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91. 发明专利

JPH11214846A MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH11214846A
公开(公告)日：1999-08-06
申请号：JP1534698
申请日：1998-01-28
申请人： IBIDEN CO LTD
发明人： ASAI MOTOO , KARIYA TAKASHI , SHIMADA KENICHI , SEGAWA HIROSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To secure electric connection between inner layer circuits in a multilayer core substrate via through holes, by forming the through holes in the multilayer core substrate, filling the through holes with a filler to form conductor layers covering exposed faces in the through holes, and connecting via holes to the conductor layers. SOLUTION: A multilayer core substrate 1 is made by alternately stacking conductor layers and prepregs. In this case, prepregs impregnated with fluorine contained resin and the like and arranged in a B stage are stacked alternately with copper foils and circuit boards and then are heated and pressed into an intergral unit. A through hole is formed in the multilayer core substrate 1 by drilling and the like and a wall face of the through hole and the surface of the substrate are electroless-plated to form a through hole 3. Then, an inner wall of the through hole 3 and the surface of the substrate are electrolytic copper plated for secure thickness. Then, the inner wall of the through hole and the surface of the electrolytic plating film are roughed to form a rough layer 4. After that, a filler 5 is applied onto the substrate 1 by printing with a mask having an opening at a place corresponding to the through hole 3 being mounted on the substrate 1 to fill the through hole 3 and then the filler is dried and hardened.

92. 发明专利

JPH07273242A ELECTRONIC PART MOUNTING DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH07273242A
公开(公告)日：1995-10-20
申请号：JP8802094
申请日：1994-03-31
申请人： IBIDEN CO LTD
发明人： KARIYA TAKASHI
IPC分类号： H01L23/12
摘要： PURPOSE:To obtain an electronic part mounting device which is enhanced in connection reliability and lessened in fraction defective by surely forming a brazing material junction by a method wherein a part of an auxiliary electrode located between an adhesive layer and a through-hole confronting a lead is removed, and the adhesive layer is set smaller than the auxiliary electrode in thickness. CONSTITUTION:An auxiliary electrode 13 is provided to the periphery of the opening of the through-hole 11a provided to the surface of a wiring board 1 opposed to an inner lead 21. A part of the auxiliary electrode 13 located between an adhesive layer 3a and the through-hole 11a confronting the inner lead 21 is removed, the adhesive layer 3a is set smaller than the auxiliary electrode 13 in thickness, and furthermore a lead 211 located on the auxiliary electrode 13 is elastically deformed like a concave. By this setup, a through-hole conductive layer 14 and the inner lead 21 are electrically and surely joined together with brazing material, so that a brazing material junction can sharply be lessened in fraction defective.

93. 发明专利

JP2015050315A 結合型のプリント配線板及びその製造方法审中-公开
标题翻译：联轴器类型打印接线板及其制造方法
公开(公告)号：JP2015050315A
公开(公告)日：2015-03-16
申请号：JP2013180791
申请日：2013-08-31
申请人：イビデン株式会社 , Ibiden Co Ltd
发明人： TERUI MAKOTO , KARIYA TAKASHI , KANNO YOSHINORI , KUNIEDA MASATOSHI
IPC分类号： H05K3/46
CPC分类号： H05K1/111 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L25/0655 , H01L25/18 , H01L2224/0401 , H01L2224/16227 , H01L2224/1703 , H01L2924/15313 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K3/429 , H05K3/4644 , H05K2201/041 , H05K2201/094 , H05K2201/09472 , H05K2201/09827 , H05K2201/10159 , H05K2201/10674 , H05K2203/0465 , Y02P70/611 , Y10T29/49128
摘要：【課題】基本的に従来の有機材料系(例えば、エポキシ樹脂)のプリント配線板であって、半導体素子を実装可能な密なピッチのパッドをもつプリント配線板を提供すること【解決手段】この結合型のプリント配線板は、多層プリント配線板の一方の最外絶縁層の一部分に配線フィルムが固着された結合型のプリント配線板であって、前記配線フィルムの半導体素子搭載面には、第1の半導体素子と第2の半導体素子とを電気的に相互接続するため使用される密なピッチのパッドが形成され、前記多層プリント配線板の半導体素子搭載面には、第1の半導体素子又は第2の半導体素子と電気的に接続するため使用される疎なピッチのパッドが形成さている。【選択図】図1A
摘要翻译：要解决的问题：提供基本上基于常规有机材料（例如环氧树脂）的印刷线路板，其具有能够安装半导体元件的节距较窄的垫片。解决方案：在耦合型印刷布线布线膜与多层印刷布线板的一个最外层绝缘层的一部分接合。在布线膜的半导体元件安装面上，形成用于电连接第一半导体元件和第二半导体元件的紧密间距的焊盘。在多层印刷电路板的半导体元件安装面上，形成用于电连接第一半导体元件或第二半导体元件的粗糙间距的焊盘。

94. 发明专利

JP2014116465A Inductor component, manufacturing method therefor and printed wiring board 审中-公开
标题翻译：电感元件及其制造方法及印刷电路板
公开(公告)号：JP2014116465A
公开(公告)日：2014-06-26
申请号：JP2012269660
申请日：2012-12-10
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , YANO TOSHIMASA , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F41/02 , H01F41/046 , H01F2017/002 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To provide an inductor component in which desired inductance characteristics (inductance, Q value) can be ensured while scarcely inhibiting the electrical characteristics of surrounding conductors.SOLUTION: An inductor component 10 includes a core material 20 having a first surface F, a second surface S on the opposite side, and a through hole 22, a first conductor pattern 58F formed on the first surface of the core material, a second conductor pattern 58S formed on the second surface of the core material, and a through hole conductor provided inside of the through hole for connecting the first conductor pattern and second conductor pattern. An inductor 59 consisting of the first conductor pattern 58F, the second conductor pattern 58S and the through hole conductor 36 is also included, and a magnetic material layer is provided, at least partially, on the outer periphery of the inductor in the core material.
摘要翻译：要解决的问题：提供一种电感器部件，其中可以确保期望的电感特性（电感Q值），同时几乎不抑制周围导体的电特性。电感器部件10包括芯材20，芯材20具有第一表面F ，相对侧的第二表面S和形成在芯材的第一表面上的通孔22，形成在第一表面上的第一导体图案58F，形成在芯材的第二表面上的第二导体图案58S，以及通孔导体设置在通孔的内部，用于连接第一导体图案和第二导体图案。还包括由第一导体图案58F，第二导体图案58S和通孔导体36组成的电感器59，并且至少部分地在芯材中的电感器的外周设置有磁性材料层。

95. 发明专利

JP2013214578A Wiring board and method for manufacturing the same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2013214578A
公开(公告)日：2013-10-17
申请号：JP2012083288
申请日：2012-03-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TERUI MAKOTO , KOMATSU DAIKI , KUNIEDA MASATOSHI , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H05K3/305 , H01L21/563 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/5382 , H01L23/5383 , H01L23/5384 , H01L24/03 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2924/12042 , H01L2924/1436 , H01L2924/15192 , H01L2924/15311 , H05K1/115 , H05K3/10 , H05K3/103 , H05K3/20 , H05K3/32 , H05K3/4602 , H05K3/4658 , H05K3/4694 , H05K2201/10159 , H05K2201/10378 , H05K2201/1053 , Y10T29/49128 , Y10T29/49165 , H01L2924/00 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To provide a wiring board having high reliability and a method for manufacturing the same.SOLUTION: The wiring board includes: an interlayer insulating layer 26a; a conductor layer 31a formed on the interlayer insulating layer 26a; an interlayer insulating layer 33a provided on the interlayer insulating layer 26a and the conductor layer 31a; a sub wiring board 10 which is arranged on the interlayer insulating layer 26a and has an insulating layer 110 and a conductor layer 111 on an insulating layer 120; a conductor layer 36a formed on the interlayer insulating layer 33a; and a via conductor 35a which is formed inside the interlayer insulating layer 33a and connects the conductor layer 31a and the conductor layer 36a.
摘要翻译：要解决的问题：提供一种具有高可靠性的布线板及其制造方法。解决方案：布线板包括：层间绝缘层26a; 形成在层间绝缘层26a上的导体层31a; 设置在层间绝缘层26a和导体层31a上的层间绝缘层33a; 配置在层间绝缘层26a上并具有绝缘层110和绝缘层120上的导体层111的子布线板10; 形成在层间绝缘层33a上的导体层36a; 以及形成在层间绝缘层33a内部并连接导体层31a和导体层36a的通孔导体35a。

96. 发明专利

JP2013175614A Manufacturing method of electronic component and wiring board 有权
标题翻译：电子元件和接线板的制造方法
公开(公告)号：JP2013175614A
公开(公告)日：2013-09-05
申请号：JP2012039552
申请日：2012-02-27
申请人： Ibiden Co Ltd , イビデン株式会社 , Ibi Tech Co Ltd , イビテック株式会社
发明人： TERUI MAKOTO , HASEGAWA KIYOHISA , KARIYA TAKASHI
IPC分类号： H01L25/04 , H01L25/18 , H05K1/02 , H05K3/00 , H05K3/46
CPC分类号： H01L2224/16225 , H01L2224/92125 , H01L2924/15311
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component which enables a test of a first chip to be conducted after mounting the first chip and before mounting a second chip.SOLUTION: After a logic chip 90A is mounted on a first mounting pad 158A to conduct a function test of the logic chip 90A through a test pad 158T (Fig. 4(A)), a memory chip 90B is mounted on a second mounting pad 158B (Fig. 4(B)). The manufacturing method allows the test of the logic chip to be easily conducted before the memory chip is attached. Thus, when the logic chip does not function, the attachment of the memory chip may be cancelled and the wasteful use of the memory chip is avoided.
摘要翻译：要解决的问题：提供一种电子部件的制造方法，其能够在安装第一芯片之后并且在安装第二芯片之前进行第一芯片的测试。解决方案：在将逻辑芯片90A安装在第一安装垫片158A通过测试焊盘158T（图4（A））进行逻辑芯片90A的功能测试，存储芯片90B安装在第二安装焊盘158B上（图4（B））。制造方法允许在安装存储器芯片之前容易地进行逻辑芯片的测试。因此，当逻辑芯片不起作用时，可以消除存储芯片的附着，避免存储芯片的浪费。

97. 发明专利

JP2013008895A Wiring board and manufacturing method of the same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2013008895A
公开(公告)日：2013-01-10
申请号：JP2011141523
申请日：2011-06-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , KATO SHINOBU , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which ensures the inductor performance even if the wiring board includes a small number of layers, and to provide a manufacturing method of the wiring board.SOLUTION: A wiring board 10 includes: a base material 20 having a first surface F and a second surface S; first through hole conductors 30A, 30C, 30E and second through hole conductors 30B, 30D, 30F which penetrate through the base material 20; first conductor patterns 33B, 33C formed on the first surface F side of the base material 20 and connecting the first through hole conductors 30A, 30C, 30E with the second through hole conductors 30B, 30D, 30F; and second conductor patterns 34A, 34B, 34C formed on the second surface S side of the base material 20 and connecting the first through hole conductors 30A, 30C, 30E with the second through hole conductors 30B, 30D, 30F. The first through hole conductors, the second through hole conductors, the first conductor patterns, and the second conductor patterns form an inductor L.
摘要翻译：要解决的问题：提供即使布线板包括少量层也能确保电感器性能的布线板，并且提供布线板的制造方法。解决方案：布线板10包括：具有第一表面F和第二表面S的基材20; 穿过基材20的第一通孔导体30A，30C，30E和第二通孔导体30B，30D，30F; 形成在基材20的第一表面F侧的第一导体图案33B，33C，并将第一通孔导体30A，30C，30E与第二通孔导体30B，30D，30F连接; 以及形成在基材20的第二表面S侧的第二导体图案34A，34B，34C，并且将第一通孔导体30A，30C，30E与第二通孔导体30B，30D，30F连接。第一通孔导体，第二通孔导体，第一导体图案和第二导体图案形成电感器L.版权所有：（C）2013，JPO＆INPIT

98. 发明专利

JP2010232636A Multilayer printed wiring board 审中-公开
标题翻译：多层印刷接线板
公开(公告)号：JP2010232636A
公开(公告)日：2010-10-14
申请号：JP2010015154
申请日：2010-01-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： KARIYA TAKASHI , YOSHIKAWA KAZUHIRO , KOMATSU DAIKI , BHANDARI RAMESH
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H05K3/429 , H01L21/486 , H01L23/13 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/3011 , H05K1/0271 , H05K1/183 , H05K3/4602 , H05K3/4644 , H05K3/4694 , H05K2201/0187 , H05K2201/068 , Y10T29/49165 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of achieving fineness. SOLUTION: Since a build-up wiring layer can be formed on the surface of a low thermal expansion substrate 50 featuring excellent flatness, a conductor circuit 38 featuring fine wiring and excellent thickness accuracy can be formed, achieving a fine pitch. Further, by forming the build-up wiring layer 38 on a core substrate 12, high density and downsizing are achieved, allowing a thin plate to be obtained by reducing the number of layers. By making the low thermal expansion substrate 50 to be built-in, a via conductor 40 of the low thermal expansion substrate 50 can be connected with a via 46 through plating, enabling to enhance reliability. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够实现细度的多层印刷线路板。解决方案：由于可以在具有优异平坦度的低热膨胀基板50的表面上形成积聚布线层，所以可以形成具有精细布线和优异的厚度精度的导体电路38，从而实现细微的间距。此外，通过在芯基板12上形成积层布线层38，实现了高密度和小型化，通过减少层数可以获得薄板。通过使低热膨胀基板50内置，低热膨胀基板50的通路导体40能够通过电镀与通孔46连接，能够提高可靠性。版权所有（C）2011，JPO＆INPIT

99. 发明专利

JP2008034839A Capacitor having adjustable capacitance and printed wiring board having same 审中-公开
标题翻译：具有可调节电容的电容器和具有相同功能的印刷电路板
公开(公告)号：JP2008034839A
公开(公告)日：2008-02-14
申请号：JP2007177108
申请日：2007-07-05
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： SAKAMOTO HAJIME , KARIYA TAKASHI , MANO YASUHIKO
IPC分类号： H01G4/255 , H01G4/12 , H01G4/18 , H01G4/30 , H05K3/46
CPC分类号： H01G4/005 , H01G2/06 , H05K1/162 , H05K3/4644 , H05K2201/09509 , H05K2201/0969 , H05K2203/171
摘要： PROBLEM TO BE SOLVED: To provide a novel capacitor having adjustable capacitance and a printed wiring board having the same. SOLUTION: The capacitance of a capacitor is adjusted by: forming openings in one of a pair of electrodes of the capacitor, the openings having different sizes d1, d2, d3, ... wherein d1>d2>d3... and being arranged in numbers n1, n2, n3, ..., respectively; and sequentially filling a necessary number of the openings with an electroconductive material in descending order of size so as to adjust the capacitance gradually with an increasing degree of precision. The resulting capacitor is included to a printed wiring board. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有可调电容的新型电容器和具有该电容器的印刷电路板。解决方案：通过以下方法来调节电容器的电容：在电容器的一对电极中形成开口，开口具有不同的尺寸d1，d2，d3，...，其中d1> d2> d3 ... 并分别以数字n1，n2，n3，...排列; 并按照尺寸的大小顺序用导电材料依次填充必要数量的开口，以便随着精度的增加逐渐调整电容。所得到的电容器被包括在印刷线路板中。版权所有（C）2008，JPO＆INPIT

100. 发明专利

JP2008021996A Power-supply-integrated package board 有权
标题翻译：电源综合封装板
公开(公告)号：JP2008021996A
公开(公告)日：2008-01-31
申请号：JP2007177205
申请日：2007-07-05
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： KARIYA TAKASHI , MANO YASUHIKO , KONO SHUICHI , CHIN TOSHIMASU
IPC分类号： H01L23/12 , H01L25/00 , H05K3/46
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2224/45124 , H01L2224/45139 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H01L2924/01078 , H01L2924/16152 , H01L2924/207 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/48 , H01L2924/0002 , H01L2224/0401 , H01L2924/01005
摘要： PROBLEM TO BE SOLVED: To provide a small-sized power-supply-integrated package board which can supply low voltages and large currents to the IC side and reduce the height of a power supply. SOLUTION: A magnetic layer 74B is formed on the surface of a copper wire 74C so that the magnetic saturation of the copper wire 74C hardly occurs and that an inductor 74 comes to have sufficient inductance. A plurality of the inductances 74 are arranged in rows, and are fixed with resin 72 to make an inductor array 70. This allows arranging many inductors in a small space, thus enabling power supply division. Power supply division increases the number of feeder cables 52 to lessen a current volume per feeder cable 52, which enables supply of a large current to the IC chip 40 side. In addition, a power supply module 50 is built in the package board 30. This shortens the distance between the power supply and the IC chip 40, which reduces heat generation and voltage drop by the feeder cables 52, thereby facilitates supply of large currents to the IC chip 40 side. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够向IC侧提供低电压和大电流并降低电源高度的小型电源集成封装板。解决方案：在铜线74C的表面上形成磁性层74B，使得铜线74C的磁饱和几乎不发生，并且电感器74具有足够的电感。多个电感器74排列成行，并用树脂72固定以形成电感器阵列70.这允许在许多空间中布置许多电感器，从而实现电源分配。供电部分增加馈电电缆52的数量，以减小每个馈电电缆52的电流容量，这使得能够向IC芯片40侧提供大电流。此外，电源模块50内置在封装板30中。这缩短了电源和IC芯片40之间的距离，这减少了馈电电缆52的发热和电压降，从而有助于将大电流提供给 IC芯片40侧。版权所有（C）2008，JPO＆INPIT

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