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    • 93. 发明专利
    • FIELD-EFFECT SEMICONDUCTOR DEVICE
    • JPH08316461A
    • 1996-11-29
    • JP12028095
    • 1995-05-18
    • SANYO ELECTRIC CO
    • MATSUSHITA SHIGEHARUINOUE DAIJIROMATSUMURA KOJISAWADA MINORUHARADA YASOO
    • H01L29/812H01L21/338H01L29/778
    • PURPOSE: To maintain the high speed property of carrier in a wide range of an electric field, and to improve high output characteristics by a method wherein the third semiconductor layer possesses the greatest carrier density and the electron mobility higher than that in the first semiconductor layer and lower than that in the second semiconductor layer, and an impurity-doped layer is contained therein. CONSTITUTION: Electrons of an impurity-doped layer 5 are mainly allowed to move in an InGaAs electron moving layer 3 by application of voltage to a source electrode 9 and a drain electrode 10. The mobility of electrons in InGaAs is higher than the mobility of electrons in AlGaAs and GaAs, and electrons are allowed to travel at high speed in the InGaAs electron transit layer 3 and a GaAs electron feeding layer 4. Accordingly, the electron mobility is increased on a wide range from a low electric field to a high electric field. Besides, the number of carrier travels in the InGaAs electron traveling layer 3 is increased by increasing the maximum carrier concentration of GaAs, and the current value in proportion to the product of electron speed and the number of electrons is made larger.
    • 99. 发明专利
    • SEMICONDUCTOR SWITCH
    • JPH06311007A
    • 1994-11-04
    • JP9303393
    • 1993-04-20
    • SANYO ELECTRIC CO
    • UDA NAONORISAWAI TETSUOHIRAI TOSHIKAZUHARADA YASOO
    • H03K17/693
    • PURPOSE:To improve the insertion loss characteristic of a high frequency signal by providing a 2nd FET between a gate of a FET receiving/interrupting the high frequency signal and a ground potential and controlling an ON-resistance of the 2nd FET to control the attenuation of the signal passing through the FET thereby reducing a length of a transmission path through which the high frequency signal leaks. CONSTITUTION:With a voltage of 0V given to a gate voltage terminal 13 and a voltage of 3V given to a gate voltage terminal 14, a FET 10A is turned off and a FET 10B is turned on. Thus, a high frequency signal RF is not outputted to an output terminal 11 but outputted to an output terminal 12 through the FET 10B and given to a circuit of other system (not shown). When a voltage at a gate voltage terminal 15 gets higher, an ON resistance of a FET 10C is decreased and a gate voltage applied to the FET 10B is decreased. Thus, the ON resistance of the FET 10B is increased, the signal RF passing through the FET 10B is attenuated and a signal level at the output terminal 12 is decreased. Thus, no attenuator is required and the leaked signal is reduced.