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1. 发明专利

JP2013044001A Tin and tin alloy plating bath, and electronic part with electrodeposited film formed with the bath 有权
标题翻译： TIN和TIN合金涂层浴和电子部件与电泳膜形成与浴
公开(公告)号：JP2013044001A
公开(公告)日：2013-03-04
申请号：JP2011180987
申请日：2011-08-22
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32
摘要： PROBLEM TO BE SOLVED: To improve the appearance of an electrodeposited film and the uniformity of electrodeposition in a wide range of current density region and stabilize the composition ratio of a tin alloy film in a tin or tin alloy plating bath.SOLUTION: The tin or tin alloy plating bath contains (A) a soluble salt composed of any of a tin salt and a mixture of a tin salt and a salt of a predetermined metal such as silver, copper, bismuth, and lead, (B) an acid or a salt thereof, and (C) a specific phenanthroline-dione compound. The film has excellent electrodeposition uniformity and good film appearance in a wide range of current density region because the phenanthroline-dione compound is contained. In the tin alloy plating, a uniform alloy composition can be obtained in a wide range of current density region.
摘要翻译：要解决的问题：为了改善电沉积膜的外观和在电流密度范围宽的电沉积的均匀性，并稳定锡或锡合金电镀浴中锡合金膜的组成比。锡或锡合金电镀液含有（A）由锡盐和锡盐与预定金属的盐（如银，铜，铋和铅）的盐的混合物组成的可溶性盐，（B）酸或其盐，和（C）特殊的菲咯啉二酮化合物。由于含有菲咯啉二酮化合物，该膜在电流密度范围宽的范围内具有优异的电沉积均匀性和良好的膜外观。在锡合金镀层中，可以在宽的电流密度范围内获得均匀的合金组成。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013023693A Imidazole ring-bonded type oxyalkylene compound and plating bath containing the compound 有权
标题翻译：咪唑环键合型氧化亚烷基化合物和包含化合物的包衣浴
公开(公告)号：JP2013023693A
公开(公告)日：2013-02-04
申请号：JP2011155990
申请日：2011-07-14
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/30 , C08G65/333 , C23C18/31 , C23C18/48 , C25D3/12 , C25D3/22 , C25D3/34 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/50 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To satisfy both of solubility in water and defoaming property and to make the management of plating solutions easy, in various kinds of plating baths.SOLUTION: A new imidazole ring-bonded type oxyalkylene compound includes an oxyalkylene chain selected from 2 to 4C alkylene, wherein an imidazole ring is bonded to the oxyalkylene chain through nitrogen atom at the third position and located at the terminal. When the oxyalkylene compound is used for various kinds of plating baths, foaming property is dominantly reduced while satisfactorily maintaining water solubility by introducing an imidazole ring group to the terminal in comparison with a conventional nonionic surfactant. When the oxyalkylene compound, in which an imidazole ring group exists in the molecule of a nonionic surfactant, is used for a copper plating bath for example, both of the action of the surfactant and leveling action are provided, and the plating solutions are easily managed.
摘要翻译：要解决的问题：为了满足在水中的溶解性和消泡性，并且能够在各种电镀浴中容易地进行电镀溶液的管理。解决方案：新的咪唑环键合氧化烯化合物包括选自2至4个亚烷基的氧化烯链，其中咪唑环通过位于末端的第三位的氮原子与氧化烯链结合。当将氧化烯化合物用于各种电镀浴时，与常规的非离子表面活性剂相比，通过将咪唑环引入末端，令人满意地保持水溶性，从而显着降低发泡性。当在非离子表面活性剂分子中存在咪唑环基的氧化烯化合物用于例如铜电镀浴时，提供表面活性剂的作用和流平作用，并且电镀溶液容易管理。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009191335A Plating solution and electronic parts 审中-公开
标题翻译：电镀解决方案和电子部件
公开(公告)号：JP2009191335A
公开(公告)日：2009-08-27
申请号：JP2008035092
申请日：2008-02-15
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/02 , C23C18/31 , C25D3/32
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic or electroless plating solution which has excellent temporal stability and a wide gloss range, shows uniform plating appearance, can effectively provide an intended coating film composition and contains no cyanide, and to provide electronic parts having a metal film which has been formed by using the same. SOLUTION: The plating solution includes a chemical compound shown by Formula (1) and one or more water-soluble salts of a metal selected from the group consisting of the Group VIII, IB, IIB, IIIA, IVA and VA in the fourth period to the sixth period. The water-soluble salt of the metal in the plating solution is that of tin, silver, gold, platinum, palladium or copper in particular. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的时间稳定性和宽光泽范围的电解或化学镀溶液，显示出均匀的电镀外观，可以有效地提供预期的涂膜组合物并且不含氰化物，并且提供电子部件具有通过使用其形成的金属膜。解决方案：电镀液包含式（1）所示的化合物和一种或多种选自第VIII，IB，IIB，IIIA，IVA和VA族的金属的水溶性盐，其中第四期至第六期。镀液中金属的水溶性盐特别是锡，银，金，铂，钯或铜的金属盐。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2006144073A Lead-free tin-silver based alloy or tin-copper based alloy electroplating bath 有权
标题翻译：无铅锡银合金或锡铜合金电镀浴
公开(公告)号：JP2006144073A
公开(公告)日：2006-06-08
申请号：JP2004335506
申请日：2004-11-19
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60
摘要： PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of silver or copper onto the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-silver based alloy or tin-copper based alloy electroplating bath. SOLUTION: The lead-free tin-silver based alloy or tin-copper based alloy electroplating bath is obtained by adding a nonionic surfactant(s) selected from distyrenated phenol polyalkoxylate whose HLB(Hydrophile-Lypophile Balance) is 7.3 to 15.2, tristyrenated phenol polyalkoxylate whose HLB is 7.0 to 10.4, distyrenated cresol polyalkoxylate whose HLB is 8.2 to 15.0, and a tristyrenated cresol polyalkoxylate whose HLB is 7.7 to 13.9 to a tin-silver based alloy or tin-copper based alloy electroplating bath comprising a stannous salt, a silver or copper salt and various acids. Since the nonionic surfactant(s) with the specified chemical structural species having the prescribed HLB is selectively added, the substitute precipitation of silver or copper onto an anode surface is prevented, and the consumption of silver or copper in the bath is suppressed, thus the composition of the plating bath can be stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了有效地防止在无铅锡 - 银基合金或锡 - 铜基合金中电镀处理时锡或铜在锡或锡合金阳极的表面上的替代沉淀电镀浴
解决方案：通过添加选自其中HLB（亲水亲油平衡平衡）为7.3〜15.2的二苯乙烯化苯酚聚烷氧基化物的非离子表面活性剂，得到无铅锡 - 银基合金或锡 - 铜基合金电镀浴， HLB为7.0〜10.4的三苯乙烯化苯酚聚烷氧基化物，HLB为8.2〜15.0的二苯乙烯化甲醇溶液，HLB为7.7〜13.9的三苯乙烯化甲醇溶液，其含锡亚锡盐或锡 - 铜系合金电镀浴，银或铜盐和各种酸。由于选择性地添加具有规定的HLB的特定化学结构种类的非离子表面活性剂，所以可以防止银或铜在阳极表面上的替代沉淀，并且抑制浴中的银或铜的消耗，因此镀液的组成可以稳定。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006265616A Lead-free tin ally elctroplating method and plating bath for suppressing dissolution current of anode used in the method 有权
标题翻译：无铅无铅焊接方法和镀层浴，用于抑制方法中使用的阳极溶解电流
公开(公告)号：JP2006265616A
公开(公告)日：2006-10-05
申请号：JP2005084399
申请日：2005-03-23
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , FUKAMI TAKUO , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60 , C25D7/00
CPC分类号： H01L2224/11462
摘要： PROBLEM TO BE SOLVED: To smoothly prevent the substitution deposition for noble metals in a tin (alloy) anode during electrodeposition in electroplating of the alloy of tin and metals (silver, bismuth, copper, etc.) nobler than the tin.
SOLUTION: The tin alloy elctroplating method comprises adding at least one dissolution current suppressing agent selected from the group consisting of glutamic acid-N, N-diacetic acid, methyl glycine-N, N-diacetic acid, aspartic acid and their salts to the tin electroplating bath to suppress the dissolution current of the anode and to attain the prevention of the substitution deposition of the noble metals to the anode during the electrodeposition. The dissolution current is suppressed by the addition of the suppressing agent and therefore, even if the anode current density is made lower than heretofore, the potential of the anode is shifted nobler than the natural electrode potential of the noble metal and thereby the substitution deposition to the anode of the nobler metal can be effectively prevented.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了比锡更贵的锡和金属（银，铋，铜等）的合金的电镀电镀期间，在锡（合金）阳极中的贵金属的替代沉积顺利地防止。解决方案：锡合金电镀方法包括加入至少一种选自谷氨酸-N，N-二乙酸，甲基甘氨酸-N，N-二乙酸，天冬氨酸及其盐的溶出电流抑制剂到锡电镀浴以抑制阳极的溶解电流，并且在电沉积期间防止贵金属向阳极的置换沉积。通过添加抑制剂来抑制溶解电流，因此即使阳极电流密度比以前更低，阳极的电位比贵金属的天然电极电位高，从而取代沉积为可以有效地防止贵族金属的阳极。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006052421A Lead-free tin-bismuth based alloy electroplating bath 有权
标题翻译：无铅锡合金电镀浴
公开(公告)号：JP2006052421A
公开(公告)日：2006-02-23
申请号：JP2004232959
申请日：2004-08-10
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of bismuth to the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-bismuth based alloy electroplating bath.
SOLUTION: Regarding the lead-free tin-bismuth based alloy electroplating bath, in a tin-bismuth binary alloy electroplating bath comprising: a stannous salt; a bismuth salt; and various acids, a nonionic surfactant composed of an alkylene oxide adduct of a specified chemical structural species having a prescribed HLB (Hydrophile-Lypophile-Balance) such as distyrenated phenol polyalkoxylate having an HLB of 7.3 to 15.6 and a cis-9-octadecenylamine polyalkoxylate having an HLB of 2.8 to 16.6 or composed of the polyalkoxylate of ethylenediamine having a cloud point of 15 to 30°C is added. Since the nonionic surfactant of a specified chemical structure species having a prescribed HLB or cloud point is selectively added, the substitute precipitation of bismuth on the surface of an anode is prevented, and the consumption of bismuth in the bath is suppressed, thus the composition in the plating bath can be stabilized.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在无铅锡 - 铋基合金电镀浴中有效地防止在电镀处理时锡或锡合金阳极的表面上的铋替代沉淀。解决方案：关于无铅锡 - 铋基合金电镀浴，在含有亚锡盐的锡 - 铋二元合金电镀浴中，铋盐和各种酸，具有规定的具有规定HLB（亲水亲油平衡）的化学结构物的烯化氧加合物如HLB为7.3至15.6的二苯乙烯化苯酚聚烷氧基化物和顺式-9-十八碳烯胺聚烷氧基化物的非离子表面活性剂 HLB为2.8〜16.6，或者由浊点为15〜30℃的乙二胺的聚烷氧基化物构成。由于选择性地添加具有规定的HLB或浊点的特定化学结构种类的非离子表面活性剂，因此可以防止铋在阳极表面上的替代沉淀，并且抑制沐浴中的铋的消耗，电镀液可以稳定。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005290505A Lead-tin alloy solder plating liquid 有权
标题翻译：铅锡合金焊接液
公开(公告)号：JP2005290505A
公开(公告)日：2005-10-20
申请号：JP2004109541
申请日：2004-04-02
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , Mitsubishi Materials Corp , 三菱マテリアル株式会社 , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： MASUDA AKIHIRO , OBINATA MASAYOSHI , YOSHIMOTO MASAKAZU , NAKAMURA YURI , TSUJI SEIKI , NISHIKAWA TETSUJI
IPC分类号： C25D3/60 , C25D3/56 , C25D7/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a lead-tin alloy solder plating liquid capable of forming lead-tin alloy solder plating films or lead-tin alloy solder bump electrodes each having a high current density, a smooth surface, and also having reduced variation in height. SOLUTION: The lead-tin alloy solder plating liquid is composed of: at least one kind selected from acids and the salts thereof; a soluble tin compound(s); a soluble lead compound(s); a nonionic surfactant(s); a formalin condensate of naphthalene sulfonic acid or the salt thereof; and water. The formalin condensate of naphthalene sulfonic acid or the salt thereof is comprised by 0.02 to 1.50 mass% to lead ions. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够形成铅锡合金焊料电镀膜或铅锡合金焊料凸块电极的铅锡合金焊料电镀液，每个电极具有高电流密度，光滑表面，并且还具有降低高度变化。铅锡合金焊料电镀液由以下组成：选自酸及其盐中的至少一种; 一种可溶性锡化合物; 可溶性铅化合物; 非离子表面活性剂; 萘磺酸的福尔马林缩合物或其盐; 和水。萘磺酸或其盐的福尔马林缩合物的含铅量为0.02〜1.50质量％。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2007046142A Silver-based plating bath containing no cyanide, plated body and plating method 有权
标题翻译：基于银的镀银浴，不含氰化物，镀层体和镀层方法
公开(公告)号：JP2007046142A
公开(公告)日：2007-02-22
申请号：JP2005234650
申请日：2005-08-12
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/46 , C23C18/42 , C23C18/48 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To provide a silver-based plating bath containing no cyanide, wherein the stability of silver ions is improved and a sufficient complexing ability is obtained, and the production cost is reduced and practical usability is excellent.
SOLUTION: The silver-based plating bath containing no cyanide comprises soluble salts including a silver salt and one or more kinds of sulfide compounds selected from the group comprising compounds each expressed by general formula (I) or the like, wherein n represents an integer of 2-4; R
1 and R
2 are same or different and each represent 1-3C alkyl group or 2-6C alkylene group which may be substituted with hydroxyl group; and M represents hydrogen, alkali metal, alkaline earth metal, ammonium or organic amine.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供不含氰化物的银系电镀液，其中银离子的稳定性得到改善并且获得了充分的络合能力，并且生产成本降低并且实用的可用性优异。不含氰化物的银基电镀液包含可溶性盐，包括银盐和一种或多种选自由通式（I）等表示的化合物的组的硫化物，其中n表示 2-4的整数; R SB 1和R SB 2相同或不同，分别表示可被羟基取代的1-3C烷基或2-6C亚烷基; M表示氢，碱金属，碱土金属，铵或有机胺。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006117980A Lead-free acidic tin-bismuth based alloy electroplating bath 有权
标题翻译：无铅酸性钛合金电镀浴
公开(公告)号：JP2006117980A
公开(公告)日：2006-05-11
申请号：JP2004305204
申请日：2004-10-20
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , FUKAMI TAKUO , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To prevent the substitute precipitation of bismuth on the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free acidic tin-bismuth based alloy electroplating bath.
SOLUTION: The lead-free acidic tin-bismuth based alloy electroplating bath is obtained by addition of a complexing agent selected from diethylenetriaminepentaacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetraminehexaacetic acid, N, N-dicarboxymethyl-L-glutamic acid, N, N-dicarboxymethyl-L-aspartic acid, hydroyethylidenediphosphonic acid, nitrilotris(methylenephosphonic acid), phosphonobutanetricarboxylic acid, hydroxyethylaminodimethylenephosphonic acid, diethylenetriaminepentamethylenephosphonic acid, N, N-dicarboxymethyl-L-alanine, hydroxyethyliminodiacetic acid, 1, 3-diamino-2-hydroxypropanetetraacetic acid, mercaptosuccinic acid and their salts. Specific kinds of aminocarboxylic acids, phosphonic acids or the like are selectively added thereto.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了防止在无铅酸性铋 - 铋基合金电镀浴中在电镀处理时在锡或锡合金阳极的表面上的铋替代沉淀。解决方案：通过加入选自二亚乙基三胺五乙酸，羟乙基乙二胺三乙酸，三亚乙基四胺六乙酸，N，N-二甲基甲基-L-谷氨酸，N，N，N-二甲基乙酰胺的合成电镀浴，得到无铅酸性锡 - 铋基合金电镀浴 N-二羧甲基-L-天冬氨酸，亚乙基二膦酸，次氮基三（亚甲基膦酸），膦酰基丁酸三羧酸，羟乙基氨基二亚甲基膦酸，二亚乙基三胺五亚甲基膦酸，N，N-二羧甲基-L-丙氨酸，羟乙基亚氨基二乙酸，1,3-二氨基-2-羟基丙基四乙酸，巯基琥珀酸及其盐。选择性地添加特定种类的氨基羧酸，膦酸等。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2010265491A Bath for tin or tin-alloy plating, and barrel-plating process using the plating bath 有权
标题翻译：用于镀锡或锡合金镀层的浴槽，以及使用镀锌浴的棒材工艺
公开(公告)号：JP2010265491A
公开(公告)日：2010-11-25
申请号：JP2009115600
申请日：2009-05-12
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , TSUJI SEIKI , SASAYAMA HIROAKI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To provide a plating bath which can enhance the uniformity and the like of a plated film in a wide range of current density, impart an adequate appearance and soldering characteristics to the plated film, and prevent the aggregation among electroconductive media and among articles to be plated, in a barrel-plating process. SOLUTION: A bath for tin or tin-alloy plating includes: (A) a soluble salt formed of either a stannous salt or a mixture of the stannous salt and a salt of a metal selected from the group consisting of silver, copper, bismuth, indium, zinc, antimony, nickel and lead; (B) an acid or a salt thereof; and (C) a dibenzazole disulfide sulfonate compound specifically such as dibenzothiazolyl disulphide disodium disulfonate. Because of including the compound (C), the plating bath can enhance the uniformity and smoothness of the film in the wide range of the current density, impart the superior appearance and soldering characteristics to the film, and prevent the aggregation among the electroconductive media, when having applied to a barrel-plating process. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够在宽的电流密度范围内提高电镀膜的均匀性等的镀液，赋予镀膜足够的外观和焊接特性，并且防止电镀膜之间的聚集导电介质和要镀覆的物品之间的电镀工艺。解决方案：用于锡或锡合金镀层的浴包括：（A）由亚锡盐或亚锡盐和选自银，铜的金属盐的混合物形成的可溶性盐，铋，铟，锌，锑，镍和铅; （B）酸或其盐; 和（C）二苯并唑二硫化物磺酸盐化合物，特别是二苯并噻唑基二硫化二磺酸二钠二钠。由于含有化合物（C），电镀液可以在电流密度的宽范围内提高膜的均匀性和平滑性，赋予膜优异的外观和焊接特性，并且防止导电介质之间的聚集，当应用于滚镀工艺时。版权所有（C）2011，JPO＆INPIT

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