![SUBSTRATE HOLDER RECEPTION APPARATUS](/ep/2020/10/21/EP3725922A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: SUBSTRATE HOLDER RECEPTION APPARATUS
- 申请号:EP19170254.7 申请日:2019-04-18
- 公开(公告)号:EP3725922A1 公开(公告)日:2020-10-21
- 发明人: Weinhold, Ray , Lorenz, Olaf , Hahn, Roland , Sporer, Matthias
- 申请人: Atotech Deutschland GmbH
- 申请人地址: Erasmusstraße 20 10553 Berlin DE
- 专利权人: Atotech Deutschland GmbH
- 当前专利权人: ATOTECH DEUTSCHLAND GMBH & CO. KG
- 当前专利权人地址: ATOTECH DEUTSCHLAND GMBH & CO. KG
- 代理机构: Atotech Deutschland GmbH
- 主分类号: C25D17/04
- IPC分类号: C25D17/04 ; C25D17/06 ; H05K3/00 ; B65G49/02 ; C25D21/10
摘要:
This invention concerns a substrate holder reception apparatus (1) for holding a substrate holder (3) that is connected to a substrate (2) for treatment in an electrolyte tank (14), the substrate holder reception apparatus (1) comprising a first positioning device (11), that comprises a first connection device (71) for connecting the substrate holder (3) and a first guiding device (41) for guiding the substrate holder (3) and a drive unit (43) for moving the substrate holder (3) relative to the electrolyte tank (14), and a second positioning unit (12), that comprises a second connection device (72) for connecting the substrate holder (3) and a second guiding device (42) for guiding the substrate holder (3), wherein, in a state of connection with the first connection device (71) and the second connection device (72) with the substrate holder (3), the first guide device (41) and the second guiding device (42) are movable together with the substrate holder (3) by the drive unit (43), wherein the first guide device (41) and the second guide device (42) are movable independently from each other in a state of disconnection of the first connection device (71) and the second connection device (72) from the substrate holder (3) and the second guiding device (42) is connected to a spring mechanism (5) which, in the disconnected state, is configured to move the second guiding device (42) to the loading position. The invention further concerns an electrochemical treatment apparatus (1000). (Fig. 1)
IPC结构图谱:
C | 化学;冶金 |
--C25 | 电解或电泳工艺;其所用设备 |
----C25D | 覆层的电解或电泳生产工艺方法;电铸;工件的电解法接合;所用的装置 |
------C25D17/00 | 电解镀覆用电解槽的结构件、或其组合件 |
--------C25D17/02 | .镀槽;镀槽的安装 |
----------C25D17/04 | ..外部支架或结构 |