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91. 发明专利

JP4298946B2 Electromagnetic wave shielding material 有权
公开(公告)号：JP4298946B2
公开(公告)日：2009-07-22
申请号：JP2001346068
申请日：2001-11-12
申请人：東レ・デュポン株式会社
发明人：一彦小菅 , 勉山本 , 眞人渡邊
IPC分类号： D06M11/00 , H05K9/00 , D06M11/83 , D06M101/36 , D21H13/48

92. 发明专利

JP2009132055A Automobile friction material and manufacturing method therefor 有权
标题翻译：汽车摩擦材料及其制造方法
公开(公告)号：JP2009132055A
公开(公告)日：2009-06-18
申请号：JP2007310355
申请日：2007-11-30
申请人： Du Pont Toray Co Ltd , Toray Ind Inc , 東レ・デュポン株式会社 , 東レ株式会社
发明人： KANNO KOJI , KIMURA TOSHIHIKO , TATSUMI KAORU , WATANABE MASATO
IPC分类号： B32B5/26
摘要： PROBLEM TO BE SOLVED: To provide an automobile friction material capable of preventing interlayer separation from occurring even under severe friction for a long time, and having characteristics such as a high dynamic friction coefficient in a surface layer part of a friction face side and a high heat conduction restraint property in a surface layer part of the other face side.
SOLUTION: Fluid injection working is applied on a face, serving as a friction face, of single layer cloth containing a crystalline polymer fiber, the crystalline polymer fiber is fibrillated thereby, and fibrils more than those in the surface layer part in the other face side are formed in the surface layer part in the friction face side.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了提供即使在长时间的严重摩擦下也能够防止层间分离的汽车摩擦材料，并且在摩擦面侧的表层部分具有诸如高动摩擦系数的特性并且在另一面侧表面层部分具有高的热传导约束性。
解决方案：将流体注射工作施加在含有结晶聚合物纤维的单层布的作为摩擦面的表面上，结晶聚合物纤维被原纤化，并且原纤维比在在摩擦面侧的表层部形成有另一面侧。版权所有（C）2009，JPO＆INPIT

93. 发明专利

JP2009052015A Thermoplastic elastomer resin composition and molding 审中-公开
标题翻译：热塑性弹性体树脂组合物和模塑
公开(公告)号：JP2009052015A
公开(公告)日：2009-03-12
申请号：JP2008060711
申请日：2008-03-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAKAI HIDETOSHI
IPC分类号： C08L67/02 , C08L51/04
摘要： PROBLEM TO BE SOLVED: To provide a thermoplastic elastomer resin composition with low environmental load reducing carbon dioxide emission in production while retaining the characteristics of a polyester elastomer having softness, high elasticity and excellent moldability, and to provide a molding comprising the composition. SOLUTION: The thermoplastic elastomer resin composition is obtained by blending 35-85 wt.% of a polyester block copolymer (A), 5-45 wt.% of a graft copolymer composition (B) and 10-55 wt.% of an aliphatic polyester (C) so that the total amount of the components (A) and (B) is set to 90-45 wt.% and the total amount of the components (A), (B) and (C) becomes 100 wt.%. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有低环境负荷的热塑性弹性体树脂组合物，同时保持具有柔软性，高弹性和优异成型性的聚酯弹性体的特性，并提供包含该组合物的模制品。解决方案：热塑性弹性体树脂组合物通过将35-85重量％的聚酯嵌段共聚物（A），5-45重量％的接枝共聚物组合物（B）和10-55重量％的脂肪族聚酯（C），使得成分（A）和（B）的总量为90〜45重量％，成分（A），（B）和（C）的总量成为 100重量％。版权所有（C）2009，JPO＆INPIT

94. 发明专利

JP2009040871A Wholly aromatic polyamide solution, method for producing wholly aromatic polyamide solution and wholly aromatic polyamide powder, n-substituted wholly aromatic polyamide and method for producing n-substituted wholly aromatic polyamide powder 审中-公开
标题翻译：单独的芳族聚酰胺溶液，用于生产单体芳族聚酰胺溶液和单体芳族聚酰胺粉末的方法，N-取代的芳香族聚酰胺以及用于生产N-取代的芳族聚酰胺粉末的方法
公开(公告)号：JP2009040871A
公开(公告)日：2009-02-26
申请号：JP2007206974
申请日：2007-08-08
申请人： Du Pont Toray Co Ltd , Univ Of Fukui , 国立大学法人福井大学 , 東レ・デュポン株式会社
发明人： CHO SHU , MAEDA SHU , KOSUGE KAZUHIKO , IKEDA ISAO , SUGIHARA SHINJI
IPC分类号： C08L77/10 , C08G69/48 , C08J3/12 , C08K5/00 , C08K5/19
摘要： PROBLEM TO BE SOLVED: To provide a wholly aromatic polyamide solution, methods for producing the wholly aromatic polyamide solution and wholly aromatic polyamide powder, an N-substituted wholly aromatic polyamide and a method for producing the powdery material of the same.
SOLUTION: This wholly aromatic polyamide solution is produced by mixing the wholly aromatic polyamide with a solvent consisting of the combination of a quaternary ammonium salt expressed by general formula: N(R
1 )(R
2 )
3 -F [wherein, R
1 is a linear or branched 1-18C alkyl, phenyl or benzyl; and R
2 is a 1-4C alkyl] with an aprotic polar organic solvent, and then heating for dissolving. In the above solution, the N-substituted wholly aromatic polyamide is produced by reacting the wholly aromatic polyamide with a halogen compound expressed by general formula: X-(R
3 )-Y [wherein, R
3 is a 1-21C linear or branched alkylene; X is a halogen group selected from Cl or Br; and Y is a group selected from -CH
3 , -CH=CH
2 , -phenyl and a 1-9C alkylaryl group (aralkyl group)] in the presence of sodium hydride.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供全芳香族聚酰胺溶液，全芳香族聚酰胺溶液和全芳香族聚酰胺粉末的制造方法，N-取代的全芳香族聚酰胺及其制造方法。解决方案：这种全芳族聚酰胺溶液是通过将全芳族聚酰胺与由以下通式组合的溶剂混合制成的：溶剂，其由以下通式表示的季铵盐：N（R 1 ） SP> 2 3 -F [其中，R 1是直链或支链的1-18C烷基，苯基或苄基; 并且R 2 是1-4C烷基]与非质子极性有机溶剂，然后加热溶解。在上述溶液中，N-取代的全芳香族聚酰胺通过使全芳香族聚酰胺与通式X-（R SP 3）-Y表示的卤素化合物反应而制备，[其中，R 3 是1-21C直链或支链亚烷基; X是选自Cl或Br的卤素基团; 和Y为选自-CH 3，SO 3，-CH = CH 2 S 2 - ， - 苯基和1-9C烷基芳基（芳烷基）]的基团，在钠存在下氢化物。版权所有（C）2009，JPO＆INPIT

95. 发明专利

JP2009019096A Cover-lay 审中-公开
标题翻译：封面
公开(公告)号：JP2009019096A
公开(公告)日：2009-01-29
申请号：JP2007182279
申请日：2007-07-11
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： C08G73/10 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a cover-lay that exhibits excellent dimensional stability and excellent heat resistance, is endowed with properties adaptable to AOI and is excellent in running properties (easily sliding properties) and adhesive properties.
SOLUTION: The cover-lay comprises a polyimide film mainly composed of p-phenylene diamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride as an acid dianhydride component and an adhesive layer formed on one surface thereof, where in the polyimide film a powder is dispersed mainly composed of inorganic particles having a particle size within the range of 0.01-1.5 μm and an average particle size of 0.05-0.7 μm in a ratio of 0.1-0.9 wt.% based on the weight of the film resin.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的尺寸稳定性和优异的耐热性的覆盖层，具有适用于AOI的性能，并且具有优异的运行性能（易滑动性）和粘合性能。解决方案：覆盖层包括主要由对苯二胺和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜和作为酸二酐组分的均苯四酸二酐和在其一个表面上形成的粘合剂层，其中在聚酰亚胺膜中，主要由0.01〜1.5μm的粒径和0.05〜0.7μm的平均粒径的无机粒子构成的粉末以0.1-0.9重量％的比例分散，薄膜树脂。版权所有（C）2009，JPO＆INPIT

96. 发明专利

JP2009018520A Copper clad plate 审中-公开
标题翻译：铜箔板
公开(公告)号：JP2009018520A
公开(公告)日：2009-01-29
申请号：JP2007183773
申请日：2007-07-13
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , KOKUNI MASAHIRO , SAWAZAKI KOICHI
IPC分类号： B32B15/088 , C08J5/12 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper clad plate reduced in the rate of dimensional change after etching while satisfying both dimensional change and heat resistance, having characteristics adaptable for AOI, also excellent in running property (slidability) and adhesiveness, and suitable for a high-performance flexible printed wiring board.
SOLUTION: The copper clad plate comprises: a polyimide film mainly including 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as diamine component and pyromellitic dianhydride as acid dianhydride component, the film having slidability obtained by adding inorganic fine particles to generate surface projections thereon; a copper plate adhered to one surface of the polyimide film through an adhesive; and a copper plate adhered to the other surface of the film without adhesive.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在蚀刻后减小尺寸变化率的铜包覆板，同时满足尺寸变化和耐热性，具有适用于AOI的特性，还具有优异的运行性能（滑动性）和粘合性，以及适用于高性能柔性印刷线路板。解决方案：铜包覆层包括：主要包含3,4'-二氨基二苯醚和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜和作为酸二酐组分的均苯四酸二酐，该膜具有通过添加无机物获得的滑动性细颗粒以在其上产生表面突起; 通过粘合剂粘附在聚酰亚胺膜的一个表面上的铜板; 并且在没有粘合剂的情况下粘附到膜的另一个表面的铜板。版权所有（C）2009，JPO＆INPIT

97. 发明专利

JP2008293692A Led illumination device, and lighting fixture for vehicle using the device 有权
标题翻译： LED照明装置以及使用装置的车辆的照明装置
公开(公告)号：JP2008293692A
公开(公告)日：2008-12-04
申请号：JP2007135545
申请日：2007-05-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MACHIDA HIDEAKI
IPC分类号： F21S8/10 , F21V29/00 , F21Y101/02
CPC分类号： Y02P20/52
摘要： PROBLEM TO BE SOLVED: To provide an LED illumination device which is superior in radiation characteristics, light in weight, high in precision, and high in a degree of the freedom of designing, and can be manufactured efficiently.
SOLUTION: This LED illumination device 10 is equipped with a substrate body 12 in which a thermoplastic heat resistant film is formed to have a prescribed three-dimensional form, one or a plurality of numbers of surface-mounting type LEDs 14 mounted to a prescribed position of the substrate body 12, and a conductive circuit 16 which is installed at least on one of the surface of the front face or the rear face of the substrate body 12, and connects the LEDs 14 to an external circuit and lights them on, and a radiating layer 18 composed of metal is formed on the opposite face of the conductive circuit 16 of the substrate body 12. By such a constitution, heat generated by the LEDs 14 can be radiated effectively from both front and rear faces of the LED illumination device 10 via the conductive circuit 16 and the radiating layer 18, and the degradation of LED elements caused by the heat can be prevented.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种辐射特性，重量轻，精度高，设计自由度高的LED照明装置，能够高效率地制造。解决方案：该LED照明装置10配备有基板主体12，其中形成热塑性耐热膜以具有规定的三维形状，一个或多个表面安装型LED 14安装到基板主体12的规定位置和安装在基板主体12的正面或背面的至少一个表面上的导电电路16，并且将LED 14连接到外部电路并点亮它们并且在基板主体12的导电电路16的相对面上形成由金属构成的散热层18.通过这样的结构，可以从LED 14的前后两面的有效面发射由LED 14产生的热量可以防止LED照明装置10经由导电电路16和辐射层18以及LED元件由热引起的劣化。版权所有（C）2009，JPO＆INPIT

98. 发明专利

JP2008291085A Highly adhsive polyimide film and method for producing the same 审中-公开
标题翻译：高粘度聚酰亚胺膜及其制造方法
公开(公告)号：JP2008291085A
公开(公告)日：2008-12-04
申请号：JP2007136703
申请日：2007-05-23
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TESHIBA TOSHIHIRO , SUEHIRO MORITSUGU
IPC分类号： C08J5/18 , C08G73/10 , C08J7/00 , C08K3/00 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a highly adhesive polyimide film improved in adhesivity to copper foil and also excellent in slipperiness, dimensional stability and wettability to water, and to provide a method for producing the film.
SOLUTION: The highly adhesive polyimide film is such as to be formed from 4,4'-diaminodiphenyl ether(ODA) and pyromellitic dianhydride(PMDA) and contain inorganic particles. The polyimide film has the following properties: The shrinkage when heated at 200°C is ≤0.05% both in the machine direction(MD) and transverse direction(TD). The surface roughness Ra is ≥0.065 μm and Rmax is ≥1.0 μm as determined by a tracer-type surface roughness tester. The coefficient of static friction is ≤1.0. The surface free energy is ≥80 mN/m as determined based on a contact angle method.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种改进了对铜箔的粘附性的高粘合性聚酰亚胺膜，并且还具有优异的滑爽性，尺寸稳定性和对水的润湿性，并提供了一种制备该膜的方法。解决方案：高粘合性聚酰亚胺膜由4,4'-二氨基二苯醚（ODA）和均苯四酸二酐（PMDA）形成，并含有无机颗粒。聚酰亚胺膜具有以下性质：在机械方向（MD）和横向（TD）下，在200℃下加热时的收缩率不大于0.05％。通过示踪型表面粗糙度测定仪测定，表面粗糙度Ra为≥0.065μm，Rmax为≥1.0μm。静摩擦系数≤1.0。基于接触角法测定的表面自由能为≥80mN/ m。版权所有（C）2009，JPO＆INPIT

99. 发明专利

JP4189569B2 Method of producing a carbon film 有权
公开(公告)号：JP4189569B2
公开(公告)日：2008-12-03
申请号：JP2001363728
申请日：2001-11-29
申请人：東レ・デュポン株式会社
发明人：賢治鵜原
IPC分类号： C01B31/02

100. 发明专利

JP2008266648A Fiber reinforced thermoplastic resin composite material and formed article using it 审中-公开
标题翻译：纤维增强热塑性树脂复合材料和成型用品
公开(公告)号：JP2008266648A
公开(公告)日：2008-11-06
申请号：JP2008123117
申请日：2008-05-09
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： TSUKAMOTO KOICHI , KOSUGE KAZUHIKO
IPC分类号： C08J5/04 , B32B5/26 , B32B27/02 , B32B27/04 , D04C1/02 , D04C1/12
摘要： PROBLEM TO BE SOLVED: To provide a fiber reinforced thermoplastic resin composite material which is light in weight and also high in strength, is excellent in heat-resistance, wear resistance and impact resistance, has excellent impregnating ability and small void, and excellent in formability and recyclability, and a formed article using it.
SOLUTION: The composite material using a para aramide fiber as a reinforcing material and a thermoplastic resin as a matrix is obtained by heating compression molding of a braid which contains the para aramide fiber as a core yarn and a thermoplastic resin fiber as a braid yarn, or a laminate of the braid with a thermoplastic resin film or nonwoven fabric.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供重量轻且强度高的纤维增强热塑性树脂复合材料，耐热性，耐磨性和耐冲击性优异，具有优异的浸渍能力和小的空隙，以及成型性和可回收性优异，使用它的成型制品。解决方案：使用对位芳族聚酰胺纤维作为增强材料和热塑性树脂作为基质的复合材料通过加热压缩成型包含对位芳族聚酰胺纤维作为芯纱的编织物和热塑性树脂纤维作为编织纱或编织物与热塑性树脂膜或无纺布的层压体。版权所有（C）2009，JPO＆INPIT

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