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    • 4. 发明公开
    • MEMBRANE TREATMENT APPARATUS
    • EP4299193A1
    • 2024-01-03
    • EP22868416.3
    • 2022-11-18
    • Acon Biotech (Hangzhou) Co., Ltd.
    • CUI, Chao
    • B05C3/12B05C3/15B05C11/02B05C13/02G01N33/531
    • The present invention relates to an apparatus for processing a film by a squeezing force, including a stand, a soaking tank, as well as a feeding shaft, a roll shaft, a stepping motor and a scraping mechanism mounted to the stand, respectively, wherein the rotatable pressure roll shaft presses the film to the soaking tank; the scraping mechanism includes a first scraping shaft and a second scraping shaft which are connected to the stepping motor; an optocoupler switch is fixed to the stand; the stepping motor automatically finds the initial position via the optocoupler switch; and the stepping motor automatically adjusts the position and angle of the scraping mechanism according to a parameter. The apparatus in the present invention allows passage of the film between the first scraping shaft and the second scraping shaft, and the first scraping shaft and the second scraping shaft generate a squeezing or scraping force on the film abutting against the shafts to remove excess chemical reagent solution on the film, so that the chemical reagent solution is evenly distributed on the film. The present invention has the advantages of simple operation, high production efficiency, low cost, wide application range, etc. The prepared film can be used for manufacturing test paper, improving the performance of the test paper.
    • 6. 发明公开
    • Device for applying fluid
    • 涂抹液体的装置
    • EP0467118A3
    • 1992-03-18
    • EP91110558.3
    • 1991-06-26
    • International Business Machines Corporation
    • Bard, Steven L.Christensen, David N.Glenning, John J.Nicoletti, James A.Urdanick, Mark W.
    • B05C3/00B05C3/15C23F1/08
    • C23F1/08B08B3/04H05K3/068H05K13/0061
    • A device (10) for applying fluid (e.g., etchant) to a substrate (19) (e.g., thin metallic tape) wherein the device (19) includes a head member (11) having means (13) therein for directing a first fluid (15) (e.g, etchant) at an established first pressure against the substrate (19) and means (23) for directing a second fluid (25) (e.g., air) at an established second pressure equal to or greater than the first pressure (at the location of fluid intersection) and against the substrate (19) in the area proximate the first fluid so as to substantially contain and limit the first fluid (15) to impingement substantially only at the location against which the first fluid (15) is designed to strike. Preferably, two opposing head members (11, 11') are utilized, and these may serve to maintain the substrate (19) therebetween in a suspended state. Both head members (11, 11') are movable relative to each other during fluid application. As stated, the device is particularly suited to function as an etcher, but may also serve other purposes (e.g., coating, cleaning, rinsing, etc.).
    • 一种用于将流体(例如蚀刻剂)施加到基底(19)(例如,薄金属带)的装置(10),其中该装置(19)包括头部件(11),其中具有用于引导第一流体 在确定的第一压力下对衬底(19)施加第一压力(15)(例如蚀刻剂),以及用于以等于或大于第一压力的建立的第二压力引导第二流体(25)(例如空气)的装置(23) (在流体相交位置处)并抵靠在靠近第一流体的区域中的基底(19),以基本上容纳并限制第一流体(15)基本上仅在第一流体(15)抵靠的位置处撞击, 旨在罢工。 优选地,利用两个相对的头部构件(11,11'),并且这些头部构件可用于将衬底(19)保持在悬置状态。 在流体施加期间,两个头构件(11,11')都可相对于彼此移动。 如上所述,该装置特别适合用作蚀刻机,但也可以用于其他目的(例如,涂覆,清洁,冲洗等)。