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    • 4. 发明公开
    • Thermally operated overload relay
    • Thermisch betriebenesÜberstromrelais
    • EP2091060A2
    • 2009-08-19
    • EP08017805.6
    • 2008-10-10
    • Fuji Electric FA Components & Systems Co., Ltd.
    • Tatsukawa, MasahiroNakano, MasaakiFuruhata, Yukinari
    • H01H61/01H01H61/02
    • H01H61/01H01H61/02H01H71/162H01H71/7427H01H2071/7454H01H2071/7481
    • Disclosed is a thermally operated overload relay installing a linked assembly in an outer casing (1), the assembly comprising a main bimetal (2) that bends receiving heat due to electric current flowing in a main circuit, a shifter (3) that displaces responsively to the bend of the main bimetal (2), a release lever (5) that links to the shifter and opposes a reversing spring (7) for driving a contact switching mechanism (6), and an adjusting dial that positions the release lever corresponding to setting of a trigger current value; output contacts of the contact switching mechanism being switched upon detecting the bend of the main bimetal (2) due to development of an overcurrent. The adjusting dial composed of a slider (14) and is directly coupled to the release lever (5) to form a monolithic structure, and the slider (14) is operated to position the release lever (5) corresponding to setting of the trigger current value and fastened by a fastening screw (15) .
    • 公开了一种热操作的过载继电器,其将连接的组件安装在外壳(1)中,所述组件包括:主双金属(2),其由于在主电路中流动的电流而弯曲地接收热量;移位器(3),其响应地移位 与主双金属片(2)的弯曲部分相连接,与释放杆(5)相连接,该释放杆(5)与变速器相连,并与用于驱动接触切换机构(6)的反向弹簧(7)相对应;以及调节转盘, 设定触发电流值; 由于过电流的发展,检测到主双金属片(2)的弯曲时,接触切换机构的输出触点被切换。 调节拨盘由滑块(14)构成并且直接联接到释放杆(5)以形成整体结构,并且滑块(14)被操作以根据触发电流的设定来定位释放杆(5) 并用紧固螺钉(15)固定。
    • 6. 发明授权
    • MICROELECTROMECHANICAL DEVICE HAVING SINGLE CRYSTALLINE COMPONENTS AND METALLIC COMPONENTS AND ASSOCIATED FABRICATION METHODS
    • 与单晶硅组件和金属部件及相关的制造方法微机电安排
    • EP1121694B1
    • 2006-04-26
    • EP00965594.5
    • 2000-08-07
    • Memscap S.A.
    • DHULER, Vijayakumar, R.
    • H01H1/00H01H61/02H01H61/04H01H59/00
    • H01H1/0036H01H59/0009H01H61/02H01H61/04H01H2001/0078H01H2061/006
    • A microelectromechanical (MEMS) device (10) is provided that includes a microelectronic substrate (40), a microactuator (20) disposed on the substrate (40) and formed of a single crystalline material, and at least one metallic structure (30) disposed on the substrate (40) adjacent the microactuator (20) such that the metallic structure (30) is on substantially the same plane as the microactuator (20) and is actuated thereby. For example, the MEMS device may be a microrelay (10). As such, the microrelay (10) may include a pair of metallic structures (32, 34) that are controllably brought into contact by selective actuation of the microactuator. While the MEMS device can include various microactuators, one embodiment of the microactuator is a thermally actuated microactuator which advantageously includes a pair of spaced apart supports (22) disposed on the substrate and at least one arched beam (24) extending therebetween. By heating the at least one arched beam (24) of the microactuator (20), the arched beams (24) will further arch. In an alternate embodiment, the microactuator is an electrostatic microactuator which includes a stationary stator and a movable shuttle. Imposing an electrical bias between the stator and the shuttle causes the shuttle to move with respect to the stator. Thus, on actuation, the microactuator moves between a first position in which the microactuator is spaced apart from the at least one metallic structure to a second position in which the microactuator operably engages the at least one metallic structure. Several advantageous methods of fabricating an MEMS device having both single crystal components and metallic components are also provided.