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    • 12. 发明专利
    • Electroless plating treatment method and electroless plating treatment material
    • 电镀镀层处理方法和电镀镀层处理材料
    • JP2013124390A
    • 2013-06-24
    • JP2011273643
    • 2011-12-14
    • Toyota Motor Corpトヨタ自動車株式会社Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • YOSHINAGA FUMITAKAYANAGIMOTO HIROSHIMITSUOKA TAKUYA
    • C23C18/20
    • PROBLEM TO BE SOLVED: To provide a treatment method of performing an electroless plating capable of improving adhesion of a plated coating formed by the electroless plating and of forming a highly adhesive plated coating even on a resin including no nitrogen such as a hydrocarbon resin.SOLUTION: The treatment method includes at least the steps of: oxidizing a treatment surface 31 of a resin substrate 3; treating the oxidized treatment surface 31 with alkali; contacting the alkali-treated treatment surface 31 with a solution containing allylamine polymer 4 with a molecular weight of 1,600 or less; adsorbing a metallic catalyst onto the treatment surface contacted with the solution and into a surface layer 32 of the treatment surface 31; and performing an electroless plating on the treatment surface 31 on which the metallic catalyst is adsorbed.
    • 要解决的问题:提供一种执行无电解电镀的处理方法,其能够提高通过无电镀形成的镀覆涂层的粘附性,并且甚至在不含氮的树脂上形成高度粘合的镀覆涂层,例如烃 树脂。 解决方案:处理方法至少包括以下步骤:氧化树脂基板3的处理表面31; 用碱处理氧化处理表面31; 使碱处理表​​面31与分子量为1600以下的含有烯丙胺聚合物4的溶液接触; 将金属催化剂吸附在与溶液接触的处理表面上并进入处理表面31的表面层32; 并在其上吸附有金属催化剂的处理表面31上进行化学镀。 版权所有(C)2013,JPO&INPIT
    • 13. 发明专利
    • Electroless nickel plating method and electroless nickel plating material
    • 电镀镍镀层方法和电镀镍镀层材料
    • JP2013091841A
    • 2013-05-16
    • JP2011236212
    • 2011-10-27
    • Toyota Motor Corpトヨタ自動車株式会社
    • YOSHIOKA TAKAYASUYANAGIMOTO HIROSHI
    • C23C18/32H05K3/18
    • PROBLEM TO BE SOLVED: To provide an electroless nickel plating method able to obtain a nickel plating film in which the decrease in thermal conductivity is suppressed even when elements such as power elements are bonded to the nickel plating film by soldering.SOLUTION: The electroless nickel plating method at least includes a process for immersing a treated surface of a base material in an electroless nickel plating solution containing a carbon element to coat the treated surface with the nickel plating film by electroless plating. The electroless nickel plating method uses the electroless nickel plating solution repeatedly in the process to coat the nickel plating film. In the process to coat the nickel plating film, the nickel plating film is coated while regulating the amount of eutectoid carbon during coating the nickel plating film.
    • 要解决的问题:提供一种能够获得即使当通过焊接将诸如功率元件的元件结合到镀镍膜上时导热性降低也被抑制的镀镍膜的化学镀镍方法。 解决方案:化学镀镍方法至少包括将基材的处理表面浸入含有碳元素的无电镀镍溶液中以通过无电镀将镀镍膜涂覆在处理表面上的方法。 无电镀镍方法在镀镍膜的过程中重复使用化学镀镍液。 在镀镍膜的过程中,镀镍镀膜,同时在镀镍膜的同时调节共析碳的量。 版权所有(C)2013,JPO&INPIT
    • 14. 发明专利
    • Method of identifying internal strain of amorphous material
    • 鉴定非晶材料内应变的方法
    • JP2013002950A
    • 2013-01-07
    • JP2011134286
    • 2011-06-16
    • Toyota Motor Corpトヨタ自動車株式会社
    • SATO YUKIYANAGIMOTO HIROSHI
    • G01N23/20
    • PROBLEM TO BE SOLVED: To provide a method of precisely identifying internal strain of an amorphous material that constitutes a laminate film formed by laminating the amorphous material on a polycrystalline material.SOLUTION: The method of identifying internal strain of an amorphous material in a laminate film formed by laminating the amorphous material on a polycrystalline material includes: a first step of using X-ray diffraction method to measure first internal strain of the polycrystalline material 1; a second step of preparing a laminate film 5 by forming the amorphous material 2 on the polycrystalline material 1'; a third step of using the X-ray diffraction method to measure second internal strain of the polycrystalline material 1' constituting the laminate film 5; and a fourth step of identifying internal strain of the amorphous material 2 from a difference between the first and second internal strains.
    • 要解决的问题:提供一种精确地识别构成通过将非晶材料层压在多晶材料上而形成的层压膜的非晶材料的内部应变的方法。 解决方案:通过将非晶材料层压在多晶材料上形成的层压膜中鉴定非晶材料的内部应变的方法包括:使用X射线衍射法测量多晶材料的第一内部应变的第一步骤 1; 通过在多晶材料1'上形成非晶材料2来制备层压膜5的第二步骤; 使用X射线衍射法测量构成层叠膜5的多晶材料1'的第二内部应变的第三步骤; 以及从第一和第二内部应变之间的差异鉴定非晶材料2的内部应变的第四步骤。 版权所有(C)2013,JPO&INPIT
    • 15. 发明专利
    • Method of plating on resin base material
    • 树脂基材料涂层方法
    • JP2010031306A
    • 2010-02-12
    • JP2008192600
    • 2008-07-25
    • Toyota Motor Corpトヨタ自動車株式会社
    • YANAGIMOTO HIROSHIBESSHO TAKESHITAKADA TOMOJI
    • C25D5/56B32B38/00C23C18/30C25D5/12
    • PROBLEM TO BE SOLVED: To provide a method of plating on a resin base material by which a smoothed plated surface is obtained even on the roughened surface of the resin base material without etching as a pretreatment step. SOLUTION: The method of plating on the resin base material at least includes: a step S12 of carrying out an ozone water treatment on the surface of the resin base material having unsaturated bond; a step S14 of carrying out a catalyst adsorption treatment of adsorbing a metal catalyst on the treating surface; a step S15 of carrying out electroless plating treatment on the treating surface after catalyst adsorption treatment; a first electroplating treatment step S16 of carrying out semi-lustrous metal plating treatment on the treating surface after electroless plating treatment so that the center line average surface roughness Ra becomes 0.1-0.5 μm; and a second electroplating treatment step S17 of carrying out lustrous metal plating treatment on the treating surface after the first electroplating treatment so that the center line average surface roughness Ra becomes ≤0.03 μm. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种电镀在树脂基材上的方法,即使在树脂基材的粗糙化表面上也可获得平滑的电镀表面,而不进行蚀刻作为预处理步骤。 解决方案:在树脂基材上的电镀方法至少包括:在具有不饱和键的树脂基材的表面上进行臭氧水处理的步骤S12; 执行在处理表面上吸附金属催化剂的催化剂吸附处理的步骤S14; 催化剂吸附处理后的处理面进行化学镀处理的步骤S15; 第一电镀处理步骤S16,其在化学镀处理之后在处理表面上进行半光泽金属电镀处理,使得中心线平均表面粗糙度Ra变为0.1-0.5μm; 以及在第一次电镀处理后对处理面进行光泽金属镀处理的中间线平均表面粗糙度Ra变得≤0.03μm的第二电镀处理工序S17。 版权所有(C)2010,JPO&INPIT
    • 17. 发明专利
    • 金属被膜の成膜装置および成膜方法
    • 金属镀膜薄膜沉积装置及膜沉积方法
    • JP2015040311A
    • 2015-03-02
    • JP2013170336
    • 2013-08-20
    • トヨタ自動車株式会社Toyota Motor Corp
    • HIRAOKA MOTOKIYANAGIMOTO HIROSHISATO YUKI
    • C25D5/06C25D17/00C25D21/00
    • C25D5/04C25D3/00C25D5/08C25D5/22C25D17/00C25D17/002C25D17/007C25D17/12C25D17/14C25D21/04
    • 【課題】ボイドまたはピンホールなどの欠陥が生成され難い金属被膜を成膜することができる金属被膜の成膜装置およびその成膜方法を提供する。【解決手段】陽極11と、陰極となる基材Bと、の間において陽極11の表面に固体電解質膜13を配置し、固体電解質膜13を基材Bに接触させる。これと共に、陽極11と基材Bとの間に電圧を印加し、固体電解質膜13を基材Bに接触した状態で固体電解質膜13の内部に含有された金属イオンから金属を前記基材の表面に析出させて金属被膜Fを基材Bの表面に成膜する。金属被膜Fの成膜時に、固体電解質膜13と基材Bとを接触状態から非接触状態にすることにより金属被膜Fの成膜を中断し、成膜の中断後、接触状態とは異なる接触状態となるように固体電解質膜13と基材Bの接触状態を変更し、変更した接触状態で金属被膜Fの成膜を再開する。【選択図】図3
    • 要解决的问题:提供一种能够沉积金属涂膜的金属涂膜的薄膜沉积设备和薄膜沉积方法,所述金属涂膜不可能产生诸如空隙或针孔等的几代缺陷。溶解性:固体电解质膜13 布置在阳极11和作为阴极设置的基板B之间的阳极11的表面上,并且固体电解质膜13与基板B接触。在阳极11和基板B之间同时施加电压,并且 金属涂膜F通过在固体电解质膜13与基板B接触的状态下,通过在包含金属离子的金属离子到基板表面上的沉淀而沉积在基板B的表面上 在固体电解质膜13的内部。在金属涂膜F的沉积时,固体电解质膜13和基板B的接触状态切换到非接触状态 te,以便中断金属涂膜F的沉积,并且在膜沉积中断之后,固体电解质膜13和基板B的接触状态被切换到与初始接触状态不同的接触状态,并且 在切换接触状态下恢复金属涂膜F的沉积。
    • 18. 发明专利
    • Film formation apparatus for metal film and film formation method
    • 用于金属膜和膜形成方法的膜形成装置
    • JP2014185371A
    • 2014-10-02
    • JP2013061534
    • 2013-03-25
    • Toyota Motor Corpトヨタ自動車株式会社
    • SATO YUKIHIRAOKA MOTOKIYANAGIMOTO HIROSHI
    • C25D17/00
    • C25D5/00C25D3/00C25D3/38C25D7/00C25D17/00C25D17/002C25D17/10C25D17/12
    • PROBLEM TO BE SOLVED: To provide a film formation apparatus for a metal film which can form a metal film of a desired film thickness continuously on the surfaces of a plurality of substrates and allows increasing the film formation speed while suppressing occurrence of abnormalities in the metal film and a method of forming the metal film.SOLUTION: A film formation apparatus 1A includes an anode 11, a solid electrolyte membrane 13 arranged with a metal ion solution L on the side of the anode 11 between the anode 11 and a substrate B serving as a cathode and a power source part E applying a voltage between the anode 11 and the substrate B, and a metal film F composed of the metal of the metal ion is formed by applying a voltage between the anode 11 and the substrate B to precipitate the metal ion as the corresponding metal onto the surface of the substrate B. The anode 11 consists of a base material 11a which has insolubility in the metal ion solution L and is coated with a metal plating film 11c composed of the same metal as that of the metal film F.
    • 要解决的问题:为了提供能够在多个基板的表面上连续地形成期望的膜厚的金属膜的金属膜的成膜装置,并且可以在抑制金属的异常发生的同时提高成膜速度 膜和形成金属膜的方法。溶液:成膜装置1A包括阳极11,固体电解质膜13,其在阳极11和基板B之间的阳极11侧配置有金属离子溶液L, 作为在阳极11和基板B之间施加电压的阴极和电源部分E,并且通过在阳极11和基板B之间施加电压来形成由金属离子的金属构成的金属膜F以沉淀 作为相应的金属的金属离子作为相应的金属涂覆到基底B的表面上。阳极11由在金属离子溶液L中具有不溶性并涂有金属铂的基材11a g膜11c由与金属膜F相同的金属构成。