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1. 发明公开

EP4450277A1 BATTERY INSULATION SHEET, MANUFACTURING METHOD THEREOF, AND BATTERY MODULE COMPRISING THE SAME 审中-公开
公开(公告)号：EP4450277A1
公开(公告)日：2024-10-23
申请号：EP24171237.1
申请日：2024-04-19
申请人： Samsung SDI Co., Ltd.
发明人： Park, Hye Jin , Woo, Myung Heui , Ryu, Bo Kyung , Yang, Seung Yong , Lee, Jae Hyun , Ra, Ha Na , Lee, Jung Hyo , Nam, Hyun , Nam, Jung Hyun , Yang, Yun Sung
IPC分类号： B32B19/04 , H01M10/658 , H01M50/249 , B32B5/16 , B32B5/18 , B32B5/30 , B32B15/04 , B32B27/06
CPC分类号： H01M10/658 , H01M2220/2020130101 , H01M50/249 , B32B19/045 , B32B19/048 , B32B5/18 , B32B15/046 , B32B27/065 , B32B5/16 , B32B5/30
摘要： Disclosed are a battery insulation sheet including an aerogel layer, wherein the aerogel layer includes a fibrillized polymer matrix and aerogel particles distributed in the fibrillized polymer matrix, and the fibrillized polymer matrix includes a dry binder, a method of manufacturing the same, and a battery module including the same.

3. 发明授权

EP3146009B1 POLYETHERS CONTAINING NON-BISPHENOLIC CYCLIC GROUPS 有权转让
公开(公告)号：EP3146009B1
公开(公告)日：2024-10-02
申请号：EP15796095.6
申请日：2015-04-24
IPC分类号： C09D171/00 , C09D171/12 , C08G59/22 , B32B15/04
CPC分类号： C09D171/00 , C08G59/04 , C08G59/066 , C08G59/245 , C08G59/26 , C08G2650/5620130101 , C09D163/00

8. 发明公开

EP4342614A1 BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC CIRCUIT SUBSTRATE USING SAME 审中-实审
公开(公告)号：EP4342614A1
公开(公告)日：2024-03-27
申请号：EP22804680.1
申请日：2022-05-17
申请人： Kabushiki Kaisha Toshiba , Toshiba Materials Co., Ltd.
发明人： KATO, Hiromasa , HOSHINO, Masanori , HIRABAYASHI, Hideaki , SUENAGA, Seiichi , MORIMOTO, Kazumitsu
IPC分类号： B23K1/00 , B23K1/008 , B23K1/19 , H01L23/13 , B32B15/04 , B32B15/20 , C04B37/02 , H05K3/38
摘要： A bonded object production method according to one embodiment of the present invention involves performing, by using continuous furnace, a process on a laminate that includes a metallic member, a ceramic member, and a brazing material layer disposed therebetween while conveying the laminate. The bonded object production method is characterized by comprising: a step for heating the laminate in an inert atmosphere from 200°C to a bonding temperature at an average temperature increase rate of at least 15°C/min; a step for bonding the laminate in an inert atmosphere at the bonding temperature within a range of 600-950°C; and a step for cooling the laminate from the bonding temperature down to 200°C at an average temperature decrease rate of at least 15°C/min. In addition, the ceramic substrate is preferably a silicon nitride substrate.

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