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    • 1. 发明专利
    • Adhesive composition
    • 粘合剂组合物
    • JP2007039698A
    • 2007-02-15
    • JP2006277162
    • 2006-10-11
    • Toagosei Co Ltd東亞合成株式会社
    • MARUYAMA KOSHININUKAI HIROSHIMOCHIZUKI KATSUNOBU
    • C09J133/06C09J11/00C09J143/04C09J163/00
    • PROBLEM TO BE SOLVED: To provide an elastic adhesive composition having excellent adhesive strength, heat resistance and weather resistance.
      SOLUTION: The adhesive composition comprises a polymer as an essential ingredient, which polymer comprises an acrylic ester unit having 1-20C ester part and an alkoxysilyl group and has ≤-10°C glass transition temperature and ≥500 but ≤20,000 weight-average molecular weight. The polymer is continuously produced at 170-300°C polymerization temperature without containing a chain transfer agent. The adhesive composition may be added with a curing accelerator.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供具有优异的粘合强度,耐热性和耐候性的弹性粘合剂组合物。 粘合剂组合物包含聚合物作为必要成分,该聚合物包含具有1-20C酯部分和烷氧基甲硅烷基并且具有≤-10℃玻璃化转变温度和≥500但≤20,000重量的丙烯酸酯单元 平均分子量。 聚合物在不含链转移剂的情况下在170-300℃聚合温度下连续生产。 粘合剂组合物可以加入固化促进剂。 版权所有(C)2007,JPO&INPIT
    • 2. 发明专利
    • Sealing material composition containing polymer with epoxy group
    • 含聚合物与环氧聚合物的密封材料组合物
    • JP2005105041A
    • 2005-04-21
    • JP2003337324
    • 2003-09-29
    • Toagosei Co Ltd東亞合成株式会社
    • INUKAI HIROSHIMOCHIZUKI KATSUNOBUYONEDA KOTAROIIDA AKIHITOKAWAI MICHIHIRO
    • C09K3/10
    • PROBLEM TO BE SOLVED: To provide a sealing material composition which has the high weatherability and the excellent adhesion to a base material.
      SOLUTION: The sealing material composition contains 1-100 parts by mass of an epoxy group-containing (meth)acrylate copolymer having a glass transition temperature of 10 °C or lower and a number-average molecular weight of 500-3,000 and 100 parts by mass of a base polymer. Preferably, the (meth)acrylate copolymer contains as the constitutional monomer unit a (meth)acrylate unit having the numbers of such carbons of 1-20 as is contained in the residue derived from an alcohol forming an ester and a radical-polymerizable monomer unit with an epoxy group.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种具有高耐候性和对基材的优异粘附性的密封材料组合物。 解决方案:密封材料组合物含有玻璃化转变温度为10℃以下,数均分子量为500〜300的含有环氧基的(甲基)丙烯酸酯共聚物1-100质量份, 100质量份基础聚合物。 优选地,(甲基)丙烯酸酯共聚物作为构成单体单元,含有由形成酯的醇的残基和自由基聚合性单体单元中含有的碳原子数为1-20的(甲基)丙烯酸酯单元 与环氧基团。 版权所有(C)2005,JPO&NCIPI
    • 3. 发明专利
    • Sealing material composition
    • 密封材料组成
    • JP2005179560A
    • 2005-07-07
    • JP2003424444
    • 2003-12-22
    • Toagosei Co Ltd東亞合成株式会社
    • YONEDA KOTAROINUKAI HIROSHIIIDA AKIHITOMOCHIZUKI KATSUNOBU
    • C09K3/10C08F2/44C08F220/12C08F283/06
    • PROBLEM TO BE SOLVED: To provide a silyl-functional sealing material composition which gives a cured product extremely excellent in weather resistance, alkali resistance and stain resistance.
      SOLUTION: The sealing material composition comprises a vinyl polymer (A) having a glass transition temperature of -80 to 10°C, a number-average molecular weight of 500-3,000, 1-50 mass% of alkyl methacrylate units as constituent monomer units and 0.05-2 hydrolyzable silyl groups on the average per molecule, and an oxyalkylene polymer (B) bearing a hydrolyzable silyl group, where the ratio of the vinyl polymer (A) is 1-150 pts.mass based on 100 pts.mass of the oxyalkylene polymer (B).
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供赋予固化产物耐候性,耐碱性和耐污性极好的甲硅烷基官能的密封材料组合物。 解决方案:密封材料组合物包括玻璃化转变温度为-80至10℃,数均分子量为500-3,000的乙烯基聚合物(A),1-50质量%的甲基丙烯酸烷基酯单元为 构成单体单元和每个分子平均为0.05-2个水解甲硅烷基,以及含有水解性甲硅烷基的氧化烯聚合物(B),其中乙烯基聚合物(A)的比例为1-150pts.mass,基于100个 氧化烯聚合物(B)的质量。 版权所有(C)2005,JPO&NCIPI
    • 4. 发明专利
    • Sealant composition
    • 密封组合物
    • JP2005097455A
    • 2005-04-14
    • JP2003334635
    • 2003-09-26
    • Toagosei Co Ltd東亞合成株式会社
    • INUKAI HIROSHIYONEDA KOTAROMOCHIZUKI KATSUNOBUIIDA AKIHITO
    • C09K3/10C08L33/06C08L71/00
    • PROBLEM TO BE SOLVED: To provide a sealant composition having high weatherability and extensibility, expressing good contamination resistance and having optimum workability. SOLUTION: The sealant composition comprises (A) a (meth)acrylic ester copolymer obtained by continuous polymerization of a radical-polymerizable monomer at 150-350°C, having a weight-average molecular weight of 8,000-30,000 and a glass transition temperature of -70 to -10°C and having no hydrolyzable silyl group, (B) a polyoxyalkylene-based compound having a weight-average molecular weight of 1,000-100,000 and hydrolyzable silyl groups and (C) a plasticizer. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供具有高耐候性和延展性的密封剂组合物,表现出良好的耐污染性并具有最佳的可加工性。 解决方案:密封剂组合物包含(A)通过可自由基聚合的单体在150-350℃下连续聚合得到的(甲基)丙烯酸酯共聚物,其重均分子量为8,000-30,000,玻璃 转化温度为-70〜-10℃,不具有水解甲硅烷基,(B)重均分子量为1,000〜10000000的聚氧化烯系化合物和可水解甲硅烷基,(C)增塑剂。 版权所有(C)2005,JPO&NCIPI
    • 8. 发明专利
    • Adhesive composition for tiling method
    • 用于倾斜方法的胶粘组合物
    • JP2010185078A
    • 2010-08-26
    • JP2010085615
    • 2010-04-02
    • Toagosei Co Ltd東亞合成株式会社
    • MARUYAMA KOSHININUKAI HIROSHIMOCHIZUKI KATSUNOBU
    • C09J143/04C09J133/14C09J171/02
    • PROBLEM TO BE SOLVED: To provide an elastic adhesive composition for tiling method having superior adhesive strength, heat resistance and weather resistance.
      SOLUTION: The elastic adhesive composition comprises: a polymer (a) which is composed of 50 to 99.5 mass% of butyl acrylate unit and 0.5 to 50 mass% of alkoxysilyl group-containing (meth)acrylic ester unit, has a glass transition temperature of -20°C or less and has a weight-average molecular weight of 1,000 to 15,000 and is continuously produced at a polymerization temperature of 170 to 300°C under such conditions that a chain transfer agent is not contained and the amount used of organic solvent is less than 10 mass%; and an alkoxysilyl group-modified polyoxyalkylene (b). Therein, a curing accelerator is preferably added to the adhesive composition.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种具有优异的粘合强度,耐热性和耐候性的平铺方法的弹性粘合剂组合物。 解决方案:弹性粘合剂组合物包括:由50-99.5质量%的丙烯酸丁酯单元和0.5至50质量%的含烷氧基甲硅烷基的(甲基)丙烯酸酯单元组成的聚合物(a)具有玻璃 转化温度为-20℃以下,重均分子量为1000〜15000,在不含有链转移剂的条件下,在170〜300℃的聚合温度下连续制造,使用量 的有机溶剂小于10质量%; 和烷氧基甲硅烷基改性聚氧化烯(b)。 其中,优选在粘合剂组合物中加入固化促进剂。 版权所有(C)2010,JPO&INPIT
    • 9. 发明专利
    • Adhesive composition including epoxy resin
    • 包含环氧树脂的粘合剂组合物
    • JP2006096834A
    • 2006-04-13
    • JP2004283210
    • 2004-09-29
    • Toagosei Co Ltd東亞合成株式会社
    • INUKAI HIROSHI
    • C09J163/00C09J133/08
    • PROBLEM TO BE SOLVED: To provide an epoxy resin-based adhesive composition that has high adhesive strength, excellent heat resistance, weather resistance, good handleability and workability because of low viscosity.
      SOLUTION: This adhesive composition comprises a copolymer that includes an epoxy group-bearing monomer unit and an epoxy group-free (meth)acrylic ester unit with the weight-average molecular weight of 500 to 5,000 and an epoxy resin. The copolymer is preferably prepared by continuously polymerizing the starting monomers at a temperature of 150 to 350°C.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种由于粘度低而具有高粘合强度,优异的耐热性,耐候性,良好的操作性和可加工性的环氧树脂基粘合剂组合物。 该粘合剂组合物包含具有环氧基的单体单元和重均分子量为500〜5000的无环氧基(甲基)丙烯酸酯单元的共聚物和环氧树脂。 共聚物优选通过在150至350℃的温度下连续聚合起始单体来制备。 版权所有(C)2006,JPO&NCIPI