专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH11135387A FORMATION OF ELECTRODES OF CHIP PARTS 失效
公开(公告)号：JPH11135387A
公开(公告)日：1999-05-21
申请号：JP29385797
申请日：1997-10-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IKEDA KIMIHIKO , YAMAGUCHI YOSHIHIRO , GOTO SEIICHI , TAKESHITA HIROYUKI
IPC分类号： H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for forming electrode of chip parts, wherein external electrodes having shapes of high quality are efficiently formed by coating at the end of a chip part without damaging a chip part body. SOLUTION: A chip part is slidably held between chuck which is adjacent to a chucking plate 10 provided with a plurality of chuck in a comb-tooth shape. Next, a coating material is contacted with the edge of the above chip part by moving either the chucking plate 10 or a coating roller opposite to it to the chucking plate 10. While sliding the chip part, the above coating roller coats the edge of the chip part of form an electrode paste film.

2. 发明专利

JP2001093774A METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2001093774A
公开(公告)日：2001-04-06
申请号：JP27080899
申请日：1999-09-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OIKAWA SATORU , YAMAGUCHI YOSHIHIRO , IKEDA KIMIHIKO , ASADA IKUTAKA
IPC分类号： H01G4/12 , H01G4/252 , H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component superior in productivity which can easily keep an extremely small chip component and can form electrodes on both end faces of this chip. SOLUTION: This manufacturing method forms electrodes at both opposed end faces of chip parts 1 by inserting the chip parts 1 into the through holes 4 of a first pallet 3 where a plurality of through holes 4 are made and an adhesive sheet 7 is stuck to the bottom, and forming electrodes 2 at the other end faces of the chip parts 1 which are retained and projected, with one end face each of the chip parts 1 stuck to the first adhesive sheet 7, and transferring the chip parts 1 to a second pallet 15, where a plurality of through-holes 16 are formed and an adhesive sheet 19 is stuck to the bottom thus forming electrodes on one face each of the chip parts 1, and then separating the chip parts 1 from the second pallet 15.

3. 发明专利

JPH08119325A CARRIER BODY FOR CHIP PART 失效
公开(公告)号：JPH08119325A
公开(公告)日：1996-05-14
申请号：JP26357994
申请日：1994-10-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INOUE TORU , YAMADA KENJI , HARAZONO KOHEI , TSUMURA TAKESHI , IKEDA KIMIHIKO , IMANAKA SEIJI , YAMAMOTO MITSUNORI
IPC分类号： B65D73/02 , H05K13/02
摘要： PURPOSE: To provide a carrier body for a chip part which is inexpensive and has a high reliability, regarding a carrier body for a chip part which is used when chip parts are held and carried to respective manufacturing processes. CONSTITUTION: A carrier body for chip part is constituted by providing holding parts 2 being constituted of slits on a band-form base 1 with a specified interval. When a chip part 4 is inserted in the holding part 2, tongue pieces 2a pinch the side surfaces of the chip part 4, and the chip part 4 can be carried while being assuredly held.

4. 发明专利

JP2006196633A Electronic component transporting apparatus and its transporting method 审中-公开
标题翻译：电子元件运输设备及其运输方法
公开(公告)号：JP2006196633A
公开(公告)日：2006-07-27
申请号：JP2005005924
申请日：2005-01-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： IKEDA KIMIHIKO , YAMAGUCHI YOSHIHIRO , ITO AKISATO
IPC分类号： H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide an electronic component transporting apparatus and its transporting method which easily allows the appearance test of all surfaces of a work and enables the stable availability of ultra-micro electronic components. SOLUTION: The transporting apparatus along with its transporting method comprises a work feeder 14 for feeding a work 12, a primary turntable 16 for holding the work 12 with a first holding means, and a secondary turntable 18 for holding the work 12 with a second holding means. The first holding means is one for vacuum-chucking the work 12 to hold, the second holding means is one for magnetically attracting the work 12 to hold, and the magnetic attraction is made greater than the vacuum-chucking force to hold the work 12 held with the primary turntable 16 with the secondary turntable 18, thus transporting the work 12. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种易于允许工件的所有表面的外观测试的电子部件传送装置及其传送方法，并且能够实现超微电子部件的稳定可用性。传送装置及其传送方法包括用于馈送工件12的工作进给器14，用于用第一保持装置保持工件12的主转盘16和用于将工件12保持在其上的副转台18 第二保持手段。第一保持装置是用于真空吸附工件12以保持的第一保持装置，第二保持装置是用于磁力吸引工件12保持的装置，并且使磁吸引力大于被保持的工件12的真空吸附力主转盘16与次级转台18相连，从而运送工件12.版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2000138145A MANUFACTURE OF ELECTRONIC PARTS 失效
公开(公告)号：JP2000138145A
公开(公告)日：2000-05-16
申请号：JP31290798
申请日：1998-11-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IKEDA KIMIHIKO , YAMAGUCHI YOSHIHIRO , ASADA IKUTAKA , UCHIYAMA HIDEO
IPC分类号： H01G4/12 , H01G4/232 , H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To accurately form a plurality of external electrodes electrically connected to internal electrodes on the front and rear surfaces of a multiple electronic parts element. SOLUTION: A pair of side surfaces 10, 11 opposed to each other of a sintered body 1 are sandwiched by a holder 20. A cylindrical body 22, of which rotation is being stopped, is brought into contact with an upper ridge portion 5 on the front surface 4 of the sintered body 1. A roll-up electrode 14 is coated by rotating the cylindrical body 22 counter clockwise. Then the cylindrical body 22, of which is being stopped, is brought into contact with a lower ridge portion 6. A rolling electrode 15 is coated by rotating the cylindrical body 22 clockwise. Subsequently, an electrode 16 is coated by pressing the stationary cylindrical body 22 onto the front surface 4 so that the rolling electrodes 14, 15 coated in the first and second processes are connected with each other. Then, an external electrode 19 is coated on the rear surface 7 by repeating the first to third processes, dried and baked.

6. 发明专利

JPH1073626A INSPECTION SYSTEM 失效
公开(公告)号：JPH1073626A
公开(公告)日：1998-03-17
申请号：JP22810996
申请日：1996-08-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IKEDA KIMIHIKO , YAMAGUCHI YOSHIHIRO , ITO YUTAKA , KOBAYASHI TORU , ITO AKISATO
IPC分类号： G01N1/00 , G01N21/88 , G01N27/00 , G01R31/00 , G01R31/26 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To reduce the installation space by providing a table for transferring a specimen thrown into a throw-in port with openings for mounting electronic parts individually and providing characteristic detection electrodes corresponding to the openings and an image recognition means. SOLUTION: Predetermined quantity of electronic parts are fed from a hopper 1 to a part feeder thence fed in a row to a table 4. The table 4 is provided with 50 openings 5, for example, in the thin outer circumferential part thereof wherein the opening 5 is opened outward in order to receive a single electronic part 6. The electronic part 6 is set in the opening 5 from one position o the outer circumference and when the table 4 is turned, various electric characteristics are inspected at an electric characteristic inspecting section. Subsequently, images are picked up from above and below the electronic part 6 by means of cameras 23, 29 provided at an external view inspecting section in order to inspect the external view of the electronic part 6. Finally, the electronic part 6 is discharged from a discharging section 14 based on the inspection results.

7. 发明专利

JPH0837136A METHOD FOR FORMING ELECTRODE OF ELECTRONIC PART 失效
公开(公告)号：JPH0837136A
公开(公告)日：1996-02-06
申请号：JP17277994
申请日：1994-07-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KIMURA TAKESHI , IKEDA KIMIHIKO , WADA KENJI
IPC分类号： H01G4/30 , H01G13/00
摘要： PURPOSE:To obtain a defectless electrode by dipping the end section of an electronic part into raw material paste for electrodes, attaching the raw material paste for electrodes to this end section, lifting the electronic part up, bringing this end section into contact with the surface of a panel having protrusions and recessions surrounded by these protrusions, and preventing air from being swallowed up. CONSTITUTION:Raw material paste 2 for electrodes is applied on to the upper surface of a horizontal board 1, and is made to have a specified thickness by a squeeze plate. The end section of an electronic part 4 is dipped in the raw material paste 2 for electrodes until it touches the board 1, and the raw material paste 2 for electrodes is attached to the end section. And the end section of the electronic part 4 is lifted up from the raw material paste 2 for electrodes. On this occasion, swallowed in air 6 by the difference of the wettability of the electronic part 4 is produced in the raw material paste 2 for electrode attached to the end section. After the end section of the electronic part 4 is moved on to a panel 7 having latticelike protrusions and recessions surrounded by these protrusions, it is separated. The raw material paste 2 for electrodes attached to the end section of the electronic part 4 is solidified, and an external electrode 5 is obtained.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式