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    • 5. 发明公开
    • EPITAXIALLY LAMINATED III-NITRIDE SUBSTRATE
    • EPITAKTISCH BESCHICHTETES GRUPPE-III-NITRID-SUBSTRAT
    • EP2498282A1
    • 2012-09-12
    • EP10828104.9
    • 2010-11-04
    • DOWA Electronics Materials Co., Ltd.
    • IKUTA, TetsuyaSHIMIZU, JoSHIBATA, Tomohiko
    • H01L21/338H01L21/205H01L29/201H01L29/778H01L29/812
    • H01L29/2003H01L21/02381H01L21/02458H01L21/02507H01L21/0254H01L29/155H01L29/205
    • A Group III nitride epitaxial laminate substrate is provided, which can improve crystallinity of a Group III nitride semiconductor without increasing substrate warpage. A Group III nitride epitaxial laminate substrate comprising: a substrate; a buffer formed on the substrate; and a main laminate formed by epitaxially growing a Group III nitride layer on the buffer, wherein the buffer includes an initial growth layer in contact with the substrate, a first superlattice laminate formed on the initial growth layer, and a second superlattice laminate formed on the first superlattice laminate, the first superlattice laminate includes five to 20 sets of first AlN layers made of an AlN material and second GaN layers made of a GaN material, the first AlN layers and the second GaN layers being alternately stacked, and each one set of the first AlN layer and the second GaN layer has a thickness of less than 44 nm, the second superlattice laminate includes a plurality of sets of first layers made of an AlN material or an AlGaN material and second layers made of an AlGaN material having a different band gap from the first layers, the first and second layers being alternately stacked.
    • 提供III族氮化物外延层叠基板,其可以在不增加基板翘曲的情况下提高III族氮化物半导体的结晶度。 一种III族氮化物外延层叠基板,包括:基板; 形成在衬底上的缓冲液; 以及通过在缓冲器上外延生长III族氮化物层而形成的主层压体,其中所述缓冲器包括与所述基底接触的初始生长层,形成在所述初始生长层上的第一超晶格层压体和形成在所述初始生长层上的第二超晶格层压体 第一超晶格层叠体,第一超晶格层叠体包括由AlN材料制成的5至20组第一AlN层和由GaN材料制成的第二GaN层,第一AlN层和第二GaN层交替堆叠,并且每组 第一AlN层和第二GaN层具有小于44nm的厚度,第二超晶格层叠包括多组由AlN材料或AlGaN材料制成的第一层和由具有不同的AlGaN材料的AlGaN材料制成的第二层 带隙从第一层,第一层和第二层交替堆叠。