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1. 发明公开

EP1545826A4 SOLDER HIERARCHY FOR LEAD FREE SOLDER JOINT 审中-公开
标题翻译： LÖTHIERARCHIE用于无铅焊料连接
公开(公告)号：EP1545826A4
公开(公告)日：2009-02-11
申请号：EP03755830
申请日：2003-09-12
申请人： IBM
发明人： INTERRANTE MARIO , FARCOOQ MUKTA G , SABLINSKI WILLIAM EDWARD
IPC分类号： B23K1/00 , B23K31/02 , B23K35/12 , B23K35/14 , B23K35/26 , B23K35/34 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34
CPC分类号： B23K1/0016 , B23K35/262 , B23K2201/36 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613
摘要： A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an intermetallic phase structure in the module side fillet during assembly. The intermetallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).

2. 发明授权

EP0363074B1 Circuit board manufacture 失效
标题翻译： PCB生产。
公开(公告)号：EP0363074B1
公开(公告)日：1994-01-19
申请号：EP89309858.2
申请日：1989-09-28
申请人： TELCO INTERNATIONAL LTD.,
发明人： Telco, Paul
IPC分类号： H05K3/42 , H05K3/40 , B23K35/02 , B23K35/26 , B23K35/12
CPC分类号： H05K13/04 , B23K35/0222 , H01R13/5202 , H05K3/3478 , H05K3/4038 , H05K3/4046 , H05K2201/09572 , H05K2203/0195 , H05K2203/0338 , H05K2203/0415 , H05K2203/0435 , H05K2203/308 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , Y10T29/53174

3. 发明公开

EP0163018A3 Method of welding titanium alloy parts with an insert member consisting essentially of 0 to 3% by weight of aluminium and the balance of titanium 失效
标题翻译：焊接钛合金零件的方法，其中通过铝的重量和钛的平衡，基本上由0至3％
公开(公告)号：EP0163018A3
公开(公告)日：1988-02-10
申请号：EP85102484
申请日：1982-04-23
申请人： NISSAN MOTOR CO., LTD. , Hitachi, Ltd.
发明人： Kakimi, Tsuneo , Nakanose, Megumi , Satoh, Hiroshi , Konishi, Takaharu , Kita, Hisanao , Nakazaki, Takamitsu
IPC分类号： B23K35/32 , B23K35/12 , C22F01/18
CPC分类号： C22F1/183 , B23K35/0255 , B23K35/325
摘要： A method of welding opposite end surfaces of two alphabeta type titanium alloy parts by a high energy-density welding process comprising closely interposing an insert member between said end surfaces of the two titanium alloy parts, the material of said insert member consisting of 0 to 3% by weight of aluminium and incidental impurities, the balance being titanium. The obtained weld joints are subjected to a post-welding heat treatment which is a combination of a solid solution heat treatment and a subsequent aging treatment.

4. 发明公开

EP3806147A1 INTERFACE LAYER WITH WIRE MESH AND SINTER PASTE AND ITS USE FOR JOINING ELECTRONIC COMPONENTS 审中-实审转让
公开(公告)号：EP3806147A1
公开(公告)日：2021-04-14
申请号：EP20200590.6
申请日：2020-10-07
申请人： Aptiv Technologies Limited
发明人： Brandenburg, Scott D.
IPC分类号： H01L23/488 , H01L21/60 , B23K35/12
摘要： An interface layer (20) includes an electrically conductive compressible mesh (22) having wires (22a) that are interwoven and pores (24) between the wires (22a). A dried sinter paste (26) is immobilized in the pores (24), the sinter paste (26) including electrically conductive particles (28). The wires (22a) may be copper wires. The electrically conductive particles (28) may have a composition of greater than 99% copper by weight. The mesh (22) may have a mesh size of 50-80. The wires (22a) may have a wire diameter of 0.05 millimeters to 0.5 millimeters. The mesh (22) may be a plain weave. The interface layer (20) may be fabricated by providing the mesh (22) on a carrier sheet (36); introducing the sinter paste (26) onto the mesh (22), e.g. using a screen printing process; and drying the sinter paste (26) to immobilize (interlock) the sinter paste (26) in the pores (24), for example, in a chamber at a temperature of 60 °C to 125 °C for approximately 10 minutes or more, wherein the steps above may be repeated over multiple iterations to completely fill the pores (24). A method of fabricating an electronic device (40) comprises: compressing the interface layer (20) between first and second components (32, 34) to reduce a thickness of the interface layer (20); and heating the interface layer (20) to consolidate the electrically conductive particles (28) into sintered bodies (42) in the pores (24). The heating may be conducted under an inert cover gas at a temperature of 225 °C to 300 °C. The heating may be pressureless heating or may be conducted under a pressure of 10 MPa to 40 MPa. The components (32, 34) may be uneven such that the interface surfaces of the components (32, 34) are non-parallel.

5. 发明公开

EP1545826A2 SOLDER HIERARCHY FOR LEAD FREE SOLDER JOINT 审中-公开
标题翻译： LÖTHIERARCHIE用于无铅焊料连接
公开(公告)号：EP1545826A2
公开(公告)日：2005-06-29
申请号：EP03755830.1
申请日：2003-09-12
申请人： International Business Machines Corporation
发明人： INTERRANTE, Mario , FARCOOQ, Mukta, G. , SABLINSKI, William, Edward
IPC分类号： B23K31/02 , B23K35/12 , B23K35/14 , B23K35/34
CPC分类号： B23K1/0016 , B23K35/262 , B23K2201/36 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613
摘要： A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an intermetallic phase structure in the module side fillet during assembly. The intermetallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).

6. 发明公开

EP0026216A4 Process for fusion welding a superalloy workpiece and method of hard-facing superalloys with a wire produced by rapid liquid quenching. 失效
标题翻译：一种用于工件和超合金用焊丝，其已经准备了从熔体淬火碳化物堆焊的方法superlegierten熔焊方法。
公开(公告)号：EP0026216A4
公开(公告)日：1981-08-27
申请号：EP80900804
申请日：1980-10-23
申请人： UNITED TECHNOLOGIES CORP
发明人： KING WILLIAM H , KEAR BERNARD H
IPC分类号： B22D11/00 , B23K35/02 , B23K35/12 , B23K35/40 , C22C45/00 , B23K35/22
CPC分类号： B23K35/0261 , B23K35/40 , C22C45/00
摘要： A wire of a normally nonforgeable composition, having improved resistance to fracture during working, handling and use is comprised of a portion with a rapidly quenched structure as a continuous stratum along its length. A preferred wire useful for fusion welding has a circular cross section with a micro-crystalline surface portion of at least 30 volume percent of the wire. Other preferred wires have elliptical or rectangular cross sections with amorphous strata continuous along their lengths.

7. 发明公开

EP2998962A4 HEAT RECEIVING TILE FORMED FROM CARBON FIBER COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG DAVON的WÄRMEAUFNEHMENDEFLIESE AUS KOHLENFASERVERBUNDSTOFF
公开(公告)号：EP2998962A4
公开(公告)日：2017-01-11
申请号：EP14797680
申请日：2014-05-14
申请人： KAWASAKI HEAVY IND LTD
发明人： YAMADA HIROKAZU , MORI YUUICHIROU , SATOU KOUJI , MATSUNAMI KIYOTAKA , MAEDA YASUTAKA , NAKAE TAMOTSU , KUBOTA MAKOTO , SAKURAI SHINJI , NAKAMURA SHIGETOSHI , OZAKI HIDETSUGU
IPC分类号： G21B1/11 , B23K1/00 , B23K1/19 , B23K35/02 , B23K35/12 , B23K35/24 , B23K35/30 , B23K35/32 , B23K103/12 , B23K103/14 , B23K103/16 , C21D1/18 , C22F1/08 , C22F1/18 , F28D20/00 , G21B1/13 , G21B1/17
CPC分类号： F28D20/0056 , B23K1/0008 , B23K1/19 , B23K35/0222 , B23K35/0238 , B23K35/0244 , B23K35/025 , B23K35/0255 , B23K35/24 , B23K35/30 , B23K35/302 , B23K2203/12 , B23K2203/14 , B23K2203/16 , C21D1/18 , C22F1/08 , C22F1/183 , G21B1/13 , Y02E30/128
摘要： This heat receiving tile is provided with a heat receiving block 11 formed of a carbon material and having a through hole; a cooling tube 16 formed of a copper alloy and fitted in the through hole of the heat receiving block; a cylindrical material of interlayer 14 disposed between the heat receiving block and the cooling tube; and brazing material layers 13, 15 inserted between the material of interlayer and the heat receiving block and between the material of interlayer and the cooling tube, and also a slit 21 which penetrates the heat receiving block and the material of interlayer over the thickness of the heat receiving block and reaches the cooling tube on the back side of the heat receiving surface. It can provide a heat receiving tile formed of a carbon fiber composite material for high heat flux component such as a first wall of a nuclear fusion reactor, which is produced by metallurgically joining a carbon material with a copper alloy and has a higher cooling efficiency than conventional heat receiving tiles.
摘要翻译：该受热瓦片设置有由碳材料形成并具有通孔的热接收块11; 由铜合金形成并装配在热接收块的通孔中的冷却管16; 设置在所述热接收块和所述冷却管之间的中间层14的圆柱形材料; 以及插入在中间层材料和热接收块之间以及中间层材料与冷却管之间的钎焊材料层13,15以及穿过该热接收块和中间层材料的狭缝21的厚度热接收块并到达受热面背面的冷却管。它可以提供一种由用于高热通量组分的碳纤维复合材料形成的热接收砖，其通过将碳材料与铜合金冶金接合而制造的核聚变反应器的第一壁，并且具有比传统的热接收砖。

8. 发明公开

EP1631450A4 NANOSTRUCTURED SOLDERED OR BRAZED JOINTS MADE WITH REACTIVE MULTILAYER FOILS 有权
标题翻译：纳米结构的铜焊或与活性多层薄膜生产的钎焊接头
公开(公告)号：EP1631450A4
公开(公告)日：2006-07-12
申请号：EP04816734
申请日：2004-05-13
申请人： UNIV JOHNS HOPKINS
发明人： BESNOIN ETIENNE , KNIO OMAR , WEIHS TIMOTHY P , WANG JIAPING
IPC分类号： B23K1/00 , B23K31/12 , B23K35/02 , B23K35/34 , C06B45/14 , B23K35/12
CPC分类号： B23K35/34 , B23K1/0006 , B23K1/0016 , B23K31/12 , B23K35/0238 , B23K2201/40 , B23K2203/05 , B23K2203/10 , C06B45/14
摘要： Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.

9. 发明公开

EP0363074A3 Circuit board manufacture 失效
标题翻译：电路板制造
公开(公告)号：EP0363074A3
公开(公告)日：1990-12-05
申请号：EP89309858.2
申请日：1989-09-28
申请人： TELCO INTERNATIONAL LTD.,
发明人： Telco, Paul
IPC分类号： H05K3/42 , H05K3/40 , B23K35/02 , B23K35/26 , B23K35/12
CPC分类号： H05K13/04 , B23K35/0222 , H01R13/5202 , H05K3/3478 , H05K3/4038 , H05K3/4046 , H05K2201/09572 , H05K2203/0195 , H05K2203/0338 , H05K2203/0415 , H05K2203/0435 , H05K2203/308 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , Y10T29/53174
摘要： Electrically conductive patterns on opposite sides of a printed circuit board (10) are connected by way of through holes (14) formed in the board. A plug (18) formed of fusible material such as solder and having an electrically conductive coating is located in the or each hole. The plug is upset to expand it so that the electrically conductive coating contacts the wall of the hole. Solder (20) is applied to opposite ends of the plug to bridge any gap between the conductive pattern and the conductive coating. The body of the plug may then be removed by a desoldering step, leaving an electrically conductive layer (22) covering the wall of the hole.

10. 发明公开

EP0064243A2 Method of welding titanium alloy parts with titanium insert 失效
标题翻译：对于使用钛中间片焊接由钛合金的对象的方法。
公开(公告)号：EP0064243A2
公开(公告)日：1982-11-10
申请号：EP82103462.6
申请日：1982-04-23
申请人： NISSAN MOTOR CO., LTD. , Hitachi, Ltd.
发明人： Kakimi, Tsuneo , Nakanose, Megumi , Satoh, Hiroshi , Konishi, Takaharu , Kita, Hisanao , Nakazaki, Takamitsu
IPC分类号： B23K35/32 , B23K35/12 , C22F1/18
CPC分类号： C22F1/183 , B23K35/0255 , B23K35/325
摘要： A method of welding opposite end surfaces of two titanium alloy parts (10, 12) kept in alignment by a high energy-density welding process such as electron beam welding, laser beam welding or TIG arc welding, characterized by closely interposing an insert member (14) of either practically pure titanium or Ti-Al binary alloy containing up to 3 Wt% of AI. Owing to thorough alloying of the inserted titanium (14) with the constituents of the fused base metal (10, 12), the weld metal (16) in a weld joint obtained by this method is sufficiently high in both strength and toughness. By an optional postwelding heat treatment, the strength of the weld metal (16) can further be enhanced.

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