D accompanied by the surface S1 to be joined is formed, and the packaging unit 80 which has the insulating layer 82 constituting the surface S2 to be joined, are bonded by a normal temperature bonding method. In the bonding process, the surface S1, S2 to be joined are joined at the normal temperature, so that the outline of the surface S1 to be joined retreats inward from the outline of the surface S2 to be joined.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种适合于将该装置和包装部分基材分离的包装装置。解决方案：封装器件具有器件基板，其中形成有与要连接的表面S1相伴的器件D;以及封装单元80，其具有构成要接合的表面S2的绝缘层82，并被接合到器件衬底。要连接的表面S1，S2相连接。在绝缘层82中，周边侧面82b的全部或一部分高于金属浓度的端面82a。要连接的表面S1的轮廓从待接合的表面S2的轮廓向内退回。在该制造方法中，形成其中附着有要接合的表面S1的器件D的器件基板，并且具有构成要接合的表面S2的绝缘层82的封装单元80通过常温接合方法。在接合工序中，待接合面S1，S2在正常温度下接合，所以待接合面S1的轮廓将从要接合的表面S2的轮廓向内退回。版权所有（C）2010，JPO＆INPIT

15. 发明专利

JP2010032388A Angular velocity sensor and electronic device 有权
标题翻译：角速度传感器和电子设备
公开(公告)号：JP2010032388A
公开(公告)日：2010-02-12
申请号：JP2008195319
申请日：2008-07-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KATSUKI TAKASHI , NAKAZAWA FUMIHIKO , INOUE HIROAKI
IPC分类号： G01C19/56 , G01P9/04
CPC分类号： G01C19/5719
摘要： PROBLEM TO BE SOLVED: To provide an angular velocity sensor which is suited for improving the coupling efficiency of reference oscillations of two oscillating parts and for suppressing a leak of driving energy into a supporting substrate. SOLUTION: This angular velocity sensor X1 is equipped with the oscillating parts 10 and 20 which can oscillate in the X-axis and Y-axis directions and are separated from each other in the X-axis direction, two coupling beams 40 which extend in the X-axis direction and are separated from each other in the Y-axis direction, with the oscillating parts 10 and 20 disposed between, and which can oscillate with a stationary wave, fixing parts 50 which fix the coupling beams 40 to the supporting substrate S1, a connecting part 60 which bridges the two coupling beams 40 and the oscillating part 10, and a connecting part 70 which bridges the two coupling beams 40 and the oscillating part 20. The fixing parts 50 are connected to the coupling beams 40 at fixed-point places in the stationary wave oscillation of the coupling beams 40, and the connecting parts 60 and 70 have large-width parts 61a and 71a which are connected to the coupling beams 40 at the fixed-point places in the stationary wave oscillation of the coupling beams 40. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种角速度传感器，其适于提高两个振荡部分的参考振荡的耦合效率并且用于抑制驱动能量泄漏到支撑基板中。解决方案：该角速度传感器X1配备有能够在X轴方向和Y轴方向上振动并且在X轴方向上彼此分离的振动部10和20，两个连接梁40 在X轴方向上延伸并且在Y轴方向上彼此分离，其中摆动部分10和20设置在固定波之间并且可以与固定波振荡，固定部件50将联接梁40固定到支撑基板S1，桥接两个耦合光束40和振荡部分10的连接部分60以及桥接两个耦合光束40和振荡部分20的连接部分70.固定部分50连接到耦合光束40 在耦合梁40的固定波振荡中的固定点位置处，连接部分60和70具有大的宽度部分61a和71a，它们在固定波中的固定点处连接到耦合梁40 耦合光束40的振荡。版权所有（C）2010，JPO＆INPIT

16. 发明专利

JP2008207306A Method of manufacturing packaged micro movable element, and packaged micro movable element 审中-公开
标题翻译：包装微型移动元件的制造方法和包装的微动元件
公开(公告)号：JP2008207306A
公开(公告)日：2008-09-11
申请号：JP2007048806
申请日：2007-02-28
申请人： Fujitsu Ltd , Fujitsu Media Device Kk , 富士通メディアデバイス株式会社 , 富士通株式会社
发明人： INOUE HIROAKI , NAKAZAWA FUMIHIKO , ISHIKAWA HIROSHI , KATSUKI TAKASHI , YAMAJI TAKAYUKI
IPC分类号： B81C3/00 , G01C19/56 , G01P9/04 , G01P15/125 , H01L29/84
CPC分类号： G01P15/125 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L23/041 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a packaged micro movable element, suitable for suppressing the dispersion of operation characteristics of movable parts of the micro movable element, and such an element. SOLUTION: The method is for manufacturing a packaged device X comprising a micro movable element Y having movable parts 10, 20, and a packaging member 82 having a recessed section 82a, and a packaging member 82 having a recessed section 82a. The method comprises the step of joining a packaging wafer on which a plurality of recessed sections 81a are disposed to a device wafer formed into a plurality of micro movable elements, and joining another packaging wafer on which a plurality of recessed sections 82a are disposed to the device wafer, and cutting a laminated structure including the device wafer and both the packaging wafers. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造微型可移动元件的方法，该方法适用于抑制微型可移动元件的可移动部件的操作特性的分散以及这种元件。解决方案：该方法用于制造包括具有可移动部分10,20的微型可移动元件Y和具有凹部82a的包装部件82的封装装置X以及具有凹部82a的包装部件82。该方法包括将形成有多个凹部81a的封装晶片与形成有多个微型可动元件的器件晶片接合的工序，将与其上配置有多个凹部82a的另一封装晶片并且切割包括器件晶片和两个封装晶片的层压结构。版权所有（C）2008，JPO＆INPIT

17. 发明专利

JP2015015198A ＭＥＭＳモジュール及びＭＥＭＳモジュールの製造方法有权
标题翻译： MEMS模块和制造MEMS模块的方法
公开(公告)号：JP2015015198A
公开(公告)日：2015-01-22
申请号：JP2013142156
申请日：2013-07-05
申请人：富士通株式会社 , Fujitsu Ltd
发明人： INOUE HIROAKI
IPC分类号： H01H57/00 , B81B7/02 , B81C3/00
摘要：【課題】製造時に可動部が変形することが防止されるMEMSモジュールを提供する。【解決手段】MEMSモジュールは、第1面11a及び第2面11bと、第2面上に配置される複数の第1電極パッド13及び複数の第1電極パッドに囲まれるように配置される第2電極パッド14と、第1面11aと複数の第1電極パッド13又は第2電極パッド14との間を接続する内部配線12を有するインタポーザ11と、第2面11b上に配置され、複数の第1電極パッド13及び第2電極パッド14と接続する駆動回路部30と、インターポーザ11よりも小さい寸法を有し、第1面11a上において、平面視して複数の第1電極パッド13に囲まれるように配置され、駆動回路部30により駆動されるMEMS素子20と、を備える。【選択図】図1
摘要翻译：要解决的问题：提供一种在制造时防止运动部件变形的MEMS模块。解决方案：MEMS模块包括：第一表面11a和第二表面11b; 设置在第二表面上的多个第一电极焊盘13和被多个第一电极焊盘包围的第二电极焊盘14; 具有连接在第一表面11a和多个第一电极焊盘13或第二电极焊盘14之间的内部布线12的插入件11; 设置在第二表面11b上并连接多个第一电极焊盘13和第二电极焊盘14的驱动电路部分30; 以及具有比插入件11小的尺寸的MEMS元件20，被布置成在平面图中被第一表面11a上的多个第一电极焊盘13包围，并由驱动电路部分30驱动。

18. 发明专利

JP2013255975A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2013255975A
公开(公告)日：2013-12-26
申请号：JP2012134528
申请日：2012-06-14
申请人： Fujitsu Ltd , 富士通株式会社
发明人： INOUE HIROAKI , MI XIAOYU , FUJIWARA TAKAYUKI
IPC分类号： B81B3/00 , H01G5/16 , H01H59/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable and excellent electronic device.SOLUTION: An electric device includes: a fixed electrode 14 fixed to a substrate 10; a movable electrode 24 formed above the substrate, with a central part thereof opposed to the fixed electrode, and with both ends thereof respectively fixed to the substrate by means of supporting members 16a, 16b; and control electrodes 18a, 18b fixed to the substrate, opposed to the movable electrode between the fixed electrode and the supporting members, and configured to displace the movable electrode by electrostatic attractive force generated when voltage is applied. A rib-like first structure 28a for reinforcing the movable electrode is formed in a first area 26a including the central part of the movable electrode and constituting a partial area of the movable electrode. The first area is protruded in respective longitudinal directions of the movable electrode from an area where the movable electrode and the fixed electrode overlap in a planar view.
摘要翻译：要解决的问题：提供高可靠性和优异的电子设备。解决方案：电气设备包括：固定到基板10的固定电极14; 形成在基板上方的可动电极24，其中心部分与固定电极相对，并且其两端分别通过支撑部件16a，16b固定到基板上; 以及与固定电极和支撑构件之间的可动电极相对固定的基板的控制电极18a，18b，并且构造成通过施加电压时产生的静电吸引力来移动可动电极。在可动电极的中心部分的第一区域26a中形成用于加强可动电极的肋状第一结构28a，并构成可动电极的局部区域。第一区域在可动电极和固定电极在平面图中重叠的区域在可动电极的各个纵向上突出。

19. 发明专利

JP2009259055A Memory device 有权
标题翻译：内存设备
公开(公告)号：JP2009259055A
公开(公告)日：2009-11-05
申请号：JP2008108274
申请日：2008-04-17
申请人： Fujitsu Ltd , 富士通株式会社
发明人： INOUE HIROAKI
IPC分类号： G06F3/06 , G06F12/08 , G06F12/16
CPC分类号： G11B5/09 , G06F3/0611 , G06F3/0659 , G06F3/0674
摘要： PROBLEM TO BE SOLVED: To shorten write execution time as a memory device by appropriately determining the order of execution of a plurality of write instructions in the memory device in which a nonvolatile semiconductor memory and a rotational memory unit are used together.
SOLUTION: The memory device includes the rotational memory unit, the nonvolatile semiconductor memory, a temporary memory for temporarily storing the plurality of write instructions, and a control unit for executing the plurality of write instructions. The control unit arranges the sequence of the plurality of write instructions stored in the temporary memory in the order of wait time at the time of execution to the memory unit, and executes the plurality of write instructions successively to the memory unit according to the ascending order of the sequence. The control unit also executes another write instruction to the nonvolatile semiconductor memory, so as to store the entire data which are instructed to write by the plurality of write instructions into either the memory unit or the nonvolatile semiconductor memory.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过在其中使用非易失性半导体存储器和旋转存储器单元的存储器件中适当地确定多个写入指令的执行顺序来缩短作为存储器件的写入执行时间。解决方案：存储器件包括旋转存储器单元，非易失性半导体存储器，用于临时存储多个写指令的临时存储器，以及用于执行多个写指令的控制单元。控制单元将存储在临时存储器中的多个写入指令的顺序按执行时的等待时间顺序排列到存储器单元，并且根据升序顺序地将多个写入指令执行到存储器单元的序列。控制单元还对非易失性半导体存储器执行另一写入指令，以将由多个写入指令指示的写入的整个数据存储到存储器单元或非易失性半导体存储器中。版权所有（C）2010，JPO＆INPIT

20. 发明专利

JP2008246604A Micro movable element, wafer and wafer manufacturing method 审中-公开
标题翻译：微移动元件，波形和波形制造方法
公开(公告)号：JP2008246604A
公开(公告)日：2008-10-16
申请号：JP2007088911
申请日：2007-03-29
申请人： Fujitsu Ltd , Fujitsu Media Device Kk , 富士通メディアデバイス株式会社 , 富士通株式会社
发明人： INOUE HIROAKI , KATSUKI TAKASHI , ISHIKAWA HIROSHI , TAKAHASHI YUJI , NAKAZAWA FUMIHIKO , YAMAJI TAKAYUKI
IPC分类号： B81B3/00 , G01C19/56 , G01P9/04
CPC分类号： G01P15/0802 , B81B3/0008 , B81B2201/0242 , G01C19/5719 , G01P15/125 , G01P15/14
摘要： PROBLEM TO BE SOLVED: To provide a micro movable element suitable to restrain sticking of a movable structural part and also suitable to manufacturing in a favorable yield, and also to provide a wafer used to manufacture such a micro movable element and a method to manufacture such a wafer. SOLUTION: This wafer manufacturing method, for example, includes processes of: forming a fine irregular surface on a pre-second layer by filming poly-silicon or amorphous-silicon over it; forming a pre-intermediate layer on the fine irregular surface of the pre-second layer; and bonding a pre-first layer and the pre-second layer to each other through the pre-intermediate layer on the fine irregular surface. This micro movable element X1 is provided by processing the wafer, and is furnished with: a structural part 62A molded on a first layer; and a structural part 61 molded on a second layer having a portion to face the structural part 62A through a cavity and free to relatively displace against the structural part 62A. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种适于抑制可移动结构部件的粘附的微型可移动元件，并且还适于以良好的收率制造，并且还提供用于制造这种微型可移动元件的晶片和方法制造这种晶片。＆lt; P＆gt;解决方案：该晶片制造方法例如包括以下工序：在其上通过在其上形成多晶硅或非晶硅，在前置第二层上形成微小的不规则表面; 在前第二层的细微不规则表面上形成预中间层; 以及通过所述细微不规则表面上的所述预中间层将前置第一层和所述前置第二层彼此结合。该微型可动元件X1是通过加工晶片来提供的，并具有：模制在第一层上的结构部分62A; 以及模制在第二层上的结构部分61，其具有通过空腔并且相对于结构部件62A相对移位的部分以面向结构部件62A的部分。版权所有（C）2009，JPO＆INPIT

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