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1. 发明专利

JP2003342743A Electroless tinning bath 有权
标题翻译：电熨斗浴
公开(公告)号：JP2003342743A
公开(公告)日：2003-12-03
申请号：JP2002149257
申请日：2002-05-23
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： OKADA TAKASHI , INAI SHOYA
IPC分类号： C23C18/52
摘要： PROBLEM TO BE SOLVED: To effectively prevent the conversion of a thin film into abnormal grains and the excessive precipitation thereof in an electroless tinning bath consisting essentially of organic sulfonic acid, soluble stannous salt and tioureas.
SOLUTION: As for organic sulfonic acid, the anion part of organic sulfonic acid having a hydroxyl group in the molecule is not contained, also, the anion part of alkanesulfonic acid is not contained, organic acid having a hydroxyl group is a mixture satisfying the molar ratio of aromatic oxysulfonic acid/ alkanolsulfonic acid = 0 to 0.1 expressed in terms of anions, and the contained molar quantities per unit liter of soluble stannous salt and alkanolsulfonic acid (expressed in terms of anions) and thioureas satisfy Sn
2+ /alkanolsulfonic acid/ thioureas = 0.01 to 2/1.4 to 8/0.6 to 5. The occurrence of the abnormal grains of a tin film and the excessive precipitation thereof can be prevented since the anion part of alkanesulfonic acid is not present in a plating bath, and alkanolsulfonic acid or aromatic oxysulfonic acid in the range of a small amount with this are contained, and also, the three essential compositions are controlled to the prescribed contained molar quantities (per unit litre).
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了有效地防止在基本上由有机磺酸，可溶性亚锡盐和硫脲组成的化学镀锡浴中将薄膜转化成异常晶粒和过度沉淀。解决方案：对于有机磺酸，不包含分子中具有羟基的有机磺酸的阴离子部分，也不含烷基磺酸的阴离子部分，具有羟基的有机酸为混合物满足以阴离子表示的芳香族磺基磺酸/烷醇磺酸= 0〜0.1的摩尔比，每单位升可溶性亚锡盐和链烷醇磺酸（以阴离子表示）和硫脲的摩尔量满足Sn 2 + /链烷醇磺酸/硫脲= 0.01〜2 / 1.4〜8 / 0.6〜5。可以防止锡膜异常晶粒的发生及其过度析出，因为烷烃磺酸的阴离子部分为不存在于电镀槽中，并且含有少量的烷醇磺酸或芳香族磺基磺酸，并且将三种必需组合物控制为规定的含摩尔量（单位升）。版权所有（C）2004，JPO

2. 发明专利

JP2004068056A Electroless tinning bath 有权
公开(公告)号：JP2004068056A
公开(公告)日：2004-03-04
申请号：JP2002226530
申请日：2002-08-02
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： OKADA TAKASHI , INAI SHOYA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To prevent the conversion of a tin film into abnormal grains and the excessive precipitation thereof in an electroless tinning bath fundamentally consisting of organic sulfonic acid, soluble stannous salt and thioureas.
SOLUTION: The organic sulfonic acid which comprises the anion part of an organic sulfonic acid having a hydroxyl group in the molecule, also does not comprise the anion part of alkane sulfonic acid, and has a hydroxyl group is a mixture satisfying aromatic oxysulfonic acid/alkanol sulfonic acid=0 to 0.44 molar ratio expressed in terms of an anion. Hypophosphorous acids are comprised in a bath, and the content molar ratio between soluble stannous salt (Sn
2+ ) and hypophosphorous acids, Sn
2+ /hypophosphorous acids≥0.21. In the plating bath, alkane sulfonic acid is not present, and alkanol sulfonic acid or aromatic oxysulfonic acid within a prescribed range are comprised, and also, the content molar ratio between hypophosphorous acids and Sn
2+ is controlled to the prescribed one, so that the production of the abnormal grains of a thin film and the excessive precipitation thereof can be prevented.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2004360055A Pretreatment-type copper plating method 有权
公开(公告)号：JP2004360055A
公开(公告)日：2004-12-24
申请号：JP2003163417
申请日：2003-06-09
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , UCHIDA MAMORU , OKADA TAKASHI , NAWAFUNE HIDEMI , AKAMATSU KENSUKE , HASHIMOTO MORIHITO
IPC分类号： C25D5/34 , C25D7/12 , H01L21/28 , H01L21/288 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To ensure leveling property and to prevent void formation in copper plating of electronic components.
SOLUTION: The pretreatment-type copper plating method comprises immersing a substrate in a pretreatment solution containing, as a leveler, benzotriazole or a 2-4C alkylene oxide adduct of triazolopyridine [e.g., 1,2,3-benzotriazole polyethoxylate or ω,ω'-bis(1,2,3-benzotriazole) polyethoxylate] and subjecting the substrate to copper electroplating. The preliminary adsorption of the novel benzotriazole or triazolopyridine adduct by treatment with a solution containing the compound makes it possible to ensure good leveling property and to prevent the void formation on a copper plating. A similar effect can be attained when the substrate is subjected to preliminary plating instead of the immersion of the substrate in the pretreatment solution.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004332022A Two-step electroless tin plating method 有权
公开(公告)号：JP2004332022A
公开(公告)日：2004-11-25
申请号：JP2003127136
申请日：2003-05-02
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： OKADA TAKASHI , INAI SHOYA , ISHIWATARI SOSUKE
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To prevent pseudo whiskers and unevenness of color tones in an electroless tinning film. SOLUTION: A two-step electroless tin plating method is constituted by combining: a stage where tinning is applied to the object to be plated in a film thickness of ≤0.3 μm with a first bath of electroless tinning which comprises soluble stannous salt and alkanesulfonic acid; and a stage where tinning is applied with a second bath which comprises soluble stannous salt and alkanolsulfonic acid but does not comprise alkanesulfonic acid. Pseudo whiskers in the tin film are prevented and the appearance of the film can satisfactorily be held by the combination of the control of the film thickness in the plating stage using the first bath and the plating in the second bath different in the composition. A similar effect can be obtained by performing two-step plating in which the form of containing a surfactant is changed or the containing concentration of hypophosphorous acid is changed. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2004162148A Electroless tin-plating bath 有权
公开(公告)号：JP2004162148A
公开(公告)日：2004-06-10
申请号：JP2002331592
申请日：2002-11-15
申请人： Ishihara Chem Co Ltd , 石原薬品株式会社
发明人： OKADA TAKASHI , INAI SHOYA
IPC分类号： C23C2/20 , C23C2/24
摘要： PROBLEM TO BE SOLVED: To effectively prevent a phenomenon of abnormal particles formation or excessive precipitation on a tin film obtained by using an electroless tin-plating bath.
SOLUTION: The electroless tin-plating bath includes a soluble stannous salt, an organic sulfonic acid and thioureas, wherein the organic sulfonic acid includes the anion part of an alkanol-sulfonic acid, but not the anion part of an alkanesulfonic acid, and the bath further includes a carboxylic acid along with the alkanol-sulfonic acid. The alkanol-sulfonic acid is preferably a 1-5C alkanol-sulfonic acid, and the carboxylic acid is preferably an aliphatic hydroxy-carboxylic acid or an aliphatic polycarboxylic acid. Because of excluding the alkanesulfonic acid and including the alkanol-sulfonic acid together with the carboxylic acid, the bath effectively prevents abnormal deposition of the tin film.
COPYRIGHT: (C)2004,JPO

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