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11. 发明专利

JP2009185358A Tin and tin alloy plating bath, and electronic component formed with the plating film 有权
标题翻译：镀锌合金镀层和电镀元件与镀膜成膜
公开(公告)号：JP2009185358A
公开(公告)日：2009-08-20
申请号：JP2008028078
申请日：2008-02-07
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C23C18/48 , C23C18/52 , C25D3/60
摘要： PROBLEM TO BE SOLVED: To impart satisfactory film appearance stably with lapse of time to a grain refining agent of a film crystal to be added to a tin or tin alloy plating bath. SOLUTION: The tin or tin alloy plating bath includes (A) a stannous salt or a soluble salt comprised of a mixture composed of the stannous salt and a salt of a metal (for example, silver, copper, bismuth, etc.) selected from the groups VIII, IB, IIB, IIIA, IVA, VA from the fourth to the sixth period, (B) an acid or its salt, (C) a specific 2-mercaptobenzoazole derivative bonded with 3-6C alkylene with a mercapto group on the position 2 of benzoazole ring. Oxidation or cleavage is made to hardly arise by bonding of the 3-6C alkylene, and therefore, even if plating work progresses, the grain refining function lasts without declining, and the satisfactory film appearance can be of obtained stably with lapse of time. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了将待加入到锡或锡合金电镀液的膜晶体的晶粒细化剂经时地赋予令人满意的膜外观。锡或锡合金电镀浴包括（A）由亚锡盐和金属盐（例如银，铜，铋等）组成的混合物的亚锡盐或可溶性盐）选自第四至第六期的VIII，IB，IIB，IIIA，IVA，VA族，（B）酸或其盐，（C）与3-6C亚烷基键合的特异性2-巯基苯并恶唑衍生物与巯基在苯扎环2位上。通过3-6C亚烷基的键合几乎不发生氧化或裂解，因此即使电镀工作进行，晶粒细化功能也不会下降，可以随时间稳定地获得令人满意的膜外观。版权所有（C）2009，JPO＆INPIT

12. 发明专利

JP2005314750A Method for plating tin or tin alloy 有权
标题翻译：用于镀锡或锡合金的方法
公开(公告)号：JP2005314750A
公开(公告)日：2005-11-10
申请号：JP2004134251
申请日：2004-04-28
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： TSUJI SEIKI , NISHIKAWA TETSUJI , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D5/12 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To surely prevent a tin whisker from forming on an upper layer which is made of tin or a lead-free tin alloy and is formed on a plated underlayer of nickel.
SOLUTION: A method for plating tin or a tin alloy includes previously forming the plated underlayer of nickel on the surface of a base material and then forming tin or the tin alloy thereon, wherein the tin alloy is an alloy comprising tin and one or more metals selected from the group consisting of silver, bismuth, nickel, zinc, antimony and indium; and the plated underlayer of nickel includes at least one or more elements selected from the group consisting of boron, sulfur and iron therein at a rate of 0.01 to 3 wt.%. When a tin-copper alloy is plated as the upper layer, the plated underlayer of nickel is made to contain a very small amount of boron and sulfur. A very small amount of a particular element contained in the nickel film refines the crystal grains, and as a result, surely prevents a whisker from forming on a tin or tin alloy film of the upper layer.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了确保防止在锡或无铅锡合金制成的上层上形成锡晶须并形成在镀镍的底层上。电镀锡或锡合金的方法包括预先在基材表面上形成镀镍底层，然后在其上形成锡或锡合金，其中锡合金是包含锡和一种或更多选自银，铋，镍，锌，锑和铟的金属; 镍的镀层底层以0.01〜3重量％的比例含有选自硼，硫和铁中的至少一种以上的元素。当镀锡铜合金作为上层时，镍的镀层底层含有非常少量的硼和硫。包含在镍膜中的非常少量的特定元素可以改善晶粒，结果可以确保防止在上层的锡或锡合金膜上形成晶须。版权所有（C）2006，JPO＆NCIPI

13. 发明专利

JP2005139474A Tin alloy electroplating method 有权
标题翻译：锡合金电镀方法
公开(公告)号：JP2005139474A
公开(公告)日：2005-06-02
申请号：JP2003373979
申请日：2003-11-04
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , OBATA KEIGO
IPC分类号： C25D3/56 , C25D3/60 , C25D7/00 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To smoothly prevent the substitutive deposition on the anode and the increase in tin ion concentration in a plating bath regarding a tin alloy electroplating method.
SOLUTION: In the tin alloy electroplating method where an alloy of tin and a metal nobler than tin is electrodeposited, an anode chamber is separated from a plating tank via an anion exchange membrane, the anode using tin as the material is provided in the anode chamber, a tinning liquid, acid or the salt thereof is stored inside the anode chamber, the tin alloy plating liquid is stored inside the plating tank, and electroplating is performed. Since the metal nobler than tin and the anode are separated by the anion exchange membrane which does not allow cations to permeate, the migration of the noble metal cations are blocked by the anion exchange membrane, and the substitutive deposition of the noble metal at the anode can be prevented. Further, it is possible to block the migration of the tin ions to the side of the cathode by using the anion exchange membrane and eliminate an increase in the concentration of tin in the plating bath.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了顺利地防止在锡合金电镀方法中镀层中阳极上的替代沉积和锡离子浓度的增加。解决方案：在锡和锡比锡重金属的合金的锡合金电镀方法中，阳极室通过阴离子交换膜与镀槽分离，使用锡作为材料的阳极设置在阳极室，镀锡液，酸或其盐储存在阳极室内，锡合金电镀液储存在镀槽内，进行电镀。由于金属比锡和阳极由阴离子交换膜分离，阴离子交换膜不允许阳离子渗透，贵金属阳离子的迁移被阴离子交换膜阻挡，贵金属在阳极上的代用沉积可以防止。此外，可以通过使用阴离子交换膜阻止锡离子向阴极侧的迁移，并且消除镀液中锡的浓度的增加。版权所有（C）2005，JPO＆NCIPI

14. 发明专利

JP2013053336A Electrolytic copper plating bath and electronic part having electrodeposited film formed by the bath 有权
标题翻译：电泳铜管和电子部件具有由浴形成的电沉积膜
公开(公告)号：JP2013053336A
公开(公告)日：2013-03-21
申请号：JP2011191843
申请日：2011-09-02
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI
IPC分类号： C25D3/38 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To successfully achieve both copper filling in a via hole and uniform electrodeposition properties in a through hole in an electrolytic copper plating bath.SOLUTION: A tin or tin alloy plating bath is provided, which contains (A) a soluble copper salt, (B) an acid or the salt thereof, and (C) a specific phenanthrolinedione compound. Both copper filling in a via hole and uniform electrodeposition properties in a through hole are successfully achieved by containing the phenanthrolinedione compound, and productivity is improved by applying the electrolytic copper plating bath to a substrate in which the via hole and the through hole exist together.
摘要翻译：要解决的问题：在电解镀铜浴的通孔中成功地实现通孔中的铜填充和均匀的电沉积性能。解决方案：提供锡或锡合金电镀液，其包含（A）可溶性铜盐，（B）酸或其盐，和（C）特定的菲咯啉二酮化合物。通过含有菲咯啉二酮化合物，可以成功地实现通孔中的铜填充和通孔中均匀的电沉积性能，并且通过将电解铜电镀浴应用于其中存在通孔和通孔的基板而提高生产率。版权所有（C）2013，JPO＆INPIT

15. 发明专利

JP2010018885A Electrolytic copper coating film, method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coating film 审中-公开
标题翻译：电解铜涂膜，其制造方法和铜电解质制造电解铜涂膜
公开(公告)号：JP2010018885A
公开(公告)日：2010-01-28
申请号：JP2009141216
申请日：2009-06-12
申请人： Furukawa Electric Co Ltd:The , Ishihara Chem Co Ltd , 古河電気工業株式会社 , 石原薬品株式会社
发明人： SAITO TAKAHIRO , SUZUKI YUJI , INAI SHOYA , NISHIKAWA TETSUJI
IPC分类号： C25D1/04 , C25D1/00 , C25D3/38 , C25D5/50
CPC分类号： C25D7/0614 , C25D1/04 , C25D3/38 , C25D5/50 , C25D7/0635 , H05K1/0393 , H05K1/09 , H05K2201/0355 , H05K2203/1105
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic copper coating film that develops plasticity and flexibility equal to or greater than those of a rolled copper foil after applying the heat history in the circuit board fabrication process, especially a heat history that is equivalent to the heat history applied when adhering a polyimide film.
SOLUTION: In the electrolytic copper coating film manufactured by electrolytic deposition, the electrolytic copper coating film and a method for forming the same obtain crystal distribution having ≥70% of the heat treated crystal grains having a maximum crystal grain length of 10 μm or more when a heat treatment in which the LMP value shown in equation 1 is 9,000 or greater is applied. Equation 1 is LMP=(T+273)*(20+Log t) wherein, 20 is the material constant of copper, T is temperature (°C), and t is time (hr).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在电路板制造工艺中应用热历史之后，显影等于或大于轧制铜箔的塑性和柔性的电解铜涂膜，特别是等效的热历史涉及当粘附聚酰亚胺膜时施加的热历史。解决方案：在通过电解沉积制造的电解铜涂膜中，电解铜涂膜及其形成方法获得具有最大晶粒长度为10μm的热处理晶粒的≥70％的晶体分布以上，等式1所示的LMP值为9000以上的热处理。等式1是LMP =（T + 273）*（20 + Log t）其中，20是铜的材料常数，T是温度（℃），t是时间（hr）。版权所有（C）2010，JPO＆INPIT

16. 发明专利

JP2006183079A Substitution plating bath of bismuth for copper based stock material 有权
标题翻译：用于基于铜的材料的双相替代浴
公开(公告)号：JP2006183079A
公开(公告)日：2006-07-13
申请号：JP2004376489
申请日：2004-12-27
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA
IPC分类号： C23C18/31 , H01L21/288 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To form a white and dense bismuth film during the substitution plating of bismuth on a copper based stock material. SOLUTION: In the substitution plating bath of bismuth, soluble bismuth salt and base acid are contained, while a specified thio-amino carboxylic acid or its salt (methionine or the like), an aliphatic mercaptocarboxylic acid or its salt (such as mercaptosuccinic acid), sulfides (thiodiglycol, 4, 7-dithiadecane-1, 10-diol or the like), and thiouria derivative (1, 3-bis(3-pyridylmethyl)-2-thiourea or the like) is selected for a copper dissolving agent. Since the specified sulfur-containing compound is used for the copper dissolving agent, the electrode potential difference between the complexed copper ion and bismuth ion can be adequately adjusted, and a white and dense bismuth film can be obtained thereby. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在铜基原料的铋替代电镀期间形成白色和致密的铋膜。解决方案：在铋的置换镀浴中，含有可溶性铋盐和碱性酸，而特定的硫代氨基羧酸或其盐（甲硫氨酸等），脂族巯基羧酸或其盐（例如巯基琥珀酸），硫化物（硫二甘醇，4,7-二十二烷-1,10-二醇等）和硫脲衍生物（1,3-双（3-吡啶基甲基）-2-硫脲等）用于铜溶解剂。由于使用规定的含硫化合物作为铜溶解剂，所以可以适当地调整配位铜离子和铋离子之间的电极电位差，由此可以得到白色和致密的铋膜。版权所有（C）2006，JPO＆NCIPI

17. 发明专利

JP2004360055A Pretreatment-type copper plating method 有权
公开(公告)号：JP2004360055A
公开(公告)日：2004-12-24
申请号：JP2003163417
申请日：2003-06-09
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , UCHIDA MAMORU , OKADA TAKASHI , NAWAFUNE HIDEMI , AKAMATSU KENSUKE , HASHIMOTO MORIHITO
IPC分类号： C25D5/34 , C25D7/12 , H01L21/28 , H01L21/288 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To ensure leveling property and to prevent void formation in copper plating of electronic components.
SOLUTION: The pretreatment-type copper plating method comprises immersing a substrate in a pretreatment solution containing, as a leveler, benzotriazole or a 2-4C alkylene oxide adduct of triazolopyridine [e.g., 1,2,3-benzotriazole polyethoxylate or ω,ω'-bis(1,2,3-benzotriazole) polyethoxylate] and subjecting the substrate to copper electroplating. The preliminary adsorption of the novel benzotriazole or triazolopyridine adduct by treatment with a solution containing the compound makes it possible to ensure good leveling property and to prevent the void formation on a copper plating. A similar effect can be attained when the substrate is subjected to preliminary plating instead of the immersion of the substrate in the pretreatment solution.
COPYRIGHT: (C)2005,JPO&NCIPI

18. 发明专利

JP2005054256A Post treatment liquid for surface of tin or tin alloy plating, and posttreatment method 有权
标题翻译：后处理液体用于表面镀锡或锡合金涂层，以及后处理方法
公开(公告)号：JP2005054256A
公开(公告)日：2005-03-03
申请号：JP2003288252
申请日：2003-08-06
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TAMURA YASUSHI
IPC分类号： C25D5/48 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To prevent deterioration with the lapse of time in solder wettability on posttreatment for the surface of tin or tin alloy plating and to quicken and simplify the posttreatment.
SOLUTION: The posttreatment liquid is used to the posttreatment for a tin based plating face after the formation of a tin or tin alloy plating film on an object to be plated, and comprises at least one kind of resin for posttreatment selected from the group consisting of an acrylic resin, a maleic resin, an alkyd resin and a phenol resin having the average molecular weight in a specified range. Since the tin based plating face is surface-treated with the posttreatment liquid comprising the specified resin for posttreatment having the limited average molecular weight, deterioration with lapse of time in solder wettability in the plating face with the lapse of time can be prevented. Further, the deterioration in the solder wettability with the lapse of time can further effectively be prevented by limiting the acid value and softening point, the equivalent of hydroxyl groups and softening point or oil length in the resin for the posttreatment.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止锡或锡合金电镀表面的后处理时的焊料润湿性随时间的劣化，并且加快并简化后处理。解决方案：在待镀物体上形成锡或锡合金镀膜后，后处理液用于锡基电镀面的后处理，并且包括至少一种用于后处理的树脂，其选自由丙烯酸树脂，马来树脂，醇酸树脂和平均分子量在规定范围内的酚醛树脂组成的组。由于锡基电镀面用包含特定树脂的后处理液进行表面处理，后处理具有有限的平均分子量，因此可以防止电镀面中的焊料润湿性随时间的流逝随时间的劣化。此外，通过限制用于后处理的树脂中的酸值和软化点，等同的羟基和软化点或油长度，可以进一步有效地防止焊料润湿性随时间的劣化。版权所有（C）2005，JPO＆NCIPI

19. 发明专利

JP2006316315A Displacement-silver-plating bath 有权
标题翻译：位移镀银浴
公开(公告)号：JP2006316315A
公开(公告)日：2006-11-24
申请号：JP2005139697
申请日：2005-05-12
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA
IPC分类号： C23C18/42
摘要： PROBLEM TO BE SOLVED: To obtain a silver-plated film having a uniform, beautiful and glossy appearance by preventing discoloration and the unevenness of a color tone in a displacement-silver-plating process.
SOLUTION: A displacement-silver-plating bath containing a soluble silver salt and a complexing agent formed of a sulfur-containing compound such as thiourea further includes at least one of a chlorine-containing compound and a bromine-containing compound. The chlorine-containing compound contained in the displacement-silver-plating bath effectively prevents the discoloration of the silver film. The displacement-silver-plating bath also includes lactic acid, formic acid, a compound containing an amino group such as aspartic acid, and a compound containing a carboxyl group, which prevent the discoloration of the film, improve the unevenness of the plated film, and contribute to providing the plated film with a uniform, glossy and silver-white appearance.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过防止变色和位移镀银工艺中的色调不均匀，获得具有均匀，美观和光泽外观的镀银膜。解决方案：含有可溶性银盐和由含硫化合物如硫脲形成的络合剂的置换镀银浴还包括含氯化合物和含溴化合物中的至少一种。位移镀银浴中含有的含氯化合物有效地防止了银膜的变色。置换镀银浴还包括乳酸，甲酸，含有氨基的化合物如天冬氨酸和含有羧基的化合物，其防止膜的变色，改善了镀膜的不均匀性，并有助于提供均匀，光泽和银白色外观的镀膜。版权所有（C）2007，JPO＆INPIT

20. 发明专利

JP2004353071A Post-treatment solution for tin or tin-alloy plating surface, and post-treatment method 有权
公开(公告)号：JP2004353071A
公开(公告)日：2004-12-16
申请号：JP2003155605
申请日：2003-05-30
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TAMURA YASUSHI
IPC分类号： C25D5/48 , C25D7/00 , C25D7/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To superiorly secure solder wettability in post-treatment for a tin or tin-alloy plating surface and to speed up and simplify the post-treatment.
SOLUTION: The post-treatment solution for a tin-based plating surface is used for applying post-treatment to a plating surface of a tin or tin-alloy plating film formed on a material to be plated and contains a Diels-Alder addition product of 100 to 350 acid number prepared by subjecting at least one kind from among gum rosin, wood rosin, tall oil rosin and abietic acid to addition reaction with unsaturated carboxylic acids or to the addition reaction and esterification reaction. Because surface treatment is applied to the tin-based plating surface using the post-treatment solution containing the above addition product having a specific acid number, the solder wettability of the plating surface can be superiorly improved. In particular, the solder wettability can be further enhanced by specifying the softening point of the above addition product to 90 to 200°C.
COPYRIGHT: (C)2005,JPO&NCIPI

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