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    • 9. 发明公开
    • POLYMER-CERAMIC COMPOSITE HOUSINGS AND HOUSING COMPONENTS FOR PORTABLE ELECTRONIC DEVICES
    • EP3805300A1
    • 2021-04-14
    • EP20157480.3
    • 2020-02-14
    • SHPP Global Technologies B.V.
    • BAJAJ, Devendra NarayandasLEENDERS, Chiel AlbertusHOOGLAND, Gabriel Julianus MariaKALYANARAMAN, ViswanathanYOUNGSTROM, Cameron
    • C08K3/22C08K3/36B29B9/12G06F1/16G06F15/02H04M1/02B29B7/00B29B7/10B29B7/90
    • Housing parts for a portable electronic devices, and methods of molding such housing parts for portable electronic devices. Such housing parts comprise: a housing component comprising ceramic particles in a polymer matrix, the ceramic particles comprising from 50% to 90% by volume of the housing component, and the polymer matrix comprising from 10% to 50% by volume of the housing component; the ceramic particles have a Dv50 of from 50 nanometers to 100 micrometers; the ceramic particles are substantially free of agglomeration; the housing component has a relative density greater than 90%; and the housing component is configured to cover a portion of a portable electronic device. The present methods of molding such housing parts comprise: disposing polymer-ceramic core-shell particles in a working portion of a cavity in a mold, each of the core-shell particles comprising a ceramic core comprising a particle of a ceramic, and a polymer shell around the core, the shell comprising a polymer, where the ceramic cores comprise from 50% to 90% by volume of the powder, and the polymer shells comprising from 10% to 50% by volume of the powder; heating the mold to a first temperature that exceeds a melting temperature (Tm) of the first polymer; subjecting the powder in the mold to a first pressure while maintaining the temperature of the mold to or above the first temperature to define a housing component in which the ceramic particles are substantially free of agglomeration; cooling the housing component to a temperature below the Tg or Tm of the first polymer; and removing the housing component from the mold. In such housing parts and methods, the ceramic particles comprise Al 2 O 3 , Fe 3 O 4 , Fe 2 O 3 , ZnO, ZrO 2 , SiO 2 , and/or a combination of any two or more of these ceramics; and the polymer comprises PPE, PPS, PC copolymers, PEI, PEI copolymers, PPSU, PAES, PES, PAEK, PBT, PP, PE, semi-crystalline PI, or semi-crystalline polyamide.