专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3889208A1 METHOD OF MAKING A HIGH FILLED FIBER-MESH REINFORCED CERAMIC-THERMOPLASTIC POLYMER COMPOSITES WITH OUTSTANDING MECHANICAL PERFORMANCE 有权
公开(公告)号：EP3889208A1
公开(公告)日：2021-10-06
申请号：EP20168054.3
申请日：2020-04-03
申请人： SHPP Global Technologies B.V.
发明人： LEENDERS, Chiel Albertus , BAJAJ, Devendra , VERGHESE, Nikhil , VAN DER AA, Sam
IPC分类号： C08J5/10 , B32B5/30
摘要： Fiber-reinforced composite (e.g., for portable electronic devices), and methods of molding such fiber-reinforced composite parts. Such a fiber-reinforced composite part comprises one or more fiber layers and a plurality of ceramic particles within a polymer matrix such that ceramic particles and polymer are disposed above and below each of the fiber layer(s), with the ceramic particles comprising from 30% to 90% by volume of the composite part, the polymer matrix comprising from 6% to 50% by volume of the composite part, and the fiber layer(s) comprising from 1% to 40% by volume of the composite part; the ceramic particles having a Dv50 of from 50 nanometers to 100 micrometers; the ceramic particles being substantially free of agglomeration; and the composite part having a relative density greater than 90%. The present methods of molding such fiber-reinforced composite parts comprise: disposing one or more fiber layers in a working portion of a cavity in a mold such that the fiber layer(s) extends laterally across the composite part; and disposing ceramic particles and polymer above and below each of the fiber layer(s) in the working portion; heating the mold to a first temperature that exceeds a melting temperature (Tm) of the first polymer; subjecting the polymer, ceramic particles, and fiber layer(s) in the mold to a first pressure while maintaining the temperature of the mold to or above the first temperature to define a composite part in which the ceramic particles are substantially free of agglomeration; cooling the housing component to a temperature below the Tg or Tm of the first polymer; and removing the housing component from the mold. In some such methods, the core-shell particles comprise a ceramic core comprising a particle of a ceramic, and a polymer shell around the core, the shell comprising a polymer, where the ceramic cores comprise from 50% to 90% by volume of the powder, and the polymer shells comprise from 10% to 50% by volume of the powder. In such composite parts and methods, the ceramic particles comprise Al 2 O 3 , Fe 3 O 4 , Fe 2 O 3 , ZnO, ZrO 2 , SiO 2 , and/or a combination of any two or more of these ceramics; and the polymer comprises PPE, PPS, PC copolymers, PEI, PEI copolymers, PPSU, PAES, PES, PAEK, PBT, PP, PE, semi-crystalline PI, or semi-crystalline polyamide.

2. 发明公开

EP3805300A1 POLYMER-CERAMIC COMPOSITE HOUSINGS AND HOUSING COMPONENTS FOR PORTABLE ELECTRONIC DEVICES 有权
公开(公告)号：EP3805300A1
公开(公告)日：2021-04-14
申请号：EP20157480.3
申请日：2020-02-14
申请人： SHPP Global Technologies B.V.
发明人： BAJAJ, Devendra Narayandas , LEENDERS, Chiel Albertus , HOOGLAND, Gabriel Julianus Maria , KALYANARAMAN, Viswanathan , YOUNGSTROM, Cameron
IPC分类号： C08K3/22 , C08K3/36 , B29B9/12 , G06F1/16 , G06F15/02 , H04M1/02 , B29B7/00 , B29B7/10 , B29B7/90
摘要： Housing parts for a portable electronic devices, and methods of molding such housing parts for portable electronic devices. Such housing parts comprise: a housing component comprising ceramic particles in a polymer matrix, the ceramic particles comprising from 50% to 90% by volume of the housing component, and the polymer matrix comprising from 10% to 50% by volume of the housing component; the ceramic particles have a Dv50 of from 50 nanometers to 100 micrometers; the ceramic particles are substantially free of agglomeration; the housing component has a relative density greater than 90%; and the housing component is configured to cover a portion of a portable electronic device. The present methods of molding such housing parts comprise: disposing polymer-ceramic core-shell particles in a working portion of a cavity in a mold, each of the core-shell particles comprising a ceramic core comprising a particle of a ceramic, and a polymer shell around the core, the shell comprising a polymer, where the ceramic cores comprise from 50% to 90% by volume of the powder, and the polymer shells comprising from 10% to 50% by volume of the powder; heating the mold to a first temperature that exceeds a melting temperature (Tm) of the first polymer; subjecting the powder in the mold to a first pressure while maintaining the temperature of the mold to or above the first temperature to define a housing component in which the ceramic particles are substantially free of agglomeration; cooling the housing component to a temperature below the Tg or Tm of the first polymer; and removing the housing component from the mold. In such housing parts and methods, the ceramic particles comprise Al 2 O 3 , Fe 3 O 4 , Fe 2 O 3 , ZnO, ZrO 2 , SiO 2 , and/or a combination of any two or more of these ceramics; and the polymer comprises PPE, PPS, PC copolymers, PEI, PEI copolymers, PPSU, PAES, PES, PAEK, PBT, PP, PE, semi-crystalline PI, or semi-crystalline polyamide.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式