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    • 93. 发明专利
    • Method for producing silicon carbide single crystal and substrate produced by the same
    • 用于生产碳化硅单晶和由其制造的基材的方法
    • JP2014028736A
    • 2014-02-13
    • JP2013047067
    • 2013-03-08
    • Nippon Steel & Sumitomo Metal新日鐵住金株式会社
    • SATO SHINYAFUJIMOTO TATSUOTSUGE HIROSHIKATSUNO MASAKAZU
    • C30B29/36
    • C30B23/02C30B23/00C30B29/36H01L29/1608Y10T428/21
    • PROBLEM TO BE SOLVED: To provide a method for producing SiC single crystal having high crystal quality and in particular extremely low spiral dislocation density and a SiC single crystal ingot produced by the method.SOLUTION: A method for producing a silicon carbide single crystal by a sublimation recrystallization process using a seed crystal comprises: a first growth step for growing a silicon carbide single crystal having a thickness of at least 0.5 mm at a first growth atmospheric pressure of 3.9 kPa to 39.9 kPa and at a first growth temperature of the seed crystal of more than or equal to 2100°C and less than 2300°C; and a second growth step for growing a silicon carbide single crystal thicker than that grown in the first growth step at a second growth atmospheric pressure of 0.13 kPa to 2.6 kPa and at a second growth temperature of the seed crystal of more than the first growth temperature and less than 2400°C. The method provides a silicon carbide single crystal 7 in which the spiral dislocation density is smaller in the peripheral area 7b than in the central area 7a and spiral dislocation 3 is partially reduced.
    • 要解决的问题:提供一种制造具有高结晶质量,特别是非常低的螺旋位错密度的SiC单晶的方法和通过该方法制造的SiC单晶锭。解决方案:一种通过以下步骤制造碳化硅单晶的方法: 使用晶种的升华重结晶工艺包括:第一生长步骤,用于在第一生长大气压为3.9kPa至39.9kPa以及晶种的第一生长温度下生长厚度至少为0.5mm的碳化硅单晶 大于或等于2100°C且小于2300°C; 以及第二生长步骤,用于在0.13kPa至2.6kPa的第二生长大气压和超过第一生长温度的晶种的第二生长温度下生长比在第一生长步骤中生长的碳化硅单晶更厚的碳化硅单晶 小于2400°C。 该方法提供了周边区域7b中的螺旋位错密度小于中心区域7a的碳化硅单晶7,并且螺旋位错3部分地减少。