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    • 6. 发明公开
    • Method of making a current sensor
    • 赫尔斯特伦·赫斯特伦
    • EP0315358A2
    • 1989-05-10
    • EP88310047.1
    • 1988-10-26
    • Honeywell Control Systems Ltd.
    • Alexander, MichaelRiddoch, Fiona Grant
    • G01R15/02
    • H01L43/08G01R3/00G01R15/205Y10T29/49133Y10T29/49142Y10T29/49179Y10T29/49199
    • A method of making a current sensor device is disclosed wherein a sensor, having a magnetoresistive element configured into a bridge (9), an insulating substrate (2) and a conductive member (5) are sub-assembled and then the sub-assembly is heated to bond the components together. The bridge (9) is attached to a first substrate having a first layer of insulation (16) with first vias (17) therein in which are deposited first elements (12a) of (e.g.) solder projecting beyond the first layer of insulation. Second elements (12b) of (e.g.) solder are deposited in second vias (17) in a second layer of insulation (19) on the second substrate (2). When the components are sub-assembled, the first elements (12a) rest on the second elements to provide a clearance between the first and second layers (16, 19) of insulation. Heat is applied to the sub-assembly in a controlled manner so that the (solder) elements (12) melt sufficiently to cause a degree of self-alignment between the bridge (9) and the conductive member and to cause the bridge (9) to be disposed at a predetermined distance above the conductive member (5).
    • 公开了一种制造电流传感器装置的方法,其中将具有构造成桥(9),绝缘衬底(2)和导电构件(5)的磁阻元件的传感器分组装,然后子组件 加热以将组分粘合在一起。 桥(9)连接到具有第一绝缘层(16)的第一衬底,第一绝缘层(16)中具有第一通孔(17),其中沉积有(例如)焊料的第一元件(12a)突出超过第一绝缘层。 (例如)焊料的第二元件(12b)沉积在第二基板(2)上的第二绝缘层(19)中的第二通孔(17)中。 当组件被分组装时,第一元件(12a)搁置在第二元件上以在绝缘体的第一和第二层(16,19)之间提供间隙。 以受控的方式将热量施加到子组件,使得(焊料)元件(12)充分熔化以在桥(9)和导电构件之间引起一定程度的自对准并且使桥(9) 被布置在导电构件(5)上方的预定距离处。