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    • 6. 发明公开
    • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • HERSTELLUNGSVERFAHRENFÜRHALBLEITERANORDNUNG
    • EP0780891A1
    • 1997-06-25
    • EP96922271.0
    • 1996-07-09
    • ROHM CO., LTD.
    • SAKAMOTO, Kazuhisa, Rohm Co., Ltd.
    • H01L21/322
    • H01L29/66295H01L21/263Y10S148/003Y10S148/004Y10S148/08Y10S148/09Y10S148/092
    • Disclosed is a method of manufacturing a semiconductor device wherein a corpuscular beam is radiated to a semiconductor substrate to create crystal defects therein, characterized in that said semiconductor substrate is subjected to a heat treatment, e.g. for 1 second to 60 minutes, wherein rapid heating-up, e.g. raising temperature to 550 to 850 °C within 10 minutes, is done in a process prior to that of carrying out of the radiation with a corpuscular beam. By doing so, there is provided a semiconductor device which is free from degradation in electrical characteristics such as current amplification factor and has an increased switching speed, even where crystal defects are created through the radiation of corpuscular beam such as an electron beam to shorten the carrier lifetime. Thus, the inventive semiconductor device is satisfied by both requirements of switching speed and electrical characteristic.
    • 公开了一种制造半导体器件的方法,其中将粒子束辐射到半导体衬底以在其中产生晶体缺陷,其特征在于,对所述半导体衬底进行热处理,例如, 1秒至60分钟,其中快速加热,例如, 在10分钟内将温度提高到550〜850℃,在用红细胞束进行辐射之前的过程中进行。 通过这样做,提供了一种半导体器件,其即使在通过诸如电子束的粒子束的辐射产生晶体缺陷的情况下,也不会有诸如电流放大系数的电特性的劣化并具有增加的切换速度,从而缩短 载体寿命。 因此,本发明的半导体器件通过开关速度和电气特性的要求得到满足。