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121. 发明专利

JP4355777B2 Method of fabricating a scalable wide array ink jet print head 有权
公开(公告)号：JP4355777B2
公开(公告)日：2009-11-04
申请号：JP2008165982
申请日：2008-06-25
申请人：ヒューレット・パッカード・カンパニーHewlett−Packard Company
发明人：ティモシー・イー・ビアリング , ティモシー・エル・ウェーバー , メリッサ・ディー・ボイド
IPC分类号： B41J2/05 , B41J2/16 , B41J2/14 , B41J2/155
CPC分类号： B41J2/14129 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1637 , B41J2/1643 , B41J2002/14387 , B41J2202/18 , B41J2202/19 , B41J2202/20 , B41J2202/21 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , Y10T29/49401 , H01L2924/00014 , H01L2924/00
摘要： A scalable wide-array printhead (12) is formed by mounting multiple thermal inkjet printheads (18) to a carrier substrate (20). The printheads are mounted to one face (28) and logic ICs (29) and drive ICs (30) are mounted to an opposite face (72). Interconnects (90) are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots (32). A solder bump (78) mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot (42).

122. 发明专利

JP2009252757A Piezoelectric element and manufacturing method thereof, piezoelectric actuator, and liquid jet head 审中-公开
标题翻译：压电元件及其制造方法，压电致动器和液体喷射头
公开(公告)号：JP2009252757A
公开(公告)日：2009-10-29
申请号：JP2008094619
申请日：2008-04-01
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： NAKAYAMA MASAO
IPC分类号： H01L41/09 , B41J2/045 , B41J2/055 , B41J2/135 , B41J2/14 , B41J2/145 , B41J2/16 , H01L41/18 , H01L41/187 , H01L41/22 , H01L41/332
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2202/11 , H01L41/0973 , H01L41/314 , H01L41/332 , Y10T29/42
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric element which suppresses deterioration in characteristics, and to provide a manufacturing method thereof. SOLUTION: The piezoelectric element 100 has a substrate 10; a lower electrode 20 formed above the substrate 10; a piezoelectric layer 30 formed above the lower electrode 20; and an upper electrode 40, formed above and at least in a portion of the piezoelectric layer 30, wherein the piezoelectric layer 30 has a first portion 32, formed between the lower electrode 20 and the upper electrode 40 and a second portion 34 continuously formed outside the first portion 32, and the second portion 34 covers at least a portion of the lower electrode 20, and a thick film of the second portion 34 has a film thickness which is smaller than the film thickness of the first portion 32. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供抑制特性劣化的压电元件，并提供其制造方法。解决方案：压电元件100具有基板10; 形成在基板10上方的下电极20; 形成在下电极20的上方的压电层30; 以及形成在压电层30的上方且至少部分地形成的上部电极40，其中压电层30具有形成在下部电极20和上部电极40之间的第一部分32和连续形成在外部的第二部分34 第一部分32和第二部分34覆盖下部电极20的至少一部分，并且第二部分34的厚膜的膜厚小于第一部分32的膜厚度。版权所有（C）2010，JPO＆INPIT

123. 发明专利

JP2009239208A Piezoelectric actuator manufacturing method and liquid ejection head 审中-公开
标题翻译：压电致动器制造方法和液体喷射头
公开(公告)号：JP2009239208A
公开(公告)日：2009-10-15
申请号：JP2008086713
申请日：2008-03-28
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： MITA TAKESHI
IPC分类号： H01L41/09 , B41J2/045 , B41J2/055 , B41J2/135 , B41J2/14 , B41J2/145 , B41J2/16 , H01L41/18 , H01L41/22 , H01L41/29 , H01L41/39
CPC分类号： B41J2/161 , B41J2/14233 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14266 , B41J2002/14411 , B41J2202/21 , H01L41/0973 , H01L41/319 , Y10T29/42 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric actuator that has a piezoelectric body film provided between two layers of electrode films, and that is capable of maintaining reliability of the electric actuator and of simultaneously reducing electric resistance of a wiring portion for supplying current to an electrode film, and to provide a liquid ejection head. SOLUTION: The piezoelectric actuator 12 has a structure (upper address structure) in which a lower electrode film 110 serves as a common electrode and an upper electrode film 121 serves as an individual electrode. The upper electrode film 121 is connected to an upper wiring 122. The upper wiring 122 is connected to an external wiring (e.g., a flexible cable). In contrast, the lower electrode film 110 corresponding to each pressure chamber 130 is connected to lower wirings 124 formed on the upper surface of the piezoelectric body film 112. The lower wirings 124 are mutually electrically connected and grounded. The upper wiring 122 and lower wirings 124 are formed by electrolytic plating to have a thickness of, for example, 2 to 3 μm, greater than the upper electrode film 121 and lower electrode film 110. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种制造压电致动器的方法，该压电致动器具有设置在两层电极膜之间的压电体膜，并且能够保持电致动器的可靠性并同时降低电致动器的电阻用于向电极膜提供电流的布线部分，以及提供液体喷射头。解决方案：压电致动器12具有下电极膜110用作公共电极并且上电极膜121用作单独电极的结构（上地址结构）。上电极膜121连接到上布线122.上布线122连接到外部布线（例如，柔性电缆）。相反，对应于每个压力室130的下电极膜110连接到形成在压电体膜112的上表面上的下布线124.下布线124相互电连接并接地。上布线122和下布线124通过电解镀形成比例如上电极膜121和下电极膜110的厚度例如2至3μm。（C）2010， JPO和INPIT

124. 发明专利

JP4303287B2 Method of manufacturing a drop attachment device for a member 有权
公开(公告)号：JP4303287B2
公开(公告)日：2009-07-29
申请号：JP2006520882
申请日：2004-07-19
申请人：ザールテクノロジーリミテッド
发明人：ポール・レイモンド・ドラリー
IPC分类号： B41J2/135 , B41J2/14 , B41J2/16
CPC分类号： B41J2/1632 , B41J2/1433 , B41J2/162 , B41J2/1625 , B41J2/1631 , B41J2/1643 , C25D1/08 , Y10T29/49401

125. 发明专利

JP4288077B2 Processing method of the device 有权
公开(公告)号：JP4288077B2
公开(公告)日：2009-07-01
申请号：JP2002586693
申请日：2002-04-26
申请人：ヒューレット・パッカード・カンパニーHewlett−Packard Company
发明人：パン，アルフレッド・イ‐ツン
IPC分类号： B41J2/16 , B41J2/05 , B41J2/14 , H05K1/18 , H05K3/28
CPC分类号： B41J2/16 , B41J2/14072 , B41J2/1643 , H05K1/184 , H05K1/189 , H05K3/28 , H05K2201/0397 , H05K2201/10674 , H05K2203/135 , Y10T29/49083 , Y10T29/49146 , Y10T29/49171 , Y10T29/49401

126. 发明专利

JP4274555B2 Method of manufacturing a manufacturing method and a liquid discharge device of the liquid discharge element substrate 有权
公开(公告)号：JP4274555B2
公开(公告)日：2009-06-10
申请号：JP2004210087
申请日：2004-07-16
申请人：キヤノン株式会社
发明人：博和小室
IPC分类号： B41J2/16 , B41J2/05
CPC分类号： B41J2/1646 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1643 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , Y10T29/49401

128. 发明专利

JP2008307694A Nozzle plate and its manufacturing method 有权
标题翻译：喷嘴板及其制造方法
公开(公告)号：JP2008307694A
公开(公告)日：2008-12-25
申请号：JP2007154875
申请日：2007-06-12
申请人： Brother Ind Ltd , ブラザー工業株式会社
发明人： NAKAMOTO HIKARI
IPC分类号： B41J2/135
CPC分类号： B41J2/1606 , B41J2/1433 , B41J2/162 , B41J2/1625 , B41J2/1643
摘要： PROBLEM TO BE SOLVED: To prevent discharge of a droplet from being hindered due to adhesion of foreign matter to a water-repellent film or damage of the water-repellent film in wiping operation. SOLUTION: The nozzle plate P has a substrate 1 where a nozzle hole 2 is formed, a nickel film 6 formed on a discharge surface 1a where a discharge opening 2c is formed on the substrate 1, and the water-repellent film 3 formed by electrolytic plating on the nickel film 6. By adjusting current density in the electrolytic plating in a water-repellent film forming stage, a through-hole 3a constituted of a straight part 3c succeeding to the nozzle hole 2 and having the same diameter as the discharge opening 2c, and an enlarged-diameter part 3b located on an opposite side to the nozzle hole 2 while putting the straight part 3c in between and having a diameter getting larger as it is separated from the straight part 3c, is formed on the water-repellent film 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止由于异物粘附到防水膜上而使液滴的排出受到阻碍，或者在擦拭操作中损坏了防水膜。解决方案：喷嘴板P具有形成喷嘴孔2的基板1，形成在基板1上形成有排出口2c的排出面1a上的镍膜6和防水膜3 通过在镍膜6上进行电解电镀而形成。通过在防水膜形成阶段中调整电解电镀中的电流密度，形成由喷嘴孔2之后的直线部分3c构成的直通孔3a，排出口2c和位于喷嘴孔2的相反侧的扩大直径部分3b，同时将直线部分3c放置在其间并且具有与直线部分3c分离的直径变大的直径部分3b 防水膜3.版权所有（C）2009，JPO＆INPIT

129. 发明专利

JP4202485B2 Scalable wide array ink jet print head and manufacturing method thereof 有权
公开(公告)号：JP4202485B2
公开(公告)日：2008-12-24
申请号：JP30051498
申请日：1998-10-22
申请人：ヒューレット・パッカード・カンパニーHewlett−Packard Company
发明人：ティモシー・イー・ビアリング , ティモシー・エル・ウェーバー , メリッサ・ディー・ボイド
IPC分类号： B41J2/05 , B41J2/14 , B41J2/155 , B41J2/16
CPC分类号： B41J2/14129 , B41J2/14024 , B41J2/14072 , B41J2/14145 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1637 , B41J2/1643 , B41J2002/14387 , B41J2202/18 , B41J2202/19 , B41J2202/20 , B41J2202/21 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , Y10T29/49401 , H01L2924/00014 , H01L2924/00
摘要： A scalable wide-array printhead (12) is formed by mounting multiple thermal inkjet printheads (18) to a carrier substrate (20). The printheads are mounted to one face (28) and logic ICs (29) and drive ICs (30) are mounted to an opposite face (72). Interconnects (90) are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots (32). A solder bump (78) mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot (42).

130. 发明专利

JP4193890B2 The ink-jet head 有权
公开(公告)号：JP4193890B2
公开(公告)日：2008-12-10
申请号：JP2006222376
申请日：2006-08-17
申请人：ブラザー工業株式会社
发明人：淳廣田
IPC分类号： B41J2/045 , B41J2/055 , B41J2/16
CPC分类号： B41J2/14209 , B41J2/1609 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14217 , B41J2002/14225 , B41J2002/14306 , B41J2002/14459 , B41J2002/14491 , B41J2202/20

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