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91. 发明专利

JP4920678B2 Material storage and dispensing package and method 有权
公开(公告)号：JP4920678B2
公开(公告)日：2012-04-18
申请号：JP2008509038
申请日：2006-04-25
申请人：アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人：アルバーグ，ミシェル , オドウアティ，ケビン，ティー． , キンガリー，ジョン，アール． , トム，グレン，エム． , ミッケルセン，カーク , メニング，ジョセフ , ヤン，ホンウェイ
IPC分类号： B65D83/00 , B67D99/00 , B65D65/40 , B65D77/04 , H01L21/205 , H01L21/306
CPC分类号： B65D33/00 , B65B31/003 , B65D83/0061 , B65D83/62 , Y10T428/249981 , Y10T428/31757
摘要： Packages and methods for storage and dispensing of materials, e.g., high purity liquid reagents and chemical mechanical polishing compositions used in the manufacture of microelectronic device products, including containment structures and methods adapted for pressure-dispensing of high-purity liquids. Liner packaging of liquid or liquid-containing media is described, in which zero or near-zero head space conformations are employed to minimize adverse effects of particle generation, formation of bubbles and degradation of contained material.

92. 发明专利

JP2012062572A Etching solution for copper or copper alloy 有权
标题翻译：铜或铜合金蚀刻解决方案
公开(公告)号：JP2012062572A
公开(公告)日：2012-03-29
申请号：JP2011175477
申请日：2011-08-11
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： YOSHIDA YUTAKA , KOMICHI YUKICHI
IPC分类号： C23F1/18 , C23F1/34
CPC分类号： C23F1/18 , C23F1/44 , H01L21/32134 , H01L21/76885 , H01L21/76898 , H01L24/03 , H01L2224/0346 , H01L2224/03614 , H01L2224/0401 , H01L2224/05647 , H01L2224/11 , H01L2224/11912 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an etching solution for highly selectively etching copper or a copper alloy from an electronic substrate, in a stage of etching the copper or the copper alloy from the electric substrate simultaneously including the copper or the copper alloy and nickel simultaneously.SOLUTION: The etching solution is used for the stage of selectively etching the copper or the copper alloy from the electronic substrate simultaneously including the copper or the copper alloy and nickel, the solution being an etching solution for copper or a copper alloy comprising a chelating agent (A) having an acid group in a molecule, hydrogen peroxide (B), and a surfactant (C) having an oxyethylene chain in a molecule, as essential components.
摘要翻译：要解决的问题：为了提供一种用于从电子基板高选择性地蚀刻铜或铜合金的蚀刻溶液，在同时包括铜或铜合金的电气基板上蚀刻铜或铜合金的阶段和镍。解决方案：蚀刻溶液用于同时包括铜或铜合金和镍的电子衬底的铜或铜合金的选择性蚀刻阶段，该溶液是用于铜或铜合金的蚀刻溶液，其包括分子中具有酸基的螯合剂（A），过氧化氢（B）和分子中具有氧化乙烯链的表面活性剂（C）作为必要成分。版权所有（C）2012，JPO＆INPIT

93. 发明专利

JP2012052669A System for delivery of reagent from solid source thereof 有权
标题翻译：从其固体源输送试剂的系统
公开(公告)号：JP2012052669A
公开(公告)日：2012-03-15
申请号：JP2011263316
申请日：2011-12-01
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： MARGANSKI PAUL J , DIETZ JAMES I , SWEENEY JOSEPH D
IPC分类号： F17C7/00 , B01L99/00 , H01L21/205
CPC分类号： B01J7/00 , B01J2219/00094 , B01J2219/00141 , B01J2219/00146 , C23C14/48 , C23C14/564 , C23C16/4405 , C23C16/4481
摘要： PROBLEM TO BE SOLVED: To provide a system for delivery of reagents from solid sources thereof.SOLUTION: The system (10) for delivery of the reagent from the solid source thereof includes a structure (16, 22, 24) arranged to retain a solid source material (30) in confinement by at least a part of the structure, for heating and generation of vapor from the solid source material by volatilization thereof, a heat source (82) arranged to heat the solid source material for such volatilization, and a vapor dispensing assembly (52, 54) arranged to discharge the vapor from the system. A high conductance valve (1510) includes a valve body (1512) in which inlet and outlet passages are substantially perpendicular to one another, with their interior extremities communicating with a valve chamber (1536) containing a selectively positionable valve element movable between a fully open and fully closed position.
摘要翻译：要解决的问题：提供用于从其固体源输送试剂的系统。解决方案：用于从固体源输送试剂的系统（10）包括布置成通过结构的至少一部分将固体源材料（30）保持约束的结构（16,22,24），用于通过其挥发来加热和产生来自固体源材料的蒸汽;布置成加热固体源材料用于这种挥发的热源（82），以及蒸气分配组件（52,54），其被布置成将蒸气从系统。高电导阀（1510）包括阀体（1512），入口和出口通道基本上彼此垂直，其内部端部与阀室（1536）连通，所述阀室包含可选择性定位的阀元件，该阀门可在完全打开和完全关闭位置。版权所有（C）2012，JPO＆INPIT

94. 发明专利

JP2012048733A Manufacturing system with intrinsically safe electric information storage 有权
标题翻译：具有本质安全电气信息存储的制造系统
公开(公告)号：JP2012048733A
公开(公告)日：2012-03-08
申请号：JP2011220463
申请日：2011-10-04
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： KEVIN T O'DOUGHERTY , BAILEY BRIAN
IPC分类号： G06K17/00 , G05B19/042 , G06F17/00 , G06K20060101
CPC分类号： G05B19/0425 , G05B2219/24028 , G05B2219/25293
摘要： PROBLEM TO BE SOLVED: To ensure the safety of an RFID system used for a manufacturing system including a hazard zone and a non-hazard zone.SOLUTION: A system includes a storage device 22, located in a hazard zone 12, for electrically storing information. The system further includes a communication device 24, also located in the hazard zone 12, for storing information to and reading information from the storage device 22. In a non-hazard zone 11, a controller 14 is in electrical communication with a communication device 24. The controller 14 controls the system based on information read from the storage device 22 by the communication device 24. To limit electrical energy passing to the communication device 24, an intrinsic safety barrier 16 located in the non-hazard zone 11 is connected between the communication device 24 and the controller device 14.
摘要翻译：要解决的问题：确保用于包括危险区域和非危险区域的制造系统的RFID系统的安全性。解决方案：系统包括位于危险区域12中的用于电存储信息的存储设备22。该系统还包括通信设备24，其也位于危险区域12中，用于向存储设备22存储信息和从存储设备22读取信息。在非危险区域11中，控制器14与通信设备24电通信控制器14基于由通信设备24从存储设备22读取的信息来控制系统。为了限制通向通信设备24的电能，位于非危险区域11中的本征安全栅16连接在通信设备24和控制器设备14.版权所有（C）2012，JPO＆INPIT

95. 发明专利

JP2012001819A Alkane/polyamine solvent composition for liquid delivery cvd 审中-公开
标题翻译：用于液体递送CVD的烷烃/聚氨酯溶剂组合物
公开(公告)号：JP2012001819A
公开(公告)日：2012-01-05
申请号：JP2011197056
申请日：2011-09-09
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： BAUM THOMAS H , BHANDARI GAUTAM
IPC分类号： C09K3/00 , C23C16/40 , C23C16/18 , C23C16/448 , H01L21/314
CPC分类号： C23C16/409 , C23C16/18 , C23C16/40 , C23C16/448 , C23C16/4481 , Y10S423/14
摘要： PROBLEM TO BE SOLVED: To provide a novel solvent composition having broad utility for CVD precursors, such as those comprising metal organic compositions with β-diketonate ligands.SOLUTION: The solvent composition for liquid delivery chemical vapor deposition of metal organic precursors, comprises a mixture of solvent species A, B and C in the proportion A:B:C wherein A is from about 3 to about 7 parts by volume, B is from about 2 to about 6 parts by volume, and C is present up to about 3 parts by volume, wherein such parts by volume are based on the total volume of the mixture, and wherein A is a C6-C8 alkane, B is a C8-C12 alkane, A and B are different from one another, and C is selected from the group consisting of glyme-based solvents (glyme, diglyme, and tetraglyme) and polyamines. The particular solvent composition including octane, decane and polyamine in an approximate 5:4:1 weight ratio is particularly usefully employed in the formation of SrBiTaOfilms.
摘要翻译：待解决的问题：提供一种具有广泛应用于CVD前体的新型溶剂组合物，例如包含具有β-二酮配体的金属有机组合物的溶剂组合物。溶液：用于液体输送化学气相沉积金属有机前体的溶剂组合物包含A：B：C比例的溶剂A，B和C的混合物，其中A为约3至约7体积份，B为约2至约6体积份，C为至多约3体积份，其中体积份数为混合物的总体积，其中A为C6-C8烷烃， B是C8-C12烷烃，A和B彼此不同，C选自甘醇二甲醚溶剂（甘醇二甲醚，二甘醇二甲醚和四甘醇二甲醚）和多胺。包含辛烷值，癸烷和多胺在5：4：1重量比范围内的特定溶剂组合特别有用地用于形成SrBi 2 O 9 。版权所有（C）2012，JPO＆INPIT

97. 发明专利

JP2011099562A Process for fabricating sorbent-based gas storage and dispensing system, utilizing sorbent material pretreatment 审中-公开
标题翻译：用于制造基于SORBENT的气体储存和分配系统的方法，利用SORBENT材料预处理
公开(公告)号：JP2011099562A
公开(公告)日：2011-05-19
申请号：JP2010280915
申请日：2010-12-16
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： WANG LUPING , MCMANUS JAMES V
IPC分类号： F17C11/00 , B01D53/04 , B01J4/02 , B01J20/08 , B01J20/10 , B01J20/14 , B01J20/16 , B01J20/18 , B01J20/20 , B01J20/26 , B01J20/34 , F17C7/00
CPC分类号： B01D53/0407 , B01D2253/102 , B01D2253/104 , B01D2253/106 , B01D2253/202 , B01D2253/308 , B01D2257/502 , B01D2257/504 , B01D2259/4525 , B01J20/18 , B01J20/20 , B01J20/28004 , B01J20/28019 , B01J2220/66 , F17C11/00 , F17C2205/0338 , F17C2205/0391 , Y02C10/08 , Y02E60/321
摘要： PROBLEM TO BE SOLVED: To provide a dispensing gas with high purity by desorbing at least a part of a heterogeneous adsorbable body from an adsorbent. SOLUTION: A gas storage and dispensing system 10 includes a dispenser container 12 for holding a physical sorbent material 16 having sorptive affinity for (i) a sorbable dispensing gas to be held in and subsequently selectively discharged from the container 12, and (ii)extraneous sorbables, in which the physical sorbent material having extraneous sorbables sorbed thereon, is treated to desorb at least part of the extraneous sorbables therefrom. The treated sorbent material 16 is loaded in the container 12, and sorbable dispensing gas is introduced into the container 12, for causing the container 12 holding the dispensing gas sorbed on the physical sorbent material to be sealed, so that the container 12 thereafter contains the dispensing gas in a high purity form, allowing selective dispensing by desorption and discharging of the dispensing gas from the container 12. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过从吸附剂解吸至少一部分异质吸附体来提供高纯度的分配气体。气体储存和分配系统10包括分配器容器12，用于保持具有吸附亲合力的物理吸附剂材料16，用于（i）可吸持的分配气体被保持在容器12中并随后从容器12中选择性地排出，以及（ ii）处理其中吸附有外来吸附物的物理吸附剂材料的外来可吸收物质被处理以从其中解吸至少部分外来的可吸收物质。经处理的吸附剂材料16装载到容器12中，并且可吸收的分配气体被引入到容器12中，以使得保持吸附在物理吸附剂材料上的分配气体的容器12被密封，使得容器12此后包含以高纯度形式分配气体，允许通过从容器12解吸和排出分配气体进行选择性分配。版权所有（C）2011，JPO＆INPIT

98. 发明专利

JP2011512015A Cleaning of the ion source in the semiconductor processing system 审中-公开
公开(公告)号：JP2011512015A
公开(公告)日：2011-04-14
申请号：JP2010546872
申请日：2009-02-11
申请人：アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人：イェデーブ，シャラド，エヌ． , エルドライド，デイビッド , オランダー，ダブリュー．，カール , カイム，ロバート , サージ，スティーブン , スウィーニー，ジョセフ，ディー． , タン，イン , バイル，オレグ , ビショップ，スティーブン，イー． , フェン，リン
IPC分类号： H01J37/317 , H01J27/08 , H01J37/08
CPC分类号： H01J37/3171 , C23C14/48 , C23C14/54 , C23C14/564 , H01J37/08 , H01J37/16 , H01J37/18 , H01J2237/082 , H01J2237/22
摘要：所望のフィラメントの成長、あるいはフィラメントのエッチングを行うために、アークチャンバ内の適切な温度制御によってアークチャンバのイオン源内にある前記フィラメントの成長／エッチングを可能にする反応性洗浄試薬を利用する、イオン注入システムまたはその構成要素の洗浄。また、イオン注入装置の領域または注入装置の構成要素を洗浄するために、インサイチュまたはエクスサイチュ洗浄構成で、周囲温度、高温、またはプラズマ条件下で、ＸｅＦｘ、ＷＦｘ、ＡｓＦｘ、ＰＦｘ、およびＴａＦｘ（ここで、ｘは、化学量論的に適切な値または値の範囲を有する）などの反応性ガスを使用することが記載される。特定の反応性洗浄剤のうち、ＢｒＦ
３が、インサイチュまたはエクスサイチュ洗浄構成で、イオン注入システムまたはその構成要素を洗浄するのに有用と記載される。また、フォアラインからイオン化関連堆積物の少なくとも一部を除去するために、イオン注入システムのフォアラインを洗浄する方法であって、前記フォアラインを洗浄ガスと接触させるステップを含み、前記洗浄ガスが前記堆積物との化学的反応性を有する方法が記載される。また、カソードをガス混合物と接触させるステップを含む、イオン注入システムの性能を改善し、寿命を延ばす方法が記載される。

99. 发明专利

JP2011046955A Polytetrafluoroethylene treatment 有权
标题翻译：聚四氟乙烯处理
公开(公告)号：JP2011046955A
公开(公告)日：2011-03-10
申请号：JP2010233441
申请日：2010-10-18
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： ALBERG MICHELE J
IPC分类号： C08J7/00 , C08F6/00 , C08G2/00
CPC分类号： C08J7/08 , C08J2327/18 , Y10T428/3154
摘要： PROBLEM TO BE SOLVED: To reduce a particle number in a polytetrafluoroethylene (PTFE) liner. SOLUTION: At least one PTFE film is heated to a temperature higher than 150°C for more than 20 hours, and then the film is cooled. The film may be heated to a temperature higher than 200°C and lower than 250°C, most preferably to a temperature about 228°C. The film is kept at a constant temperature for more than 50 hours, most preferably for about 100 hours. The PTFE film may be a heat processable PTFE fluoropolymer film and may have a number of heat affected zones. The heat affected zones may be formed before or after heat treating. The heat affected zones are generally obtained by integrally welding two or more PTFE films usually under pressurized conditions. The "optimum" temperature and the "optimum" time for thermally treating the polytetrafluoroethylene (PTFE) fluoropolymer, are determined. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：减少聚四氟乙烯（PTFE）衬里中的颗粒数。
解决方案：将至少一个PTFE膜加热至高于150℃的温度超过20小时，然后将膜冷却。该膜可以被加热到高于200℃且低于250℃的温度，最优选加热到约228℃的温度。将膜保持在恒定温度下超过50小时，最优选保持约100小时。 PTFE膜可以是可热加工的PTFE氟聚合物膜，并且可以具有多个热影响区域。热影响区域可以在热处理之前或之后形成。热影响区通常通过一般地在加压条件下焊接两个或更多个PTFE膜来获得。确定聚四氟乙烯（PTFE）含氟聚合物热处理的“最佳”温度和“最佳”时间。版权所有（C）2011，JPO＆INPIT

100. 发明专利

JP2011016592A Fluid storage, dispensing systems, and processes 审中-公开
标题翻译：流体储存，分配系统和工艺
公开(公告)号：JP2011016592A
公开(公告)日：2011-01-27
申请号：JP2010229396
申请日：2010-10-12
申请人： Advanced Technology Materials Inc , アドバンスドテクノロジーマテリアルズ,インコーポレイテッド
发明人： KINGERY JOHN R , BRESTOVANSKY DENNIS , O'DOUGHERTY KEVIN T , TOM GLENN M , MIKKELSEN KIRK , SMITH MATTHEW , WARE DONALD D , NELSON GREG , HAAPALA ROBERT , OBERG RUSSELL , HOYT TIM , GEROLD JASON , NESDAHL KEVIN , JANCSEK JOHN
IPC分类号： B65D83/00 , B67D99/00 , B01J4/00
CPC分类号： B67D7/0288 , B67D7/0261 , B67D7/32 , B67D7/3227 , B67D7/3281 , B67D7/34 , B67D7/344 , F16K35/00 , F16K35/025 , F16L37/08 , Y10T29/49826 , Y10T29/53
摘要： PROBLEM TO BE SOLVED: To avoid a problem of fluid contamination by ensuring proper coupling without limitation in order to store and dispense a liquid.SOLUTION: Fluid storage, dispensing systems, and processes involving various devices, structures, and arrangements as well as techniques and methods for fluid storage and dispensing, include pre-connect verification coupling sections usefully employed in application to fluid storage and dispensing packages, empty detection systems usefully employed for fluid storage and dispensing packages incorporating liners that are pressure-compressed in a fluid dispensing operation, ergonomically-enhanced structures for facilitating removal of a dispense connector from a capped vessel, cap conservation assurance systems for preventing misuse of vessel caps, and keycoding systems for ensuring coupling of proper dispense assemblies and vessels. The fluid storage and dispensing systems attain a zero or near-zero head space character, and prevent or improve solubilization effects in liquid dispensing from the liners in the overpacked vessel.
摘要翻译：要解决的问题：为了避免液体污染的问题，通过确保适当的耦合而不限于储存和分配液体。解决方案：流体存储，分配系统和涉及各种装置，结构和布置以及技术和方法的过程用于流体储存和分配的方法包括有效地用于流体储存和分配包装中的预连接验证联接部分，有用地用于流体储存和分配包装衬套的空的检测系统，其包含在流体分配操作中被压缩的衬垫，符合人体工程学增强的结构，便于从加盖的容器中取出分配连接器，用于防止容器盖的误用的盖保护系统和用于确保适当的分配组件和容器的联接的键盘系统。流体储存和分配系统达到零或接近零的头部空间特征，并且防止或改善从外包装容器中的衬垫中液体分配中的增溶作用。

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