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1. 发明专利

JP2017084805A 照明装置有权
公开(公告)号：JP2017084805A
公开(公告)日：2017-05-18
申请号：JP2016242921
申请日：2016-12-15
申请人：株式会社東芝 , Toshiba Corp , 東芝ライテック株式会社 , Toshiba Lighting & Technology Corp
发明人： IOKA KUMIKO , INOUE MICHINOBU , KOMATSU IZURU , TATEYAMA KAZUKI , PAN SHANYING , MATSUSHITA HIROSHI , KITAGAWA KAZUHIRO , HISAYASU TAKESHI , SUWA TAKUMI , SHIBAHARA YUSUKE , SAKAI MAKOTO
IPC分类号： F21K9/232 , F21V17/00 , F21V19/00 , F21V23/00 , F21V29/503 , F21V29/80
摘要：【課題】複数の光源ユニットを環状に配置した場合の放熱性を高めることができる照明装置を提供すること。【解決手段】照明装置110は、口金10と、口金に接続され、配線孔と配線孔よりも下側にねじ山が設けられた固定面を有する支持体20と、支持体の固定面と接する第1面および反対側の第2面を有し、第2面から第1面に貫通する孔およびこれよりも下に設けられた孔を介して前記ねじ山にねじが取り付けられて、下側が固定面に取り付けられて、貫通孔を介して第2面から第1面に通される配線を固定面の配線孔を介して内部に引き込む構成の台座部と、第2面から第1面に向かう方向にねじ孔が設けられ台座部の貫通孔よりも上側の第1面に設けられた複数の突起と、ねじにて取り付けられる発光部と、発光部および取り付けねじ、貫通孔を覆うように台座部に取り付けるグローブと、を有し、口金を中心とした周上に複数の光源ユニット30と、を具備している。【選択図】図1

2. 发明专利

JP2014167896A Illumination device 有权
标题翻译：照明装置
公开(公告)号：JP2014167896A
公开(公告)日：2014-09-11
申请号：JP2013040149
申请日：2013-02-28
申请人： Toshiba Corp , 株式会社東芝 , Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： IOKA KUMIKO , INOUE MICHINOBU , KOMATSU IZURU , TATEYAMA KAZUKI , PAN SHANYING , MATSUSHITA HIROSHI , KITAGAWA KAZUHIRO , HISAYASU TAKESHI , SUWA TAKUMI , SHIBAHARA YUSUKE , SAKAI MAKOTO
IPC分类号： F21S2/00 , F21V29/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide an illumination device capable of heightening heat dissipation when a plurality of light source units are arranged in an annular manner.SOLUTION: An illumination device includes: a base; a support body; and a plurality of light source units. The support body is connected to the base. The plurality of light source units are mounted on the support body and arranged along the circumference with an axis of the base being the center. Each of the plurality of light source units includes: a pedestal part; a light emitting part; and a plurality of protrusions. The pedestal part has: a first surface being in contact with the support body; and a second surface on the opposite side of the first surface. The light emitting part is mounted on the second surface of the pedestal part. The plurality of protrusions are provided on the first surface of the pedestal part. Between the plurality of protrusions, an air passage is provided communicating with each of a first direction along the first surface, and a second direction along the first surface and non-parallel with the first direction.
摘要翻译：要解决的问题：提供当多个光源单元以环形方式布置时能够提高散热的照明装置。解决方案：照明装置包括：基座; 一个支撑体; 和多个光源单元。支撑体连接到基座。多个光源单元安装在支撑体上，沿圆周方向以基部的轴为中心。多个光源单元中的每一个包括：基座部; 发光部分; 和多个突起。基座部具有：与支撑体接触的第一表面; 以及在第一表面的相对侧上的第二表面。发光部安装在基座部的第二面上。多个凸起设置在基座部的第一表面上。在所述多个突起之间，设置有沿着所述第一表面的第一方向和沿所述第一表面的第二方向与所述第一方向不平行地连通的空气通道。

3. 发明专利

JP2013058460A Illuminating device and method for manufacturing the same 有权
标题翻译：照明装置及其制造方法
公开(公告)号：JP2013058460A
公开(公告)日：2013-03-28
申请号：JP2011197724
申请日：2011-09-09
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社 , Toshiba Corp , 株式会社東芝
发明人： SAKAI MAKOTO , SUWA TAKUMI , NAKADA SHINJI , SUZUKI DAIGO , KOMATSU IZURU , INOUE MICHINOBU , IOKA KUMIKO , TATEYAMA KAZUKI , OKADA YASUHIDE
IPC分类号： F21S2/00 , F21Y101/02
CPC分类号： F21V3/00 , F21K9/232 , F21K9/60 , F21V29/713 , F21V29/74 , F21Y2115/10 , Y10T29/49002
摘要： PROBLEM TO BE SOLVED: To provide an illuminating device that can improve heat radiation performance and a method for manufacturing the same.SOLUTION: The illuminating device includes a body part, a light source which is installed at one of end part of the body part and has a light-emitting element, a globe installed to cover the light source, and a heat conducting part of which the end face on the globe side is exposed from the globe and which thermally connects the globe and the heat radiating surface on the end part side of the body part. Then, the heat conducting part has a plate-shape unit in which a first plate-shape body and a second plate-shape body crossing the first plate-shape body are integrally formed.
摘要翻译：解决的问题：提供一种能够提高散热性能的照明装置及其制造方法。解决方案：照明装置包括主体部分，安装在主体部分的端部之一并具有发光元件的光源，安装成覆盖光源的灯罩和导热部分其球面上的端面从球体露出，并且将球体和体部的端部侧的散热面热连接。然后，导热部具有与第一板状体交叉的第一板状体和第二板状体一体形成的板状部。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013058459A Illuminating device 有权
标题翻译：照明设备
公开(公告)号：JP2013058459A
公开(公告)日：2013-03-28
申请号：JP2011197723
申请日：2011-09-09
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社 , Toshiba Corp , 株式会社東芝
发明人： SAKAI MAKOTO , SUWA TAKUMI , NAKADA SHINJI , INOUE MICHINOBU , KOMATSU IZURU , SUZUKI DAIGO , IOKA KUMIKO , TATEYAMA KAZUKI , OKADA YASUHIDE
IPC分类号： F21S2/00 , F21Y101/02
CPC分类号： F21V29/004 , F21K9/135 , F21K9/232 , F21K9/60 , F21V29/503 , F21V29/506 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide an illuminating device that can improve heat radiation performance.SOLUTION: The illuminating device includes a body part, a light source which is installed at one of end part of the body part and has a light-emitting element, a globe installed to cover the light source, and a heat conducting part which is thermally connected with at least any of the globe and a heat radiation surface on the side of the end part of the body part. Then, the end face on the globe side of the heat conducting part is exposed from the globe.
摘要翻译：要解决的问题：提供可以提高散热性能的照明装置。解决方案：照明装置包括主体部分，安装在主体部分的端部之一并具有发光元件的光源，安装成覆盖光源的灯罩和导热部分其与身体部分的端部的一侧上的至少任一个球体和热辐射表面热连接。然后，导热部分的球体侧的端面从球体露出。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2007066987A Thermoelement device and thermoelectric module 有权
标题翻译：热电偶器件和热电模块
公开(公告)号：JP2007066987A
公开(公告)日：2007-03-15
申请号：JP2005247915
申请日：2005-08-29
申请人： Toshiba Corp , 株式会社東芝
发明人： IWANADE NAOKAZU , KONDO NARUHITO , TSUNEOKA OSAMU , TATEYAMA KAZUKI , SOGO TAKAHIRO
IPC分类号： H01L35/32 , H02N11/00
CPC分类号： H01L35/32
摘要： PROBLEM TO BE SOLVED: To provide a thermoelement device with an improved thermoelectric conversion efficiency.
SOLUTION: The thermoelement device 100 is provided with a first electrode 1 constituted of an electrode member 11, an elastic member 12 having a conductivity which is formed on the electrode member, and a soaking member 13 having conductivity which is formed on the elastic member; a thermoelement 3, which is formed of a material having a thermoelectric effect and is so arranged on the first electrode as to be in contact with the soaking member; and a second electrode 2 arranged on the thermoelement.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有改进的热电转换效率的热电偶装置。解决方案：热电元件100设置有由电极构件11，具有导电性的弹性构件12形成在电极构件上的第一电极1和形成在电极构件上的导电性的均热构件13 弹性构件热电元件3，其由具有热电效应的材料形成，并且布置在第一电极上以与均热部件接触; 以及布置在热电偶上的第二电极2。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006332398A Thermoelectric direct converter 有权
标题翻译：热电直流转换器
公开(公告)号：JP2006332398A
公开(公告)日：2006-12-07
申请号：JP2005154926
申请日：2005-05-27
申请人： Toshiba Corp , 株式会社東芝
发明人： IWANADE NAOKAZU , KONDO NARUHITO , TSUNEOKA OSAMU , TATEYAMA KAZUKI , SOGO TAKAHIRO , HARA AKIHIRO
IPC分类号： H01L35/32 , H01L35/06 , H01L35/14 , H02N11/00
摘要： PROBLEM TO BE SOLVED: To provide a thermoelectric direct converter that decreases friction between each of high temperature side electrodes and each of thermoelectric direct conversion semiconductor pairs, even when a displacement takes place between each of the high temperature side electrodes and each of the thermoelectric direct conversion semiconductor pairs due to thermal deformation, so that damages or breakages can thereby be prevented.
SOLUTION: The thermoelectric direct converter 1 disclosed herein is provided with a plurality of paired thermoelectric direct conversion semiconductor 4; low temperature side electrodes 6 each joined with low temperature side ends of the thermoelectric direct conversion semiconductor pairs; a low temperature side insulation board 8 connected to the thermoelectric direct conversion semiconductor pairs via the low temperature side electrodes; the high temperature side electrodes 5 each located on the high temperature side ends of the thermoelectric direct conversion semiconductor pairs; a plurality of cover members 27 respectively covering the high temperature side electrodes 5; and a high temperature side insulation board 7 thermally connected to the high temperature side electrodes 5 via the high temperature side electrodes and the cover members, and slide members 28a, 28b are provided between each of the high temperature side electrodes and each of the thermoelectric direct conversion semiconductor pairs.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供降低高温侧电极和每个热电直接转换半导体对之间的摩擦的热电直接转换器，即使当在每个高温侧电极之间发生位移时，由于热变形，热电直接转换半导体对，从而可以防止损坏或破损。解决方案：本文公开的热电直接转换器1设置有多个成对的热电直接转换半导体4; 低温侧电极6各自与热电直接转换半导体对的低温侧端接合; 经由低温侧电极连接到热电直接转换半导体对的低温侧绝缘板8; 高温侧电极5各自位于热电直接转换半导体对的高温侧端部; 分别覆盖高温侧电极5的多个盖部件27; 以及通过高温侧电极和盖部件与高温侧电极5热连接的高温侧绝缘板7，在各高温侧电极和各热电直接电极之间设置滑动部件28a，28b 转换半导体对。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005033894A Waste heat power generation system 审中-公开
标题翻译：废热发电系统
公开(公告)号：JP2005033894A
公开(公告)日：2005-02-03
申请号：JP2003195022
申请日：2003-07-10
申请人： Toshiba Corp , 株式会社東芝
发明人： TSUNEOKA OSAMU , KONDO NARUHITO , SHUDO NAOKI , SAKURADA SHINYA , HARA AKIHIRO , TATEYAMA KAZUKI
IPC分类号： H02P9/04
CPC分类号： Y02E20/14
摘要： PROBLEM TO BE SOLVED: To provide a waste heat power generation system with an energy saving measure in which the waste heat such as radiation heat released from a hot product or a hot section is recovered, and the recovered waste heat is converted into an electric energy which is easy to be used, for reuse. SOLUTION: A waste heat power generation system 10 is provided with power generation equipment which is provided between a hot side system 13 which receives or collects waste heat A such as radiation heat released from a hot material, hot product, or hot section 11, and a low temperature side system 14 in which the heat which is received or collected is subjected to a waste heat process, and directly generates power from the heat that flows due to temperature difference between the hot side system 13 and the low temperature side system 14. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有节能措施的废热发电系统，其中回收从热产物或热段释放的放射线的废热，并将回收的废热转化为易于使用的电能，可再利用。废热发电系统10设置有发电设备，其设置在接收或收集诸如从热材料，热产品或热部分释放的辐射热之类的废热A的热侧系统13之间 11和低温侧系统14，其中收集或收集的热量经受废热处理，并且由于热侧系统13和低温侧之间的温度差而流动的热量直接发电系统14.版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004327798A Method of manufacturing semiconductor device 审中-公开
公开(公告)号：JP2004327798A
公开(公告)日：2004-11-18
申请号：JP2003121632
申请日：2003-04-25
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , TATEYAMA KAZUKI , WATANABE NAOTAKE , MORI IKUO
IPC分类号： H01L21/52
CPC分类号： H01L24/743 , H01L2224/743 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To firmly bond a solder sheet to the back face of a wafer, without changing the composition of the solder as a whole. SOLUTION: This method comprises a process of configuring a solder sheet 10, having a first solder layer 8 whose Sn concentration is smaller than 6 wt.% and a second layer 9 whose Sn concentration is 7 wt.% or larger; a process for carrying out thermo-compression bonding of the solder sheet 10, in a state with the second solder layer being bonded to the back face of a wafer 12; a process of forming a semiconductor element 12a and a solder piece 10a by dicing the wafer 12, to which the solder sheet 10 is thermocompression bonded and the solder sheet 10; and a process of die-bonding the diced semiconductor element 12a via the solder piece 10a to a lead frame. COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2013065442A Lighting device 审中-公开
标题翻译：照明设备
公开(公告)号：JP2013065442A
公开(公告)日：2013-04-11
申请号：JP2011203059
申请日：2011-09-16
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE MICHINOBU , TATEYAMA KAZUKI , MORIYA KIMIMOTO , KITANI TOMOYUKI
IPC分类号： F21S2/00 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/58 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide a lighting device that can be downsized while having excellent heat radiation prop.SOLUTION: The lighting device includes a board wherein a plurality of light-emitting elements are arranged, and a support part equipped with a base part having a first surface for mounting the board and a second surface opposite to the first surface and a translucent part arranged to cover a light-emitting surface side of the light-emitting elements. An outer shape of the cross part of the translucent part is a part of a circle in a direction orthogonal to an axial direction of the lighting device.

10. 发明专利

JP2012190991A Semiconductor light-emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2012190991A
公开(公告)日：2012-10-04
申请号：JP2011052969
申请日：2011-03-10
申请人： Toshiba Corp , 株式会社東芝
发明人： KOMATSU IZURU , SHIMOKAWA KAZUO , ITO HISASHI , TATEYAMA KAZUKI
IPC分类号： H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device capable of suppressing time deterioration at a high output power.SOLUTION: A semiconductor light-emitting device according to an embodiment comprises: a light-emitting element configured to radiate emission light having a peak wavelength shorter than 493 nm; and a package containing the light-emitting element and including a terminal electrically connected to an electrode of the light-emitting element. The terminal contains aluminum with purity equal to or greater than 99.89% in a portion which reflects the emission light.

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