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1. 发明公开

EP3849742A1 METHODS FOR POLISHING SEMICONDUCTOR SUBSTRATES THAT ADJUST FOR PAD-TO-PAD VARIANCE 有权
公开(公告)号：EP3849742A1
公开(公告)日：2021-07-21
申请号：EP19762673.2
申请日：2019-08-23
申请人： GlobalWafers Co., Ltd.
发明人： YOSHIMURA, Ichiro , CHU, Alex , CHIU, H.J. , BHAGAVAT, Sumeet , KIM, TaeHyeong , KATAKURA, Norimasa , KITAZAWA, Masaru
IPC分类号： B24B9/06 , B24B49/04 , B24B37/005 , B24B37/20 , B24B49/03

2. 发明公开

EP3532243A1 VERFAHREN ZUR HERSTELLUNG VON LAGERKOMPONENTEN, SOWIE FERTIGUNGSANLAGE UND WÄLZ- ODER GLEITLAGER 有权
公开(公告)号：EP3532243A1
公开(公告)日：2019-09-04
申请号：EP17783385.2
申请日：2017-09-13
申请人： Schaeffler Technologies AG & Co. KG
发明人： SCHNABEL, Wolfgang , SCHREIBER, Martin , JUNG, Oliver
IPC分类号： B24B49/03 , B24B49/05 , B24B51/00 , B23Q7/14 , F16C33/00

3. 发明公开

EP2760633A1 WERKZEUGMASCHINE UND VERFAHREN ZUR VERMESSUNG EINES WERKSTÜCKS 有权
标题翻译：机床及方法用于测量工件
公开(公告)号：EP2760633A1
公开(公告)日：2014-08-06
申请号：EP12770446.8
申请日：2012-09-26
申请人： Fritz Studer AG
发明人： GAEGAUF, Fred
IPC分类号： B24B1/00 , B24B5/04 , B24B5/42 , B24B19/12 , B24B49/02 , B23Q17/20 , G01B21/12 , B23B25/06 , B24B49/03
CPC分类号： B24B49/045 , B23Q17/20 , B23Q17/2233 , B24B5/04 , B24B5/42 , B24B19/125 , B24B49/03 , B24B49/10 , G01B3/30 , G01B21/12
摘要： The invention relates to a machine tool, in particular a grinding machine, and to a method for measuring a workpiece, in particular a workpiece diameter, in a machine tool, in particular a grinding machine, which has a workpiece holder (14), a tool unit (28), a measuring device (48) and a control device (56) which is couplable to the measuring device (48) and the tool unit (28), wherein the measuring device (48) is held on the tool unit (28) and has at least two measuring sensors (66, 68), wherein in one measuring configuration the at least two measuring sensors (66, 68) are at a base distance (86) from one another which defines a measuring range (78), wherein the base distance (86) is selected to be greater than a known reference dimension (84) of a reference workpiece, wherein the control device (56) is designed to control the scanning of the workpiece such that first of all a first measuring sensor (66) of the at least two measuring sensors (66, 68) travels along the infeed axis (70) until a measurement can take place and subsequently the workpiece is probed on the opposite side by a second measuring sensor (68) of the at least two measuring sensors (66, 68), in that the tool unit travels in a corresponding manner along the infeed axis (70), wherein the control device (56) is designed to capture values detected at the at least two measuring sensors (66, 68), to capture an actual position of the tool unit (28) and to determine an actual distance (100) of the workpiece, in particular an actual diameter, on the basis of a travel length (98) of the tool unit (28) during the probing of a workpiece (96) which has been introduced into the measuring range (78), taking the reference dimension (84) and/or the base distance (86) into account.

4. 发明公开

EP2106880A3 Post-process sizing control device for grinding machine 有权
标题翻译：设备用于检查处理后的尺寸为研磨机
公开(公告)号：EP2106880A3
公开(公告)日：2013-05-22
申请号：EP09152052.8
申请日：2009-02-04
申请人： JTEKT CORPORATION
发明人： Inoue, Masaharu , Yamaguchi, Tomohisa
IPC分类号： B24B5/04 , B24B19/12 , B24B49/03
CPC分类号： B24B19/125 , B23Q17/20 , B24B5/04 , B24B49/03 , G05B19/401 , G05B2219/37576 , G05B2219/45218
摘要： A post-process sizing control device is provided with origin compensation means for controlling a size measuring device to measure (18) an actual size of a workpiece portion and for compensating the origin of a wheel head (19) by a position compensation amount which corresponds to a difference between the actual size and a theoretical size derived from calculation and size measuring interval setting means for setting the number of workpieces which should be ground during the next size measuring interval which begins after the preceding origin compensation operation and ends with the next origin compensation operation. The size measuring interval setting means sets the number of workpieces which should be ground during the next size measuring interval, based on an average position compensation amount derived by dividing a position compensation amount for the last workpiece ground during the present size measuring interval by the number of workpieces ground during the present size measuring interval.

5. 发明公开

EP1639630A4 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译： POLIERVORRICHTUNG UND POLIERVERFAHREN
公开(公告)号：EP1639630A4
公开(公告)日：2009-07-29
申请号：EP04747150
申请日：2004-07-01
申请人： EBARA CORP
发明人： SASAKI TATSUYA , YAMADA NAOSHI , KATSUMATA YOSHIFUMI , SHIMIZU NOBURU , TSUNO SEIRYO , MITSUYA TAKASHI
IPC分类号： H01L21/304 , B24B37/04 , B24B49/03 , H01L21/321
CPC分类号： B24B49/03 , B24B37/042 , H01L21/3212
摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
摘要翻译：研磨装置具有对基板进行研磨的研磨部（302）和测量形成在基板上的膜的厚度的测量部（307）。抛光设备还具有构造为输入形成在待抛光基板上的膜的期望厚度的界面（310）和构造成将抛光速率数据存储在其中至少一个过去基板上的存储装置（308a）。抛光装置包括运算单元（308b），该运算单元（308b）通过使用在最近抛光的衬底上对抛光速率数据进行加权的加权平均方法，基于抛光速率数据和期望厚度来计算抛光速率和最佳抛光时间。

6. 发明公开

EP1839811A4 MANUFACTURING FACILITY AND SUPER FINISHING APPARATUS FOR BALL BEARING 审中-公开
标题翻译：生产设施和用于精加工球轴承
公开(公告)号：EP1839811A4
公开(公告)日：2008-01-16
申请号：EP05809500
申请日：2005-11-22
申请人： NSK LTD
发明人： SENSUI NATSUKI , JOHNISHI SHUJI , IRIE YOSUKE
IPC分类号： B24B35/00 , B24B19/06 , B24B49/03 , F16C19/06
CPC分类号： B24B19/06 , B24B35/00 , B24B49/00 , F16C33/64 , Y10T29/51
摘要： A manufacturing facility and a super finishing apparatus for ball bearings. The detection part of a matching device (32) is connected to a control means (6) formed of a computer so that detection signals indicating the measured values of the diameters of the outer ring raceway tracks and the inner ring raceway tracks of the ball bearings can be transmitted to the control means. Also, a second grinding device (24) for outer ring, a superfinishing device (25a) for outer ring, a second grinding device (26) for inner ring, and a superfinishing device (28a) for inner ring are connected to the control means (6) so that these devices can receive control signals from the control means. Based on the measured values of the diameters of the outer ring raceway tracks and the inner ring raceway tracks measured by the detection part, the control means (6) provides a shift amount to a diameter machining target value set in the grinding device (24) (or 26) and the super finishing device (25a) (or 28a) for machining the raceway surfaces of the races of at least one of the outer and inner rings.

7. 发明授权

EP1260312B1 Improvement in positioning grinding wheels 有权
标题翻译：改进磨轮的定位
公开(公告)号：EP1260312B1
公开(公告)日：2004-06-23
申请号：EP02015167.6
申请日：2000-04-20
申请人： Unova U.K. Limited
发明人： Stocker, Mark Andrew
IPC分类号： B24B9/06 , B24B49/03 , B24B49/04 , B23Q15/04
CPC分类号： B24B1/00 , B23H1/04 , B23H9/00 , B24B9/065 , B24B47/22 , B24B49/04 , B24B53/065 , B25J9/1602 , H01L21/304

8. 发明授权

EP3849742B1 METHODS FOR POLISHING SEMICONDUCTOR SUBSTRATES THAT ADJUST FOR PAD-TO-PAD VARIANCE 有权
公开(公告)号：EP3849742B1
公开(公告)日：2022-10-05
申请号：EP19762673.2
申请日：2019-08-23
发明人： YOSHIMURA, Ichiro , CHU, Alex , CHIU, H.J. , BHAGAVAT, Sumeet , KIM, TaeHyeong , KATAKURA, Norimasa , KITAZAWA, Masaru
IPC分类号： B24B9/06 , B24B49/04 , B24B37/005 , B24B37/20 , B24B49/03

9. 发明授权

EP2106880B1 Post-process sizing control device for grinding machine 有权
标题翻译：设备用于检查处理后的尺寸为研磨机
公开(公告)号：EP2106880B1
公开(公告)日：2014-05-28
申请号：EP09152052.8
申请日：2009-02-04
申请人： JTEKT CORPORATION
发明人： Inoue, Masaharu , Yamaguchi, Tomohisa
IPC分类号： B24B5/04 , B24B19/12 , B24B49/03
CPC分类号： B24B19/125 , B23Q17/20 , B24B5/04 , B24B49/03 , G05B19/401 , G05B2219/37576 , G05B2219/45218

10. 发明授权

EP1981674B1 VERFAHREN ZUM BEARBEITEN VON KEGELRÄDERN IM TEILENDEN VERFAHREN MIT KOMPLETTER TEILUNGSFEHLERKOMPENSATION 有权转让
标题翻译：的锥轮的部分处理方法，具有完整的程序分流误差补偿完
公开(公告)号：EP1981674B1
公开(公告)日：2009-11-18
申请号：EP07712188.7
申请日：2007-02-08
申请人： Klingelnberg GmbH
发明人： RIBBECK, Karl Martin , KÖNIG, Torsten
IPC分类号： B23F9/10 , B23F23/10 , B23F23/12 , B24B49/03
CPC分类号： B24B53/085 , B23F17/003 , B23F23/10 , B23F23/1218 , B24B49/03 , Y02P70/175 , Y10T29/49476 , Y10T409/104134 , Y10T409/300896

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