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111. 发明专利

JP2014040538A Epoxy resin composition of double-liquid type 审中-公开
标题翻译：双液型环氧树脂组合物
公开(公告)号：JP2014040538A
公开(公告)日：2014-03-06
申请号：JP2012184094
申请日：2012-08-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMADA HIROYOSHI
IPC分类号： C08G59/20 , C08K3/22 , C08K3/36 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition of a double-liquid type useful as intra-case fillers of electric appliances, capable, when cured, of manufacturing electric and electronic appliances excellent in terms of insulating performance, cracking resistance, and heat conductivity, and enabling a casting work at a low viscosity.SOLUTION: The provided epoxy resin composition of a double-liquid type includes (A) a main agent combining a bisphenol A-type epoxy resin and an epoxy resin having an intra-skeletal flexibility and (B) a curative component combining an acid anhydride compound and a curing accelerator. It is desirable, furthermore, to internalize, within the main agent (A), 50-400 wt.% of spherical silica particles having an average diameter of 0.1-30 μm with respect to the main agent (A) and to internalize, within the main agent (A), 20-300 wt.% of spherical alumina particles having an average diameter of 0.1-5 μm with respect to the main agent (A).
摘要翻译：要解决的问题：提供一种双液体型环氧树脂组合物，其可用作电器的内部填充剂，当固化时，能够在绝缘性能，耐开裂性和热性方面优异的电气和电子设备的制造导电性，并且能够以低粘度的铸造工作。解决方案：所提供的双液型环氧树脂组合物包括（A）组合双酚A型环氧树脂和具有骨架内柔性的环氧树脂的主剂和（B）组合酸酐化合物和固化促进剂的固化组分。此外，还需要在主剂（A）内内化相对于主剂（A）的平均直径为0.1-30μm的50-400重量％的球形二氧化硅颗粒并将其内化主剂（A），相对于主剂（A），平均粒径为0.1-5μm的球形氧化铝颗粒为20-300重量％。

112. 发明专利

JP2014039016A Semiconductor device manufacturing method and semiconductor device 审中-公开
标题翻译：半导体器件制造方法和半导体器件
公开(公告)号：JP2014039016A
公开(公告)日：2014-02-27
申请号：JP2013132914
申请日：2013-06-25
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KAWAKAMI SUSUMU , ARIFUKU MASAHIRO
IPC分类号： H01L21/60
CPC分类号： H01L24/83 , H01L2924/07811 , H01L2924/15787 , H01L2924/15788 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can sufficiently cure a light curable adhesion layer in a simple technique to obtain good connectivity between a semiconductor element and a substrate.SOLUTION: A semiconductor device manufacturing method comprises a connection process of arranging a semiconductor element 11 with a width of 1 mm and under via a light curable adhesion layer 12, on a light-transmissive substrate 13 placed on a stage 2 and connecting the semiconductor element 11 to the light-transmissive substrate 13 by application of pressure by a thermocompression bonding head 3 and light irradiation by light irradiation devices 4a, 4b. In the connection process, by irradiating light from the light irradiation devices 4a, 4b from obliquely above both sides of the semiconductor element 11 in a width direction, the adhesion layer 12 is cured. Since the width of the semiconductor element 11 is 1 mm and under, sufficient quantities of light can be irradiated on the adhesion layer 12 only by light irradiation from both sides of the semiconductor element 11 in the width direction and good connectivity between the semiconductor element 11 and the light-transmissive substrate 13 can be obtained.
摘要翻译：要解决的问题：提供一种能够以简单的技术充分固化光可固化粘合层的半导体器件制造方法，以获得半导体元件和衬底之间的良好连接性。半导体器件制造方法包括：布置通过光固化型粘合层12在宽度为1mm的下方的半导体元件11上，放置在载置台2上的透光性基板13上，通过施加压力将半导体元件11与透光性基板13连接热压接头3和光照射装置4a，4b的光照射。在连接处理中，通过在宽度方向上从半导体元件11的两侧倾斜地照射来自光照射装置4a，4b的光，粘接层12固化。由于半导体元件11的宽度为1mm以下，所以仅通过半导体元件11的宽度方向的两侧的光照射能够在粘合层12上照射足够量的光，并且半导体元件11的连接性良好并且可以获得透光基板13。

113. 发明专利

JP2014035385A Dimming element, dimming device, and driving method thereof 有权
标题翻译：调光元件，调光装置及其驱动方法
公开(公告)号：JP2014035385A
公开(公告)日：2014-02-24
申请号：JP2012175569
申请日：2012-08-08
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KANEKO HIRONORI , MORI SHUNSUKE
IPC分类号： G02F1/19 , G02F1/167 , G02F1/17
摘要： PROBLEM TO BE SOLVED: To provide a dimming element and a dimming device which are capable of quickly controlling from a transmission state or an intermediate state to a light shielding state, and a driving method thereof.SOLUTION: The dimming element includes a first substrate, a second substrate, a first electrode formed on the first substrate and between the first substrate and the second substrate, a second electrode formed on the second substrate and between the first substrate and the second substrate, a suspension formed between the first electrode and the second electrode, and a first rugged part formed between the first substrate and the suspension. The suspension contains dimming particles and a dispersant, the dimming particles are controlled by voltage application to the first electrode and the second electrode, and the first rugged part has a taper shape.
摘要翻译：要解决的问题：提供能够从透射状态或中间状态快速控制到遮光状态的调光元件和调光装置及其驱动方法。调光元件包括第一基板，第二基板，形成在第一基板上，第一基板和第二基板之间的第一电极，形成在第二基板上，第一基板和第二基板之间的第二电极，形成在第一电极和第二基板之间的悬架电极，以及形成在第一基板和悬架之间的第一粗糙部分。悬浮液含有调光颗粒和分散剂，调光颗粒通过施加到第一电极和第二电极的电压来控制，第一粗糙部分具有锥形形状。

114. 发明专利

JP2014034587A Polymer particle including inorganic phosphor for solar cell wavelength conversion, and production method thereof 审中-公开
标题翻译：包含无机磷光体的聚合物颗粒用于太阳能电池波长转换及其生产方法
公开(公告)号：JP2014034587A
公开(公告)日：2014-02-24
申请号：JP2012174901
申请日：2012-08-07
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： SAWAKI TAKU , OKANIWA KAORU , YAMASHITA TAKESHI
IPC分类号： C08L23/00 , C08F2/44 , C08K9/00 , H01L31/054
CPC分类号： Y02E10/52
摘要： PROBLEM TO BE SOLVED: To provide a polymer particle including an inorganic phosphor for solar cell wavelength conversion, excellent in durability, capable of improving light utilization efficiency in a solar cell module, and enabling stable improvement of electric generation efficiency for a long period of time, and to provide a production method thereof.SOLUTION: In a polymer particle including an inorganic phosphor for solar cell wavelength conversion, a particulate wavelength conversion material for a solar cell includes: a fluorescent substance; and a transparent material including the fluorescent substance. The fluorescent substance is an inorganic fluorescent substance whose surface is treated by a coupling agent. The transparent material is a transparent vinyl resin. Density of the inorganic fluorescent substance (at 25 degrees) is 1.5-5.0 g/cm.
摘要翻译：要解决的问题：提供一种包括太阳能电池波长转换用无机荧光体的聚合物粒子，耐久性优异，能够提高太阳能电池模块的光利用效率，能够长时间稳定地提高发电效率并提供其制造方法。解决方案：在包括用于太阳能电池波长转换的无机磷光体的聚合物颗粒中，用于太阳能电池的颗粒状波长转换材料包括：荧光物质; 以及包含荧光物质的透明材料。荧光物质是其表面用偶联剂处理的无机荧光物质。透明材料是透明乙烯基树脂。无机荧光物质（25度）的密度为1.5〜5.0g / cm 3。

115. 发明专利

JP2014032258A Resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board 有权
标题翻译：树脂组合物，感光元件，形成耐火图案的方法和制造印刷线路板的方法
公开(公告)号：JP2014032258A
公开(公告)日：2014-02-20
申请号：JP2012171436
申请日：2012-08-01
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TAKEUCHI KAZUMASA
IPC分类号： G03F7/039 , C08F2/38 , C08F20/10 , C08G18/62 , G03F7/004 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a resin composition that can be used as a positive resist material having a novel photosensitive mechanism different from that of a conventional positive resist material and giving good sensitivity and resolution even in a thick film state.SOLUTION: The resin composition comprises: a polymeric compound having a skeleton derived from a compound having an ethylenically unsaturated bond, a trithiocarbonate group and a urethane bond; and a compound that generates a radical by actinic rays.
摘要翻译：要解决的问题：提供一种树脂组合物，其可以用作具有与常规正性抗蚀剂材料不同的新型感光机构的正性抗蚀剂材料，并且即使在厚膜状态下也能提供良好的灵敏度和分辨率。解决方案：树脂组合物包含：具有衍生自具有烯键式不饱和键的化合物的骨架的聚合物，三硫代碳酸酯基和氨基甲酸酯键; 以及通过光化射线产生自由基的化合物。

116. 发明专利

JP2014032254A Resin composition 审中-公开
标题翻译：树脂组合物
公开(公告)号：JP2014032254A
公开(公告)日：2014-02-20
申请号：JP2012171400
申请日：2012-08-01
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KAMIYAMA KENICHI , SHIBATA TOMOAKI , MASUDA HIROSHI
IPC分类号： G02B6/12 , C08G59/62
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for an optical material, from which a resin layer having properties of high transparency, a low refractive index and low thermal expansion can be formed.SOLUTION: The resin composition comprises (A) an epoxy compound having two or more epoxy groups, (B) a compound having a phenolic hydroxyl group, and (C) silica particles having an average particle diameter of 1 nm or more and 70 nm or less. For example, in all atoms of carbon, nitrogen and oxygen constituting the (A) component, when the total number of these atoms and a number n of atoms in which all chemical bonds with other atoms consist of single bonds are denoted by N and n, respectively, n/N is 0.6 or more and 1 or less.
摘要翻译：要解决的问题：提供一种光学材料用树脂组合物，由此可以形成具有高透明性，低折射率和低热膨胀性的树脂层。溶液：树脂组合物包含（A）环氧化合物具有两个以上的环氧基，（B）具有酚羟基的化合物和（C）平均粒径为1nm以上且70nm以下的二氧化硅粒子。例如，在构成（A）成分的碳，氮和氧的全部原子中，当这些原子的总数和与其他原子构成的单键的所有化学键的原子的数量n表示为N和n ，n / N分别为0.6以上且1以下。

117. 发明专利

JP2014029535A Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and method for manufacturing printed wiring board 有权
标题翻译：光敏树脂组合物，使用其的感光元件，电阻图案形成方法和制造印刷线路板的方法
公开(公告)号：JP2014029535A
公开(公告)日：2014-02-13
申请号：JP2013173528
申请日：2013-08-23
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MIYASAKA MASAHIRO , MURAMATSU YUKIKO
IPC分类号： G03F7/027 , G03F7/004 , G03F7/033 , H05K3/06 , H05K3/18
CPC分类号： C08F2/48 , C08F222/1006 , G03F7/027 , G03F7/033
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is superior in sensitivity, resolution, adhesion, resist shape, and strippability after curing.SOLUTION: A photosensitive resin composition includes a binder polymer which includes a (meth)acrylic acid structure unit and a (meth)acrylic acid benzyl ester structure unit and has an acid value of 100-250 mgKOH/g, and a photopolymerizable compound of formula (1).
摘要翻译：要解决的问题：提供一种感光性树脂组合物，其在固化后的灵敏度，分辨率，粘合性，抗蚀剂形状和剥离性都优异。解决方案：感光性树脂组合物包括粘合剂聚合物，其包含（甲基）丙烯酸结构单元和（甲基）丙烯酸苄酯结构单元，酸值为100-250mgKOH / g，以及式（1）的光聚合性化合物。

118. 发明专利

JP2014027288A Substrate for mounting semiconductor chip and method for manufacturing the same 有权
标题翻译：用于安装半导体芯片的基板及其制造方法
公开(公告)号：JP2014027288A
公开(公告)日：2014-02-06
申请号：JP2013176904
申请日：2013-08-28
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： EJIRI YOSHINORI , HASEGAWA KIYOSHI , SAKURAI TAKEHISA , TSUBOMATSU YOSHIAKI
IPC分类号： H01L23/12 , H05K3/24 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for mounting a semiconductor chip capable of reducing bridge occurrence and obtaining excellent wire bondability and solder connection reliability even when micro wiring is formed.SOLUTION: A method for manufacturing a substrate for mounting a semiconductor chip comprises the steps of: forming a resist on a first copper layer of an inner layer board; forming a second copper layer on the first copper layer by electrolytic copper plating; forming a nickel layer on at least a part of a conductor circuit by electrolytic nickel plating; removing the resist; removing the first copper layer by etching; and forming a gold layer on at least a part of the conductor circuit by electroless gold plating. This method further includes a step of forming a gold layer composed of at least one metal selected from a group composed of cobalt, palladium, platinum, and gold on the nickel layer after forming the nickel layer and before forming the gold layer.
摘要翻译：要解决的问题：提供一种制造用于安装能够减少桥接发生的半导体芯片的基板的方法，即使在形成微细布线时也能获得优异的引线接合性和焊接连接可靠性。解决方案：一种用于安装基板的方法半导体芯片包括以下步骤：在内层板的第一铜层上形成抗蚀剂; 通过电解镀铜在第一铜层上形成第二铜层; 通过电解镀镍在导体电路的至少一部分上形成镍层; 去除抗蚀剂; 通过蚀刻去除第一铜层; 并通过无电镀金在导体电路的至少一部分上形成金层。该方法还包括在形成镍层之后并在形成金层之前，在镍层上形成由选自钴，钯，铂和金组成的组中的至少一种金属构成的金层的步骤。

119. 发明专利

JP2014027146A Polishing solution and substrate polishing method using polishing solution 审中-公开
标题翻译：抛光溶液和抛光方法使用抛光溶液
公开(公告)号：JP2014027146A
公开(公告)日：2014-02-06
申请号：JP2012166995
申请日：2012-07-27
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YOSHIKAWA SHIGERU , TANAKA TAKAAKI , OTA MUNEHIRO , MATSUMOTO TAKAAKI , YOSHIKAWA TAKAHIRO , SHINODA TAKASHI
IPC分类号： H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing solution and a substrate polishing method using the polishing solution, which can improve a polishing speed of a polished film and further improve surface smoothness after polishing in a CMP technique for polishing the polished film formed on a surface of the substrate.SOLUTION: A polishing solution for CMP of pH 4.8-5.2 contains cerium oxide particles, a pH buffer solution, a polymer compound B having a carboxylic acid group or a carboxylate group, and water. The pH buffer solution has an amount of pH change between a liquid concentrate pH and pH after 3 fold dilution of the buffer solution is 0.2 and under and the buffer solution contains acid A having pKa of 4-6, in which a content of the polymer compound B to a total mass of the polishing solution is 0.02 mass% and over and a total of contents of the acid A and the polymer compound B is 0.6 mass% and under with respect to the total mass of the polishing solution.
摘要翻译：要解决的问题：提供一种使用抛光液的抛光溶液和基板研磨方法，其可以提高抛光膜的抛光速度，并且在用于抛光形成在表面上的抛光膜的CMP技术中进一步提高抛光后的表面平滑度的溶液。溶液：pH 4.8-5.2的CMP抛光溶液含有氧化铈颗粒，pH缓冲溶液，具有羧酸基团或羧酸盐基团的高分子化合物B和水。 pH缓冲溶液在缓冲溶液稀释3倍以后在液体浓度pH和pH之间具有一定量的pH值变化，缓冲溶液含有pKa为4-6的酸A，其中聚合物的含量化合物B相对于研磨液的总质量为0.02质量％以上，酸A和高分子化合物B的总含量为0.6质量％以下。

120. 发明专利

JP2014025042A Curing accelerator, epoxy resin composition and electronic component device 有权
标题翻译：固化加速器，环氧树脂组合物和电子元件装置
公开(公告)号：JP2014025042A
公开(公告)日：2014-02-06
申请号：JP2012168942
申请日：2012-07-30
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NAKAMURA SHINYA , INOUE HIDETOSHI
IPC分类号： C08G59/40 , C08G59/62 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin curing accelerator which can realize excellent storage stability.SOLUTION: The epoxy resin curing accelerator contains a compound represented by the specified general formula (I-1). In the formula, Reach independently represent a C1-C18 substituted or unsubstituted hydrocarbon group. Any two Rselected from the three Rmay be linked with each other to form a cyclic structure. Ar represents a C6-C18 substituted or unsubstituted trivalent aromatic hydrocarbon group. The two oxygen atoms coupled to Ar are respectively coupled to two carbon atoms neighboring each other.
摘要翻译：要解决的问题：提供可以实现优异的储存稳定性的环氧树脂固化促进剂。解决方案：环氧树脂固化促进剂含有由指定的通式（I-1）表示的化合物。在该式中，Reach独立地表示C1-C18取代或未取代的烃基。来自三个Rmay的任何两个Rselect都将彼此链接以形成循环结构。 Ar表示C6-C18取代或未取代的三价芳族烃基。耦合到Ar的两个氧原子分别与彼此相邻的两个碳原子耦合。

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