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11. 发明专利

JP2007138059A Highly adhesive polyimide film and method for manufacturing the same 审中-公开
标题翻译：高粘性聚酰亚胺膜及其制造方法
公开(公告)号：JP2007138059A
公开(公告)日：2007-06-07
申请号：JP2005335437
申请日：2005-11-21
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , SUEHIRO MORITSUGU
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00 , C09J5/02 , C09J7/00 , C09J179/08
摘要： PROBLEM TO BE SOLVED: To provide a highly adhesive polyimide film which shows an improved adhesion to a copper foil and is excellent in dimensional stability and water wettability, and a method for manufacturing the same.
SOLUTION: The highly adhesive polyimide film is a polyimide film formed from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride. The heat shrinkage rates of the film at 200°C in the machine-conveying direction (MD) and the width direction (TD) are both ≤0.05%, the surface roughness Ra and Rmax of the film surface measured by a stylus profilometer are ≥0.060 μm and ≥1.0 μm, respectively, and the surface free energy measured based on the contact angle is ≥75 mN/m.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方法：提供一种粘合性高的聚酰亚胺膜，其表现出对铜箔的粘附性的改善，尺寸稳定性和水润湿性优异的方法及其制造方法。解决方案：高粘合性聚酰亚胺膜是由3,4'-二氨基二苯基醚，4,4'-二氨基二苯基醚和均苯四酸二酐形成的聚酰亚胺膜。在机器输送方向（MD）和宽度方向（TD）的200℃下的膜的热收缩率均为≤0.05％，通过触针表面光度计测量的膜表面的表面粗糙度Ra和Rmax为≥ 0.060μm，≥1.0μm，基于接触角测定的表面自由能为≥75mN/ m。版权所有（C）2007，JPO＆INPIT

12. 发明专利

JP2005014509A Surface treatment method of thermoplastic polyimide film 有权
标题翻译：热塑性聚酰亚胺薄膜的表面处理方法
公开(公告)号：JP2005014509A
公开(公告)日：2005-01-20
申请号：JP2003185074
申请日：2003-06-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MACHIDA HIDEAKI , TESHIBA TOSHIHIRO , YOKOYAMA HIROICHI
IPC分类号： B29C51/26 , B29C51/10 , B29K79/00
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method of a modified thermoplastic polyimide film which simultaneously achieves the traveling properties (easy lubricating properties), optical properties and moldability inside a mold.
SOLUTION: This surface treatment method of the thermoplastic polyimide film is to apply surface treatment to the polyimide film in contact with a mold when the film is vacuum-molded.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种改进的热塑性聚酰亚胺膜的表面处理方法，其同时实现模具内的移动性（易润滑性），光学性质和成型性。解决方案：当热塑性聚酰亚胺膜的表面处理方法是真空成型时，对与模具接触的聚酰亚胺膜进行表面处理。版权所有（C）2005，JPO＆NCIPI

13. 发明专利

JP2008291085A Highly adhsive polyimide film and method for producing the same 审中-公开
标题翻译：高粘度聚酰亚胺膜及其制造方法
公开(公告)号：JP2008291085A
公开(公告)日：2008-12-04
申请号：JP2007136703
申请日：2007-05-23
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , SUEHIRO MORITSUGU
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a highly adhesive polyimide film improved in adhesivity to copper foil and also excellent in slipperiness, dimensional stability and wettability to water, and to provide a method for producing the film.
SOLUTION: The highly adhesive polyimide film is such as to be formed from 4,4'-diaminodiphenyl ether(ODA) and pyromellitic dianhydride(PMDA) and contain inorganic particles. The polyimide film has the following properties: The shrinkage when heated at 200°C is ≤0.05% both in the machine direction(MD) and transverse direction(TD). The surface roughness Ra is ≥0.065 μm and Rmax is ≥1.0 μm as determined by a tracer-type surface roughness tester. The coefficient of static friction is ≤1.0. The surface free energy is ≥80 mN/m as determined based on a contact angle method.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种改进了对铜箔的粘附性的高粘合性聚酰亚胺膜，并且还具有优异的滑爽性，尺寸稳定性和对水的润湿性，并提供了一种制备该膜的方法。解决方案：高粘合性聚酰亚胺膜由4,4'-二氨基二苯醚（ODA）和均苯四酸二酐（PMDA）形成，并含有无机颗粒。聚酰亚胺膜具有以下性质：在机械方向（MD）和横向（TD）下，在200℃下加热时的收缩率不大于0.05％。通过示踪型表面粗糙度测定仪测定，表面粗糙度Ra为≥0.065μm，Rmax为≥1.0μm。静摩擦系数≤1.0。基于接触角法测定的表面自由能为≥80mN/ m。版权所有（C）2009，JPO＆INPIT

14. 发明专利

JP2008106140A Polyimide film and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：JP2008106140A
公开(公告)日：2008-05-08
申请号：JP2006290151
申请日：2006-10-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08L79/08 , C08K3/00
CPC分类号： C08G73/1042 , C08J5/18 , C08J2379/08 , C08K7/18 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0266
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide film that has excellent running properties, adhesiveness and dimensional stability of a film and is applicable to an automatic optical inspection system (AOI) of a flexible printed circuit board (FPC) or a chip-on-film (COF) and to provide a method for producing the same. SOLUTION: The polyimide film is produced mainly by imidation from p-phenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic acid dianhydride as an acid dianhydride component and comprises 0.1-0.9 wt.% based on the weight of a film resin of inorganic particles, having particle diameters in a range of 0.01-1.5 μm, an average particle diameter of 0.05-0.7 μm and a particle size distribution in which ≥80 vol.% based on the total particles of inorganic particles having particle diameters of 0.15-0.60 μm, dispersed into the film. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有优异的运行性能，粘合性和膜的尺寸稳定性的聚酰亚胺膜，并且可应用于柔性印刷电路板（FPC）或芯片的自动光学检测系统（AOI） - 膜（COF），并提供其制造方法。解决方案：聚酰亚胺膜主要通过由对苯二胺和4,4'-二氨基二苯醚作为二胺组分和作为酸二酐组分的均苯四甲酸二酐的酰亚胺化产生，并且包含0.1-0.9重量％粒径为0.01〜1.5μm，平均粒径为0.05〜0.7μm，粒径分布为≥80体积％的无机粒子的无机粒子的薄膜状树脂直径为0.15-0.60μm，分散在膜中。版权所有（C）2008，JPO＆INPIT

15. 发明专利

JP2007177098A Highly adhesive copolyimide film 审中-公开
标题翻译：高粘性共聚酰亚胺膜
公开(公告)号：JP2007177098A
公开(公告)日：2007-07-12
申请号：JP2005377885
申请日：2005-12-28
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SUEHIRO MORITSUGU , TESHIBA TOSHIHIRO
IPC分类号： C08J7/00 , C08G73/10 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a highly adhesive copolyimide film that is enhanced in adhesive properties to copper foil and excellent in dimensional stability and water wettability.
SOLUTION: The highly adhesive copolyimide film is obtained by subjecting a polyimide film formed from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride to a sand mat treatment, a relaxation treatment and a plasma treatment successively, where the film has a heat shrinkage ratio at 200°C of at most 0.05% in both the machine feed direction (MD) and the width direction (TD) of the film and the film surface has surface roughness Ra of at least 0.065 μm and Rmax of at least 1.0 μm as measured by a contact probe type surface roughness meter and a surface free energy of at least 80 mN/m as measured by the contact angle method.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高对铜箔的粘合性能的高粘合性共聚酰亚胺膜，尺寸稳定性和水润湿性优异。解决方案：通过将由3,4-二氨基二苯醚，4,4'-二氨基二苯醚和均苯四甲酸二酐形成的聚酰亚胺膜进行砂垫处理，松弛处理和等离子体处理，得到高粘性共聚酰亚胺膜其中膜的200℃下的热收缩率在膜的进给方向（MD）和宽度方向（TD）均为0.05％以下，膜表面的表面粗糙度Ra为0.065以上通过接触式表面粗糙度计测量的至少1.0μm的μm和Rmax以及通过接触角法测量的至少80mN / m的表面自由能。版权所有（C）2007，JPO＆INPIT

16. 发明专利

JP2006143911A Manufacturing method of polyimide substrate for optical use 有权
标题翻译：用于光学应用的聚酰亚胺基板的制造方法
公开(公告)号：JP2006143911A
公开(公告)日：2006-06-08
申请号：JP2004336893
申请日：2004-11-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , YOKOYAMA HIROICHI
IPC分类号： C08J7/00 , C08L79/08 , G02B1/04 , G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a polyimide substrate to make a polymer waveguide having surface smoothness. SOLUTION: The manufacturing method of the polyimide substrate for optical use comprises performing at least one thermal treatment on the polyimide substrate at ≥250°C. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种聚酰亚胺基板的制造方法以制造具有表面光滑度的聚合物波导。解决方案：用于光学用途的聚酰亚胺基板的制造方法包括在≥250℃下对聚酰亚胺基板进行至少一次热处理。版权所有（C）2006，JPO＆NCIPI

17. 发明专利

JP2004161938A Polyimide 审中-公开
公开(公告)号：JP2004161938A
公开(公告)日：2004-06-10
申请号：JP2002331190
申请日：2002-11-14
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , YASUDA MASABUMI , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , C08G73/10 , C08K3/02
摘要： PROBLEM TO BE SOLVED: To improve insufficient adhesive properties of a polyimide to give a polyimide exhibiting excellent adhesive properties.
SOLUTION: More than 0 ppm but at most 100 ppm of a silicon element is incorporated into the polyimide. The polyimide contains the silicon element in an amount of more than 0 ppm but at most 150 ppm and therefore exhibits excellent adhesive properties to be widely employed in semiconductor or mounting circuit board applications.
COPYRIGHT: (C)2004,JPO

18. 发明专利

JP2013014776A Polyimide film, and copper-clad laminate using the same as substrate material 审中-公开
标题翻译：聚酰亚胺薄膜和使用相同材料的铜箔层压板
公开(公告)号：JP2013014776A
公开(公告)日：2013-01-24
申请号：JP2012194817
申请日：2012-09-05
申请人： Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B32B7/02 , B32B15/08 , B32B15/088 , B32B15/20 , B32B27/34
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film excellent in dimensional stability and suitable for a substrate for fine pitch circuit, particularly COF (Chip on film) in which wiring is carried out at naroow pitches in the width direction, and a copper-clad laminate using the same as a substrate material.SOLUTION: The polyimide film has a thermal expansion coefficient αMD in the machine transport direction (MD) of the film of 3 to 10 ppm/°C, and a thermal expansion coefficient αTD in the transverse direction (TD) of 10 to 20 ppm/°C. With the polyimide film used as a substrate material, copper of 1 to 10 μm in thickness is formed thereon.
摘要翻译：要解决的问题：为了提供尺寸稳定性优异并且适用于细间距电路的基板的聚酰亚胺膜，特别是在宽度方向上以纳罗孔间距进行布线的COF（膜上芯片），以及覆铜层压板使用其作为基底材料。解决方案：聚酰亚胺膜的膜的机器输送方向（MD）的热膨胀系数αMD为3〜10ppm /℃，横向（TD）的热膨胀系数αTD为10〜 20 ppm /°C。以聚酰亚胺薄膜为基材，在其上形成厚度为1〜10μm的铜。版权所有（C）2013，JPO＆INPIT

19. 发明专利

JP2008156559A High adhesion copolymerized polyimide film 审中-公开
标题翻译：高粘度共聚聚酰亚胺膜
公开(公告)号：JP2008156559A
公开(公告)日：2008-07-10
申请号：JP2006349576
申请日：2006-12-26
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SUEHIRO MORITSUGU , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00
摘要： PROBLEM TO BE SOLVED: To provide a high adhesion copolymerized polyimide film having improved adhesiveness to a copper foil and excellent slipperiness, dimensional stability and water wettability.
SOLUTION: The high adhesion polyimide film having a 200°C heat-shrinkage of ≤0.05% in both machine transportation direction (MD) and transverse direction (TD), a film surface roughness Ra of ≥0.065 μm and Rmax of ≥1.0 μm measured by a stylus-type surface roughness tester and a surface free energy of ≥80 mN/m measured by a contact angle method is produced from a polyimide film derived from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride by successively applying a sand-matting treatment, a relaxation treatment and a plasma treatment to the polyimide film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改善的对铜箔的粘合性和优异的滑爽性，尺寸稳定性和水润湿性的高粘合性共聚聚酰亚胺膜。
解决方案：在机器输送方向（MD）和横向（TD）上具有≤0.05％的200℃热收缩率的高粘合性聚酰亚胺膜，≥0.065μm的膜表面粗糙度Ra和≥ 由来自3,4'-二氨基二苯醚的聚酰亚胺膜，4,4'-二氨基二苯醚（4,4'-二氨基二苯基醚）制得的聚酰亚胺膜，由触针式表面粗糙度测定仪测得的1.0μm，接触角法测得的表面自由能为≥80mN/ 醚和均苯四甲酸二酐，通过对聚酰亚胺膜进行沙粒处理，松弛处理和等离子体处理。版权所有（C）2008，JPO＆INPIT

20. 发明专利

JP2008144050A Highly adhesive polyimide film and method for producing the same 审中-公开
标题翻译：高粘性聚酰亚胺膜及其制造方法
公开(公告)号：JP2008144050A
公开(公告)日：2008-06-26
申请号：JP2006333210
申请日：2006-12-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , SUEHIRO MORITSUGU
IPC分类号： C08J5/18 , C08J7/00 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having improved adhesiveness to a copper foil and excellent easy slipperiness, dimensional stability and water wettability and to provide a method for producing the polyimide film.
SOLUTION: The highly adhesive polyimide film is a polyimide film formed from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and comprising inorganic particles. The polyimide film has ≤0.05% heat shrinkage percentage at 200°C in both the mechanical transporting direction (MD) and the width direction (TD) of the film, ≥0.065 μm surface roughness Ra and ≥1.0 μm Rmax measured with a stylus type surface roughness meter, ≤1.0 coefficient of static friction and ≥80 mN/m surface free energy measured on the basis of a contact angle method.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改善的对铜箔的粘附性的聚酰亚胺膜和优异的易滑性，尺寸稳定性和水润湿性，并提供一种聚酰亚胺膜的制造方法。解决方案：高度粘合的聚酰亚胺膜是由3,4'-二氨基二苯醚，4,4'-二氨基二苯醚和均苯四酸二酐形成并包含无机颗粒的聚酰亚胺膜。聚酰亚胺膜在膜的机械输送方向（MD）和宽度方向（TD）的200℃下的热收缩率≤0.05％，表面粗糙度Ra≥0.065μm，用触针型测定的≥1.0μmRmax 表面粗糙度计，≤1.0静摩擦系数和≥80mN / m表面自由能测量基于接触角法。版权所有（C）2008，JPO＆INPIT

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