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121. 发明专利

JPH11317477A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11317477A
公开(公告)日：1999-11-16
申请号：JP7513599
申请日：1999-03-19
申请人： HITACHI LTD
发明人： SHIRAI MASAYUKI , OTSUKA KANJI , MIWA TAKASHI , NAKANO TETSUO , KOIDE KAZUO , YAMAGIWA AKIRA , OBA TAKAO , HATADA TOSHIO , MATSUSHIMA HITOSHI , MIYAZAKI KUNIO
IPC分类号： H01L23/12 , H01L23/34
摘要： PROBLEM TO BE SOLVED: To fully achieve cooling using a plastic package without losing signal propagation characteristics by mounting a semiconductor chip to a heat diffusing plate, mounting a heat sink to the opposite surface, at the same time providing a wiring board, and jointing it to the heat diffusing plate. SOLUTION: A chip 1 is jointed to a pedestal part that is formed at the center of a heat diffusing plate 2 via an elastomer 3 having rubber-like elasticity having a filler with improved thermal conductivity. Around the chip 1, a wiring board 4 where wiring is made into multiple layers is jointed to the heat diffusing plate 2 via a soft material, for example an elastomer 5 having a filler with improved thermal conductivity. Also, a heat sink 9 is jointed onto the upper surface of the hat diffusion plate 2 via a soft material such as the elastomer 8. An aluminum material with improved thermal conductivity is used for the heat sink 9, and further a plurality of deep grooves are formed, so that the cooling area is widened.

122. 发明专利

JPH10261735A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH10261735A
公开(公告)日：1998-09-29
申请号：JP8434497
申请日：1997-03-18
申请人： HITACHI LTD
发明人： KIKUCHI TAKU , MIWA TAKASHI , HAYASHIDA TETSUYA
IPC分类号： H01L21/60 , H01L23/12 , H01L23/50 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a surface mount type area array package having narrow pitch. SOLUTION: A μPGA.IC has a wiring board 10 wherein inner terminals 12 and external terminals 13 which are connected by an electric wiring 14 are formed on both of the surfaces. Wires 23 bridge an electrode pad of a pellet 22 which is fixed on the wiring board 10 by a bonding layer 21 and the inner terminals 12. The pellet 22, the inner terminals 12 and the wires 23 are plastic-molded by a resin sealing member 25. Micropins 27 whose outer diameters are set to be 30-100 μm and whose length are set to be 0.5-1.2 mm are soldered on the respective external terminals 13. Thereby, since the outer diameter of the micropin 27 is thin, the pitch between pins can be narrowed, and the mounting density can be increased in the area arrangement of the micropins 27. Surface-mount is possible by abutting the micropins 27 against the land of a mounting board. Imperfection such as short-circuiting between pins which is to be caused by collapse of solder bumps of a BGA can be prevented by maintaining a gap between the μPGA.IC and the mounting board.

123. 发明专利

JPH10125850A LEAD FRAME, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JPH10125850A
公开(公告)日：1998-05-15
申请号：JP27568496
申请日：1996-10-18
申请人： HITACHI LTD
发明人： NOSE FUJIAKI , WATANABE YUJI , KIKUCHI TAKU , MIWA TAKASHI
IPC分类号： H01L23/50 , H01L21/321 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To eliminate the need of bonding wires and realize a thin type package. SOLUTION: Above a semiconductor chip 2 a lead frame locates through an insulation tape 3 to form a lead-on-chip(LOC) structure of the semiconductor device. Bumps BB are formed on bonding pads of the chip 2. The top ends of inner leads 4a overlay the bumps BB. Connection fixing recesses 4a1 having the same width as that of the bump BB and depth ranging from 50μm to about a half the thickness of the lead are formed into the top ends of the leads 4a by the half etching, etc. When die-bonding the chip 2, the inner leads 4a and the bumps BB are thermally compression welded so that the recesses 4a1 cover the bumps BB.

124. 发明专利

JPH1079405A SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MOUNTING THE SAME 失效
公开(公告)号：JPH1079405A
公开(公告)日：1998-03-24
申请号：JP23372196
申请日：1996-09-04
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , YAMAGUCHI EIJI , MIWA TAKASHI
IPC分类号： H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a technique of semiconductor device, capable of preventing a package board of the semiconductor device in which a semiconductor chip mounted on the package board is prevented from warping through bumps. SOLUTION: A semiconductor device is formed by a package board 1 on which first and second semiconductor chips 3a and 3b, having predetermined circuit elements on it, are mounted on both sides of the board respectively. The first and semiconductor chips 3a and 3b are mounted opposite on the other side of the package board 1 and connected electrically to the wiring layer through the bump 4. A plurality of solder bumps 2 electrically connecting the first and second semiconductor chips 3a to the mounting board through the wiring layer is formed on the package board 1.

125. 发明专利

JPH1050770A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH1050770A
公开(公告)日：1998-02-20
申请号：JP20513396
申请日：1996-08-05
申请人： HITACHI LTD
发明人： YAMAGUCHI EIJI , MIWA TAKASHI , TAZAKI KOJI , HOZOJI HIROYUKI
IPC分类号： H01L21/60 , H01L21/56 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To facilitate resin filling and besides to prevent the deterioration of the electrode layers of a wiring board, in a BGA(Ball Grid Array) structure package composed by bonding a semiconductor chip to the wiring board by a flip-chip system. SOLUTION: A semiconductor chip 2 is flip-chip-bonded. A dam 7 made out of insulating material like resin for example is provided along the periphery of the surface of a wiring board 4 on which electrode layers 5 are formed. After the semiconductor chip 2 is flip-chip-bonded on the surface of the wiring board 4, the inside of the dam 7 is filled with resin 8 to seal the semiconductor chip 2 and the electrode layers 5.

126. 发明专利

JPH1012811A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JPH1012811A
公开(公告)日：1998-01-16
申请号：JP16131096
申请日：1996-06-21
申请人： HITACHI LTD
发明人： KIKUCHI TAKU , WATANABE YUJI , NOSE FUJIAKI , MIWA TAKASHI
IPC分类号： H01L25/18 , H01L23/50 , H01L25/065 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To improve mechanical and electrical reliability at connection part of each lead frame in assembling an LSI by stacking a plurality of lead frames. SOLUTION: When the end parts of the leads 4 of a plurality of lead frame 2 are connected together for mutual stacking, for sealed in the same package 6, relating to mutual stacking of the end parts of the leads 4 of each lead frame 2, a protruded part 8 provided at the lead 4 of the lead frame 2 on one side is inserted into a through hole 9 provided at the lead 4 of the lead frame 2 on the other side, so that each contact point is deformed for connection.

127. 发明专利

JPH09326543A ELECTRONIC PART 失效
公开(公告)号：JPH09326543A
公开(公告)日：1997-12-16
申请号：JP14058096
申请日：1996-06-04
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , MIWA TAKASHI , HAYASHIDA TETSUYA
IPC分类号： H05K1/18 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/28 , H01L25/10 , H01L25/11
摘要： PROBLEM TO BE SOLVED: To provide an electronic part in which a semiconductor device is mounted on a wiring board with high density in such a manner that connecting parts of a group of leads extending in the same direction are electrically connected to substrate electrodes, a plurality of semiconductor devices are mounted on a mounting face with predetermined angles, and the plurality of semiconductor devices on the wiring board are sealed in a lump. SOLUTION: A first lead group 7a is mounted via an insulating film 8 on a semiconductor chip 4 on which circuit elements are formed. A second lead group 7b is mounted on the first lead group 7a via the insulating film 8. The first and the second lead groups 7a and 7b are electrically connected by a bump 6. A semiconductor device 1 is formed by the connection and the lead groups 7 and electrodes on a wiring board 2 are soldered so that the semiconductor device 1 is oblique with respect to the mounting face with a predetermined angle until a necessary degree of integration is obtained. The plurality of semiconductor devices 1 on the wiring board 2 are sealed by a mold resin 3 in a lump. Consequently, the semiconductor devices 1 can be mounted on the wiring board 2 with high density.

128. 发明专利

JPH09139451A SEMICONDUCTOR DEVICE WITH HEAT RADIATING FIN, AND MOUNTING/DISMOUNTING METHOD FOR THE DEVICE 失效
公开(公告)号：JPH09139451A
公开(公告)日：1997-05-27
申请号：JP29636495
申请日：1995-11-15
申请人： HITACHI LTD
发明人： MIWA TAKASHI , KIKUCHI TAKU , HOZOJI HIROYUKI
IPC分类号： H01L23/40
摘要： PROBLEM TO BE SOLVED: To increase mounting reliability and reduce mounting/dismounting work time. SOLUTION: The device includes a both-face-wired substrate (base) 12 having mounting bump electrodes 10 mounted on its one side and having an LSI chip 12 mounted on the other side, a heat radiating fin 2 contacted directly with the LSI chip 12 or contacted with it through a heat conductor, and fixing means for removably mounting the heat radiating fin 3 to the base 13. A reinforcing member is fastened to the base 13 and the heat radiating fin 3 is fastened to the reinforcing member by the fixing means. The fixing means has a screw structure where the heat radiating fin 3 is fixed on the reinforcing member by screws 4.

129. 发明专利

JPH09129819A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH09129819A
公开(公告)日：1997-05-16
申请号：JP28486095
申请日：1995-11-01
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , KIKUCHI TAKU , NOSE FUJIAKI , YAMAGUCHI EIJI , WATANABE YUJI , MIWA TAKASHI , HAYASHIDA TETSUYA
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To improve reliability of a connection part between lead frames, by electrically connecting inner lead parts and connection end portions by using a combining part, and encapsulating all of the stock side semiconductor chips which are arranged at specified intervals from a base side semiconductor chip, with an encapsulating part. SOLUTION: Connection end portions 3b1 -3d1 which are stretched from leg parts 3b2 -3b2 and formed parallel with inner lead parts 3a1 are electrically connected with stack side leads 3b-3d. Lamination side semiconductor chips 1b-1d which are positioned at specified intervals from a base side semiconductor chip 1a and the inner lead parts 3a1 are electrically connected with the connection end portions 3b1 -3d1 , by using a combining part 6. All semiconductor chips 1a-1d are encapsulated with an encapsulating part 2. Thereby reliability of a connection part between lead frames can be improved.

130. 发明专利

JPH088518A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH088518A
公开(公告)日：1996-01-12
申请号：JP13919594
申请日：1994-06-21
申请人： HITACHI LTD
发明人： SHIRAISHI TOMOHIRO , SHIRAI MASAYUKI , MIWA TAKASHI , KUBOSONO MINORU , TSUTSUMI YASUKI , KURODA HIROSHI , HIDA AKIHIRO
IPC分类号： H05K3/28 , H01L23/40
摘要： PURPOSE:To prevent occurrence of blow holes, voids and the like when a printed substrate and a heat diffusion plate are bonded. CONSTITUTION:An air vent 11a, which is an air release hole, is provided on a prescribed place between the edge part of a printed substrate 5, located nearest from a semiconductor chip 9 in a thermal diffusion plate 11, and the lead pin 6 located nearest from the semiconductor chip 9, and the air entrained when the heat diffusion plate 11 and printed substrates 4 and 5 are bonded, is discharged from the air vent 11a.

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