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11. 发明专利

JPH11335562A POLYMER-BASED HEAT RADIATING MATERIAL AND HEAT RADIATING PARTS USING SAME 失效
公开(公告)号：JPH11335562A
公开(公告)日：1999-12-07
申请号：JP14194598
申请日：1998-05-22
申请人： FUJIKURA LTD
发明人： IINUMA KOICHI , ONO AKINOBU , MIYATA HIROYUKI
IPC分类号： C08K3/38 , C08K7/04 , C08L83/04
摘要： PROBLEM TO BE SOLVED: To obtain a material which shows small thermal expansion at high temperatures and can suppress decrease of thermal conductivity caused by the thermal expansion by dispersing a specific amount of a thermal conductive filler in a crosslinked silicone rubber. SOLUTION: A polymer-based radiating material is obtained by dispersing 5-75 pts.wt. of a thermal conductive filler including preferably a high pressure type cubic baron nitride or a low pressure type cubic boron nitride and/or having an average diameter of 50-200 μm in 100 pts.wt. of a crosslinked silicone rubber. The crosslinked silicone rubber is preferably a rubber which has a volume expansion ratio of not more than 8×10 cc/cc/ deg.C, preferably not more than 3×10 cc/cc/ deg.C and thermal conductivity of not less than 3×10 cal/ cm.sec. deg.C such as a rubber obtained by crossliking a dimethylsilicone raw rubber, a methylphenylvinylsilicone raw rubber or the like. The crosslinking method includes usage of crosslinking agents, heating, γ-ray radiation and the like.

12. 发明专利

JPH11203939A POWER CABLE 失效
公开(公告)号：JPH11203939A
公开(公告)日：1999-07-30
申请号：JP806798
申请日：1998-01-19
申请人： FUJIKURA LTD
发明人： ONO AKINOBU , TAKEAKI TOSHIO
IPC分类号： H01B1/20 , H01B9/02
摘要： PROBLEM TO BE SOLVED: To prevent the degradation of a thermoplastic rubber caused by the catalytic action of a conductor of a power cable having an insulating layer formed from the thermoplastic rubber or a semiconductive layer. SOLUTION: An inner semiconductive layer 4 or an insulating layer 5 and the inner semiconductive layer 4 are formed from a composition comprised of a copper inhibitor and thermoplastic rubber. The copper inhibitor imparts a metal inactivation effect to a heavy metal by forming a complex compound. As a result, the catalytic action of the heavy metal is suppressed. Forming the inner semiconductive layer 4, for example, by using such a composition comprised of thermoplastic rubber and a copper inhibitor can prevent the degradation of the thermoplastic rubber in the case of the direct contact with a conductor 2 formed from a heavy metal.

13. 发明专利

JPH08227616A INSULATED WIRE 失效
公开(公告)号：JPH08227616A
公开(公告)日：1996-09-03
申请号：JP3271995
申请日：1995-02-21
申请人： FUJIKURA LTD
发明人： ONO AKINOBU , AMANO SHIGERU , HATADA MICHIAKI , WATABE TOSHIHITO , SUGIYAMA SHUICHI
IPC分类号： H01B3/48 , H01B7/02 , H01B7/29 , H01B7/34
摘要： PURPOSE: To provide an insulated wire, which has the excellent flexibility and which does not hurt a hand of a worker during the manufacturing work, by winding an aramid fiber bundle around a conductor, and dipping this conductor in Si varnish, and hardening it so as to form an insulated body at a predetermined thickness. CONSTITUTION: A conductor 1 is made of a straight angle wire having a rectangular cross section, and an insulating body 2 is provided thereon. The insulating body 2 is formed by dipping an aramid fiber bundle in the silicone varnish, and hardening it, and thickness thereof is formed at 50-100μm, desirably, at 60-80μm. A yarn or a roving made of aramid fiber strand, which is formed by bundling several ten several hundred mono-filaments of aramid fiber, is wound around the conductor 1. Width of this fiber bundle at 0.2-0.5mm and thickness thereof at 0.01-0.05mm are desirable. Sizing is eliminated at the time of processing this fiber bundle, and washing is performed. A usual tape winding machine can be utilized so as to wind the fiber bundle around the conductor 1. Dip of the silicone varnish is performed by passing the conductor 1 wound with the fiber bundle into a coating dies filled with the varnish.

14. 发明专利

JP2009188326A Flexible wiring board 审中-公开
标题翻译：柔性布线板
公开(公告)号：JP2009188326A
公开(公告)日：2009-08-20
申请号：JP2008029093
申请日：2008-02-08
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ONO AKINOBU
IPC分类号： H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board which is capable of preventing a reinforcing portion formed at an terminal part from falling off and superior in electrical characteristics and connection reliability.
SOLUTION: In the flexible wiring board, an end part of a PET film 11 is bent toward the other surface side of the resin film 11, and laminated on a rear surface side of the terminal part 15 as a reinforcing part 16, and further the inner side of the bent portion is bonded with a bonding material 17.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止形成在端子部分的加强部分脱落并且具有优异的电特性和连接可靠性的柔性布线板。解决方案：在柔性布线板中，PET膜11的端部朝向树脂膜11的另一个表面侧弯曲，层叠在作为加强部16的端子部15的后表面侧，并且另外，弯曲部分的内侧用接合材料17粘接。版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2008224334A Pressure sensor 审中-公开
标题翻译：压力传感器
公开(公告)号：JP2008224334A
公开(公告)日：2008-09-25
申请号：JP2007061051
申请日：2007-03-09
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KAWAHIRA TETSUYA , ONO AKINOBU
IPC分类号： G01L1/20
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor, with its pressure-resistance value change curve gradually changing over a wide range, without increasing labor for production management.
SOLUTION: This pressure sensor is structured so that an upper electrode of a low resistance value is formed on an upper electrode sheet and a lower electrode of a high resistance value is formed on a lower electrode sheet while the two electrode sheets are superposed on each other with a spacer having a hole part in its middle put therebetween so that the electrodes face each other leaving a prescribed gap therebetween. The electrode on at least one electrode sheet is upheaved on the other electrode sheet-side centering on the center position of this electrode.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供压力传感器，其耐压值变化曲线在宽范围内逐渐变化，而不增加生产管理的劳动。解决方案：该压力传感器构造成使得在上电极片上形成低电阻值的上电极，并且在下电极片上形成高电阻值的下电极，同时将两电极片重叠在其间具有中间的孔部分的间隔件彼此相对地彼此面对，从而在它们之间留有规定的间隙。至少一个电极片上的电极在另一个电极片侧以该电极的中心位置为中心。版权所有（C）2008，JPO＆INPIT

16. 发明专利

JP2007073837A Method and apparatus for processing printed wiring board 审中-公开
标题翻译：印刷线路板加工方法与装置
公开(公告)号：JP2007073837A
公开(公告)日：2007-03-22
申请号：JP2005260890
申请日：2005-09-08
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ONO AKINOBU , KUROSAWA MASARU
IPC分类号： H05K3/22
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for processing a printed wiring board capable of improving conductive characteristics of a conductive film constituting a conductive circuit provided on the wiring board.
SOLUTION: The apparatus 1 is constituted at least of a carry-out roller 2 serving as a carry-out means for feeding out a wiring board sheet 4, a carry-in roller 3 serving as a carry-in means for taking up the wiring board sheet 4 fed out by the roller 2, and a contact 5 between the rollers 2 and 3 to serve as a sliding means for rubbing a conductive circuit plane 14 of the sheet 4. The conductive circuit plane 14 of the sheet 4 comes into contact with the contact 5 to apply a pressure for rubbing, and the sheet 4 is fed out from the carry-out roller 2 and taken up by the carry-in roller 3, thereby rubbing the conductive circuit plane 14.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够提高构成设置在布线板上的导电电路的导电膜的导电特性的印刷布线板的处理方法和装置。解决方案：装置1至少构成作为用于输出布线板片4的进出装置的进出辊2，作为用于取出的携带装置的进入辊3 将辊2送出的配线基板4和辊2,3之间的接点5作为用于摩擦片材4的导电电路平面14的滑动装置。片材4的导电电路平面14 与触点5接触以施加用于摩擦的压力，并且片材4从进出辊2送出并被输入辊3吸收，从而摩擦导电电路平面14。版权所有（C）2007，JPO＆INPIT

17. 发明专利

JP2006040603A Forming method of conductive film 有权
标题翻译：导电膜的形成方法
公开(公告)号：JP2006040603A
公开(公告)日：2006-02-09
申请号：JP2004215429
申请日：2004-07-23
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ONO AKINOBU , IGARASHI NAHOKO
IPC分类号： H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a forming method of a conductive film for forming a high-conductivity conductive film with a conductive composition containing a silver particle precursor.
SOLUTION: In a forming method of the conductive film composed of a process A of coating a conductive composition containing a silver particle precursor made of silver oxide particles and/or tertiary aliphatic silver salt and a solvent, and process B of forming the conductive film by heating the conductive composition, the conductive composition is heated so that a mass of the solvent contained in the conductive composition is to be 3% of that of the silver oxide precursor when a temperature of the conductive composition reaches 148°C, in the process B. Or, the conductive composition is heated with far infrared rays in the process B. Further in the process B, the conductive composition is heated with hot air further, after it is heated with the far infrared rays.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用含有银颗粒前体的导电组合物形成高导电性导电膜的导电膜的形成方法。解决方案：在由包含由氧化银颗粒和/或叔脂族银盐和溶剂制成的银颗粒前体的导电组合物的方法A构成的导电膜的形成方法中，以及形成通过加热导电组合物，导电组合物被加热，使得当导电组合物的温度达到148℃时，导电组合物中包含的溶剂的质量为氧化银前体的质量的3％，在或者，在工艺B中用远红外线加热导电组合物。此外，在工艺B中，在用远红外线加热后，用热空气进一步加热导电组合物。版权所有（C）2006，JPO＆NCIPI

18. 发明专利

JP2003309352A Conductive adhesive and electronic component mounting structure using the same 审中-公开
标题翻译：导电胶和电子元件安装结构
公开(公告)号：JP2003309352A
公开(公告)日：2003-10-31
申请号：JP2002113711
申请日：2002-04-16
申请人： Fujikura Kasei Co Ltd , Fujikura Ltd , 株式会社フジクラ , 藤倉化成株式会社
发明人： IMAI TAKAYUKI , OMORI KIWAKO , ONO AKINOBU , HONDA TOSHIYUKI , OKAMOTO KOJI , ITO MASAFUMI
IPC分类号： C09J9/02 , C09J11/04 , C09J201/00 , H05K3/32
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide conductive adhesive, where electrical resistance is remarkably low and high connection reliability can be obtained, and to provide an electronic component mounting structure.
SOLUTION: An electronic component 6 is mounted on a conductor circuit 2, by using a conductive component including a particulate silver compound as a conductive adhesive 5. A reducing agent and a binder can be added to the conductive component. It is desirable to use a mixture made of one or two types selected from silver (I) oxide, silver (II) oxide, silver carbonate, silver acetate and an acetyl-acetone complex as the particulate silver compound, or the conductive component, including particulate silver oxide and tertiary fatty acid silver can be used.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供电阻显着低且可以获得高连接可靠性的导电粘合剂，并提供电子部件安装结构。解决方案：通过使用包含颗粒状银化合物作为导电粘合剂5的导电组件，将电子部件6安装在导体电路2上。可以向导电部件添加还原剂和粘合剂。期望使用选自氧化银（I），氧化银（II），碳酸银，乙酸银和乙酰丙酮络合物中的一种或两种作为颗粒状银化合物或导电组分的混合物，包括可以使用颗粒状氧化银和叔脂肪酸银。版权所有（C）2004，JPO

19. 发明专利

JP2003308984A Organic electroluminescence element and production process thereof 审中-公开
标题翻译：有机电致发光元件及其生产工艺
公开(公告)号：JP2003308984A
公开(公告)日：2003-10-31
申请号：JP2002115440
申请日：2002-04-17
申请人： Fujikura Kasei Co Ltd , Fujikura Ltd , 株式会社フジクラ , 藤倉化成株式会社
发明人： OMORI KIWAKO , IMAI TAKAYUKI , ONO AKINOBU , HONDA TOSHIYUKI , OKAMOTO KOJI , ITO MASAFUMI
IPC分类号： H05B33/26 , H01L51/50 , H05B33/10 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide an organic EL element that is simplified in production process and can be made a large area and subjected to minute processing, and a production process thereof.
SOLUTION: The organic EL element is obtained by successively laminating a hole transport layer 3, a luminous layer 4, an electron transport layer 5, a negative electrode layer 6 and a collector electrode layer 7 on a glass substrate 1, on which a positive electrode layer 2 has been laminated, and forming the negative electrode layer 6 and collector electrode layer 7 with a conductive composition containing a particulate silver compound, respectively. The conductive compositions further contain a reducing agent and/or a binder, or particulate silver oxide and the silver salt of a tertiary fatty acid. The production process of the organic EL element comprises respectively applying solutions of materials forming the hole transport layer 3, luminous layer 4 and electron transport layer 5 on to the surface of the glass substrate 1, on which the positive electrode layer 2 has been laminated, drying the solutions to successively laminate them, applying the conductive composition containing the particulate silver compound on to the electron transport layer 5 and heating it to form the negative electrode layer 6 and collector electrode layer 7.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供简化生产过程并且可以制成大面积并进行微小加工的有机EL元件及其制造方法。解决方案：有机EL元件通过在玻璃基板1上依次层叠空穴传输层3，发光层4，电子传输层5，负极层6和集电极层7而获得，其上已经层叠了正极层2，并分别用含有颗粒状银化合物的导电组合物形成负极层6和集电极层7。导电组合物还含有还原剂和/或粘合剂，或颗粒状氧化银和叔脂肪酸的银盐。有机EL元件的制造方法分别将形成空穴传输层3，发光层4和电子传输层5的材料的溶液分别施加到已经层叠有正极层2的玻璃基板1的表面上，干燥溶液以依次层压它们，将含有颗粒状银化合物的导电组合物施加到电子传输层5上并加热，形成负极层6和集电极层7.版权所有（C）2004， JPO

20. 发明专利

JP2003303529A Ink for forming thick membrane and membrane switch using this 审中-公开
标题翻译：用于形成厚膜和薄膜开关的墨水
公开(公告)号：JP2003303529A
公开(公告)日：2003-10-24
申请号：JP2002108179
申请日：2002-04-10
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ONO AKINOBU , KUROSAWA MASARU , IMAI TAKAYUKI , HOTTA HIROAKI , ONO YASUSHI
IPC分类号： H01H13/70
摘要： PROBLEM TO BE SOLVED: To decrease a dispersion in thickness of ink membranes acting an a spacer, formed by printing form the ink membrane having the required thickness by one printing operation, and stabilize an operation load of the switch when the spacer 3 of a membrane switch is formed by printing.
SOLUTION: As the spacer 3 for keeping a specified interval and separating contacts 2, 2 of the membrane switch, the ink membrane is used, the ink membrane is formed by screen printing the ink for forming a thick membrane, the ink is prepared by mixing 5-40 pts.wt. granular filler such as globular resin particles to 100 pts.wt. resin such as ultraviolet curing resin. By the presence of the granular filler, the dispersion in thickness of the obtained spacers 3 is decreased, and the operation load in the operation of the switch is stabilized.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了减少作用于通过一次印刷操作由具有所需厚度的油墨膜印刷形成的间隔物的油墨膜的厚度分散，并且当间隔件3 通过印刷形成膜开关。解决方案：作为用于保持指定间隔的间隔物3和分离膜开关的接触件2，使用油墨膜，通过丝网印刷形成厚膜的油墨形成油墨膜，油墨是通过混合5-40重量份粒状填料如球状树脂颗粒至100重量份树脂如紫外线固化树脂。通过颗粒填料的存在，所获得的间隔物3的厚度分散减小，并且开关操作中的操作负荷稳定。版权所有（C）2004，JPO

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