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111. 发明专利

JPH0855896A WAFER CARRIER 失效
公开(公告)号：JPH0855896A
公开(公告)日：1996-02-27
申请号：JP20932094
申请日：1994-08-11
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： ONO TOMOHIRO
IPC分类号： B65G49/07 , B25J15/06 , H01L21/677 , H01L21/68
摘要： PURPOSE:To prevent a relatively thin wafer and a compound semiconductor which easily cracks from being damaged due to suction. CONSTITUTION:A carrier for a wafer from one working process to another is constituted of a suction part 2 for retaining the wafer and a carrier part and the suction part 2 is formed by a porous member 4 and at the same time a buffer material 3 is included between the suction part and the carrier part.

112. 发明专利

JPH07329026A PRODUCTION OF PC PANEL 失效
公开(公告)号：JPH07329026A
公开(公告)日：1995-12-19
申请号：JP14407594
申请日：1994-06-03
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： SEKIYA SHINJI
IPC分类号： E04F13/08 , B28B1/14 , B28B1/16 , B28B7/00
摘要： PURPOSE:To produce a PC panel so as not to curve a surface stone material tile outwardly. CONSTITUTION:When a PC panel is formed so as to be slightly curved in a protruding state on the side of the surface tile thereof, a protruding curve is inwardly formed to the bottom surface of the form member 4 for molding the PC panel in anticipation of the warp quantity of the protruding curve and a tile is arranged on this curved surface 4a and a binder material such as mortar is poured in the form member to be solidified.

113. 发明专利

JPH07276183A BLADE COVER 失效
公开(公告)号：JPH07276183A
公开(公告)日：1995-10-24
申请号：JP9077094
申请日：1994-04-06
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： MABASHI TAKAYUKI
IPC分类号： B23Q11/08 , B23Q11/10 , H01L21/301
摘要： PURPOSE:To facilitate and increase the efficiency of the blade changing operation by selectively positioning a cutting water feeding nozzle to the position of evacuation which is not in the way of attachment/detachment when a blade is attached/detached to/from a spindle and the position to feed the cutting water after attachment/detachment is completed. CONSTITUTION:A blade cover 4 is mounted on the tip part of a spindle unit 3, and a cutting water feeding nozzle 5 is provided on one end part of this blade cover 4 in an openable/closable manner through an actuator 10 such as an air motor. That means, the actuator 10 is mounted on the side part of the blade cover 4, and the cutting water feeding nozzle 5 is mounted on a rotary shaft 10a through a bracket 11. When the cutting water feeding nozzle 5 is turned to open by this actuator 10, the cutting water feeding nozzle is in the position of evacuation not in the way of changing the blade 2, while the cutting water feeding nozzle is returned to the position to feed the cutting water relative to the blade 2 when the cutting water feeding nozzle 5 is closed.

114. 发明专利

JPH07211685A SPINNER CLEANING EQUIPMENT 失效
公开(公告)号：JPH07211685A
公开(公告)日：1995-08-11
申请号：JP1693394
申请日：1994-01-18
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： SATO KICHIZO
IPC分类号： B08B3/02 , H01L21/304 , H01L21/68 , H01L21/683
摘要： PURPOSE:To protect a wafer against wetting due to splash from the rear side of an upper cover, when the wafer is taken out after cleaning and drying, by disposing the upper cover while inclining in one direction and retracting a side cover downward when an object to be cleaned is carried in or out. CONSTITUTION:An upper cover 8 is secured, on one side face thereof, to the upper end part of a bracket cover 6 through a stopper and has a plan view similar to a vessel 1b. The upper cover 8 also has a peripheral part 8a of substantially L-shaped cross-section and a top plate 8b formed on a surface inclining in one direction. A side cover 10 comprises a drum section having a plan view similar to the vessel section 1b but slightly smaller than that and the drum section is moved up and down between the upper cover 8 and the vessel section 1b by means of cylinders 11 for up/down motion. In other words, when the cylinders 11 are operated simultaneously to retract a rod 11a, the side cover 10 is lowered and housed in the vessel section 1b. Consequently, the side cover 10 is located at a retracted position.

115. 发明专利

JPH07171754A DICING DEVICE WITH VISUAL INSPECTING FUNCTION 失效
公开(公告)号：JPH07171754A
公开(公告)日：1995-07-11
申请号：JP34505193
申请日：1993-12-20
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： SEKIYA KAZUMA
IPC分类号： B24B27/06 , H01L21/66
摘要： PURPOSE:To provide a dicing device with the visual inspecting function where the chip inspection is carried out after the dicing by the dicing device, and the chip inspection can be carried out even during the alignment operation of other wafers. CONSTITUTION:A dicing device is provided with at least an alignment means 7 to recognize the surface of a semiconductor wafer and detect the street, a cutting means 8 to cut the semiconductor wafer along the street based on the information of this alignment means, a cleaning means 10 to mesh and dry the semiconductor wafer after cutting, and a visual inspecting means 11 to recognize the surface of the semiconductor wafer after cutting and inspect the condition of the individually divided chip.

116. 发明专利

JPH07106405A ALIGNING METHOD 失效
公开(公告)号：JPH07106405A
公开(公告)日：1995-04-21
申请号：JP26946293
申请日：1993-10-04
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： SEKIYA KAZUMA
IPC分类号： G01B11/00 , G06T1/00 , G06T7/00 , H01L21/301 , H01L21/68
摘要： PURPOSE:To prevent failure in the cutting of a chip due to oblique alignment by confirming the actual parallelism between the cutting line of a work and a reference alignment line after angular correction. CONSTITUTION:Angular correction is made so that a line defined by patterns identical, respectively, to the key patterns of a first and second regions A and B will be in parallel with a reference alignment line L. Subsequently, actual parallelism between a cutting line of a work W and the reference alignment line L is verified. For that purpose, presence of a pattern identical to the key pattern on the line defined by the patterns identical, respectively, to the key patterns of first and second regions A and B is verified by pattern matching. This method allows detection of misalignment of an inclined line.

117. 发明专利

JPH06302569A POLISHING METHOD FOR WAFER 失效
公开(公告)号：JPH06302569A
公开(公告)日：1994-10-28
申请号：JP11114593
申请日：1993-04-15
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KOMA YUTAKA
IPC分类号： B24B1/00 , B24B41/06 , H01L21/304 , H01L21/68 , H01L21/683
摘要： PURPOSE:To easily convey to a next step after polishing by holding a wafer in a frame through an adhesive tape, mounting the wafer held in the frame on a chucking table of a polishing apparatus, and conveying the polished wafer to a next step through the frame. CONSTITUTION:A wafer 3 is held on a mount table 6. When the step of mounting on a chucking table 5 is conducted, the wafer 3 is attracted to the center 6a of the table 6. A frame l is attracted to a periphery 6b lowered by one step, and an adhesive tape 2 is so attracted as to be disposed snugly along an upper surface shape of the table 6. A polishing step is performed while pressing the wafer 3 under a suitable pressure. Then, the frame 1 is attracted by an attraction pad to conduct the step of conveying the polished wafer 3 to a next step. Since the wafer 3 is conveyed in a state held by the frame 1, even a large-diameter wafer reduced in thickness after the polishing is not damaged.

118. 发明专利

JPH06270038A FINE CUTTING DEVICE 失效
公开(公告)号：JPH06270038A
公开(公告)日：1994-09-27
申请号：JP8387193
申请日：1993-03-19
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： ONO TAKATOSHI , SEKIYA KAZUMA
IPC分类号： B23Q15/24
摘要： PURPOSE:To correctly determine the dividing position of a rotary blade by measuring the actual position of a rotary blade by a laser measuring device, in the cutting of a wafer on a chuck table through the shift of a spindle unit. CONSTITUTION:When a semiconductor wafer 20 is dieing worked, the wafer 20 is held on a chuck table 2a, and a rotary blade 18 is dividing-fed in the Y-axis direction, and cutting is performed, carrying out the positioning at the cut line of the wafer 20. When the rotary blade 18 is dividing-fed, the rotary blade 18 is cut out according to the previously determined dividing feeding quantity, and the feed quantity Y1 is detected by reading out the scale of a linear scale 12 by a reading-out head 11. Further, the actual dividing quantity Y2 is measured by irradiating the laser beam 19a to the cutting edge part 18a of a rotary blade 18 from a laser measuring device 19, and compared with the value Y1, and the dividing feed quantity of the rotary blade 8 is corrected according to the difference.

119. 发明专利

JPH06181257A DICING APPARATUS 失效
公开(公告)号：JPH06181257A
公开(公告)日：1994-06-28
申请号：JP33494492
申请日：1992-11-24
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： MORI TAKASHI , SEKIYA KAZUMA
IPC分类号： H01L21/301 , H01L21/78
摘要： PURPOSE:To make compact the whole of a dicing apparatus by reducing the lateral width of the dicing apparatus. CONSTITUTION:A cassette region 2, a chuck region 3 and a spin washing region 4 in a dicing apparatus 1 are disposed in parallel to the axial line of a spindle 81. A chuck table in the chuck region 3 is disposed in a reciprocating manner in a direction perpendicular to the parallel line and is positioned with respect to the chuck region 3 and dicing region 6.

120. 发明专利

JPH0635108B2 失效
公开(公告)号：JPH0635108B2
公开(公告)日：1994-05-11
申请号：JP14240884
申请日：1984-07-11
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： MORI TOSHUKI , SATO KICHIZO
IPC分类号： B24B49/02 , B24B49/04

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