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1. 发明专利

JP2003011269A Manufacturing method of insulating material with copper leaf 审中-公开
标题翻译：绝缘材料与铜箔的制造方法
公开(公告)号：JP2003011269A
公开(公告)日：2003-01-15
申请号：JP2001195709
申请日：2001-06-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OGAWA NOBUYUKI , HORIUCHI TAKESHI , HIROZAWA KIYOSHI , TANABE TAKAHIRO
IPC分类号： B32B15/08 , B32B15/092 , C09D163/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To stably manufacture an insulating material with a copper leaf wherein a fault of insulating properties, deterioration of heat resistance and electrolytic corrosion resistance or the like does not occur. SOLUTION: The insulating material with the copper leaf is obtained by a manufacturing method wherein a varnish of an epoxy resin containing a phenolic hydroxyl containing cyclic phosphorus compound expressed by general formula 1 (R denotes an alkyl, a cycloalkyl, an aryl or an aralkyl) is applied on the roughened surface of the copper leaf having at least one roughened surface, and is dried. In the varnish, the average particle size of the phenolic hydroxyl containing the cyclic phosphorus compound expressed by the general formula 1 is 10 μm or below and the maximum particle size thereof is 40 μm or below.
摘要翻译：要解决的问题：为了稳定地制造具有铜箔的绝缘材料，其中不会发生绝缘性能的故障，耐热劣化和耐电腐蚀性等。解决方案：具有铜箔的绝缘材料是通过一种制备方法得到的，其中含有由通式1表示的含酚羟基的环状磷化合物的环氧树脂的清漆（R表示烷基，环烷基，芳基或芳烷基）施加在具有至少一个粗糙表面的铜箔的粗糙表面上，并干燥。在清漆中，由通式1表示的含有环状磷化合物的酚羟基的平均粒径为10μm以下，最大粒径为40μm以下。

2. 发明专利

JP2005015811A Composition containing modified polyamide epoxy resin, and adhesive and film using the same 有权
标题翻译：含有改性聚酰胺环氧树脂的组合物，使用其的粘合剂和膜
公开(公告)号：JP2005015811A
公开(公告)日：2005-01-20
申请号：JP2004229308
申请日：2004-08-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： HIRAYAMA TAKAO , ITO TOSHIHIKO , MUKOYAMA YOSHIYUKI , HIRAKURA HIROAKI , NISHIZAWA HIROSHI , NANAUMI KEN , HIROZAWA KIYOSHI
IPC分类号： C08G18/65 , C08G59/14 , C09J11/00 , C09J163/00 , C09J175/04
摘要： PROBLEM TO BE SOLVED: To obtain a composition giving sufficient adhesive strength in low temperature contact bonding at ≤20°C and excellent in chemical resistance, soldering heat resistance, processability, and the like, and to provide an adhesive and an adhesive film using the composition. SOLUTION: A modified polyamide epoxy resin is obtained by reacting (I) an acid terminal polyamide resin with (II) an epoxy resin at ≥1 molar ratio of epoxy groups/carboxyl groups, wherein the acid terminal polyamide resin is prepared by reacting (A) dicarboxylic acids with (B) an organic diisocyanate at >1 molar ratio of the carboxyl groups/the isocyanate groups, which dicarboxylic acids contain (a) a both terminal carboxylic acid compound having a polyalkylene glycol residue or a polycarbonate diol residue and (b) an aliphatic or aromatic polycarboxylic acid. The above composition comprises the modified polyamide epoxy resin, an epoxy resin and an epoxy resin-curing agent. The adhesive and the adhesive film are obtained by using the composition. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得在≤20℃的低温接触粘合剂中赋予足够的粘合强度并且具有优异的耐化学性，耐焊接性，加工性等的组合物，并提供粘合剂和粘合剂电影使用组合。解决方案：改性聚酰胺环氧树脂通过使酸性末端聚酰胺树脂与（II）环氧树脂以环氧基/羧基的摩尔比为1摩尔比反应而获得，其中酸性末端聚酰胺树脂由使（A）二羧酸与（B）有机二异氰酸酯以羧基/异氰酸酯基团摩尔比为1摩尔，该二羧酸含有（a）具有聚亚烷基二醇残基或聚碳酸酯二醇残基的两末端羧酸化合物和（b）脂族或芳族多元羧酸。上述组合物包含改性聚酰胺环氧树脂，环氧树脂和环氧树脂固化剂。通过使用该组合物获得粘合剂和粘合剂膜。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2011021205A Insulating resin composition for printed wiring board and application thereof 审中-公开
标题翻译：印刷线路板绝缘树脂组合物及其应用
公开(公告)号：JP2011021205A
公开(公告)日：2011-02-03
申请号：JP2010237879
申请日：2010-10-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUJITA HIROAKI , KUMAKURA YOSHITOSHI , HIROZAWA KIYOSHI , EDA TETSUO , KANEKO YOICHI
IPC分类号： C08L63/00 , C08G59/62 , C08J5/18 , C08K5/13 , C08L29/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a halogen-free insulating resin sheet excellent in copper foil peeling strength and chemical resistance. SOLUTION: An insulating resin composition is an epoxy resin composition containing a polyphenolic antioxidant. The epoxy resin composition is a resin composition including an epoxy resin, phenolic hardener, compound having a dihydrobenzoxazine ring, polyvinyl butyral resin and inorganic filler. A method of manufacturing a printed wiring board using the epoxy resin composition is described. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供优异的铜箔剥离强度和耐化学性的无卤绝缘树脂片。解决方案：绝缘树脂组合物是含有多酚抗氧化剂的环氧树脂组合物。环氧树脂组合物是包含环氧树脂，酚类固化剂，具有二氢苯并恶嗪环的化合物，聚乙烯醇缩丁醛树脂和无机填料的树脂组合物。对使用该环氧树脂组合物的印刷电路板的制造方法进行说明。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011252152A Insulating varnish using modified cyanate ester-based resin composition, and manufacturing method of resin film of the same 审中-公开
标题翻译：使用改性的基于氰化物的树脂组合物的绝缘变性及其树脂膜的制造方法
公开(公告)号：JP2011252152A
公开(公告)日：2011-12-15
申请号：JP2011148488
申请日：2011-07-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMISHIRO YASUSHI , SUEYOSHI TAKAYUKI , MORITA KOJI , HIROZAWA KIYOSHI
IPC分类号： C09D4/00 , B32B15/08 , C08J5/18 , C08K5/13 , C08K5/315 , C08L9/00 , C08L71/12 , C09D5/25 , C09D7/12 , C09D163/00 , C09D171/10 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating film which is good in heat resistance, moisture resistance, solvent resistance and chemical resistance, and is suitable for a build-up lamination system effective for thickness and weight reduction and densification of a printed wiring board; and to provide methods for manufacturing an insulating vanish and the insulating film, which uses a modified cyanate ester-based curing resin composition which can achieve a low dielectric constant and a dielectric loss tangent in a high-frequency band, and a low loss of a high-frequency circuit, and is good in moldability including crack resistance and circuit filling property.SOLUTION: The insulating vanish comprises a resin composition containing (A) a cyanate ester compound, (B) a phenolic compound, (C) a polyphenylene ether resin, (D) a filler and (E) an epoxy resin, as essential components.
摘要翻译：要解决的问题：提供耐热性，耐湿性，耐溶剂性和耐化学性良好的绝缘膜，并且适用于对印刷的厚度和重量的减轻和致密化有效的积层层压系统接线板; 并且提供了制造绝缘膜的方法和使用可以在高频带中实现低介电常数和介电损耗角正切的改性氰酸酯基固化树脂组合物的绝缘膜，以及低损耗高频电路，成型性好，具有抗裂性和电路充填性。绝缘消毒剂包括含有（A）氰酸酯化合物，（B）酚类化合物，（C）聚苯醚树脂，（D）填料和（E）环氧树脂）的树脂组合物，作为必不可少的组成部分。版权所有（C）2012，JPO＆INPIT

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