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    • 94. 发明专利
    • PHOTOELECTRIC CONVERTER
    • JPH04261071A
    • 1992-09-17
    • JP1259591
    • 1991-01-11
    • CANON KK
    • SUGAWA SHIGETOSHIGOFUKU IHACHIROU
    • H01L27/146H01L31/0376H01L31/10H01L31/105H01L31/20
    • PURPOSE:To enhance the low afterimage property by a method wherein a charge implantation preventive layer is formed of a P type or N type amorphous semiconductor layer in contact with an I layer as well as a semiconductor layer containing P type or N type fine crystal. CONSTITUTION:Cr is deposited on a glass substrate 11 by sputtering and then etched away in specific shape to form a lower electrode 12 comprising a photodiode. Next, the substrate 11 is heated at specific temperature using a capacity coupled type CVD device and then specific amount of SiH4, PH3, and H2 are led-in to be discharged meeting the specific requirements so as to deposit an N type amorphous silicon layer 13 250Angstrom thick containing fine crystal. Successively, the substrate 11 is heated again at specific temperature using the same capacity coupled type CVD device and then specific amount of SiH4, PH3 and H2 are led-in again to be discharged meeting the specific requirements so as to deposit another N type amorphous silicon layer 14 100Angstrom thick for the completion of an N type charge preventive layer. Likewise, a P type amorphous semiconductor layer 17 containing the fine crystal 250Angstrom thick is deposited to complete a P type charge preventive layer.
    • 95. 发明专利
    • PHOTOVOLTAIC DEVICE
    • JPH02260662A
    • 1990-10-23
    • JP8310489
    • 1989-03-31
    • SANYO ELECTRIC CO
    • OKAMOTO SHINGOTAKAHAMA TAKESHINISHIKOKU MASATONAKANO SHOICHI
    • H01L31/04H01L31/0376H01L31/0747H01L31/075H01L31/20
    • PURPOSE:To restrain dopant or the like from diffusing and separating to improve a photovoltaic device in thermal stability, and to lessen it in photo- deterioration by a method wherein the amount of hydrogen contained in a first semiconductor layer provided between a second semiconductor layer and the conductive surface of a substrate is set equal to or lower than a prescribed value. CONSTITUTION:A certain conductivity type semiconductor layer 31, an intrinsic or a substantially intrinsic second semiconductor layer 32, and an opposite conductivity type third semiconductor layer 33 are successively piled on the conductive surface of a substrate 1. Hydrogen is contained in the layers 31, 32, and 33, the amount of hydrogen contained in the layer 31 provided between the layer 33 and the conductive face of the substrate 1 is set to 10% or below, and the layer 32 is formed of amorphous semiconductor. The amount of hydrogen contained in the layer 32 is set to nearly 10% or below the same as the layer 31. Moreover, light rays are incident on the layer 32 passing through the layer 31. The layer 31 is made to contain a band gap enhancing element other than hydrogen so as to be improved in optical band gap as compared with the layer 32.
    • 100. 发明专利
    • IMAGE SENSOR
    • JPS61224353A
    • 1986-10-06
    • JP6551485
    • 1985-03-28
    • SUMITOMO ELECTRIC INDUSTRIES
    • ITOZAKI HIDEOFUJITA NOBUHIKOICHIYANAGI HAJIME
    • G01J1/02G03G5/082H01L21/205H01L27/146H01L31/0248H01L31/0376H01L31/20
    • PURPOSE:To obtain an a-SiGe:H film which is excellent in photoelectric conductivity under the conditions of a definite pressure, intensity of light and the temperature of a substrate by optical CVD using one of SiH4, Si2H4 or SiF4 or GeF4, or further adding B and diluting with H2 as required. CONSTITUTION:A mixed gas of SiH4 or Si2H6 and GeH4 or GeF4 is introduced 6 in a reaction bath 1 and kept to 0.5-15 torr, the reduction of film forming speed is prevented, the appropriate film forming speed is kept by irradiating ultraviolet rays of 10-100 mW/cm through a quartz glass window 2 and the deterioration of film characteristics is prevented. The temperature of a substrate is also kept at 150-250 deg.C and the generation of a defect due to the reduction of photoelectric conductivity or the reduction of the content of H is prevented. Further, if 10 -10 stoms/cc of B are added, the sensitivity for a long wavelength is increased. This method causes no damage of a film since plasma is not used, the efficiency of Ge addition by optical CVD is also high, a high performance a-SiGe:H film is obtained and an image sensor which is excellent in the sensitivity to a long wavelength can be manufactured.